一种混合集成电路共晶焊接用石墨夹具的设计

在某贯军标混合集成电路产品研制过程中,陶瓷基片共晶焊接的焊透率直接影响产品的噪声系数、增益等重要特性指标。文中设计了多组均匀分布、独立配重的倒扣式一体化石墨组件,可实现共晶焊接载体限位。倒置时多组重针悬空,不施压;正置时多组重针自动下垂,对基片等均匀配重施压,最终完成一致性共晶焊接。采用该设计方法研制的石墨夹具能有效解决基片等偏移和空洞率高的问题,保证了电路单元的接地性能,突破了该贯军标混合集成电路产品的批量研制技术瓶颈,提高了批量成品的质量一致性水平。焊透率检测及重要指标测试结果验证了该方法的可行性和有效性。

Design Method of a Graphite Fixture for Eutectic Sintering of Hybrid Integrated Circuit

In the process of developing a national military standard hybrid integrated circuit product, the eutectic sintering penetration rate of the ceramic substrate directly affects the important parameters such as the noise figure and gain of the product. In this paper multiple sets of evenly-integrated, independently weighted and invertedly-locked integrated graphite fixtures are designed, with which the eutectic sintered carrier limit can be realized. When inverted, the multiple sets of heavy needles hang in the air, not pressed; when placed normally, the multiple sets of heavy needles hang down automatically and the sheet is evenly weighted and pressed. The uniform eutectic sintering is finally completed. The graphite fixture developed by this design method can effectively solve the problem of high offset and void ratio of the substrate. As a result, the grounding performance of the circuit unit is ensured, the batch development technology bottleneck of the national military standard hybrid integrated circuit product is broken through and meanwhile the quality consistency level of batch products is improved. The test results of penetration rate and important indicators verify the feasibility and effectiveness of this design method.