接地板变形对微带阵列电性能影响的仿真分析

针对微带阵列天线在制造与使用过程中接地板存在变形的情况，仿真分析了碗状与正弦周期2种结构变形对天线电性能的影响。首先将结构规则的微带贴片天线等效为2条辐射缝隙，研究了其接地板变形对其端口特性与辐射性能的影响。然后通过改变贴片长度和馈电点位置调整了天线的谐振频率和阻抗匹配。在此基础上，建立了矩形排布的4×4贴片阵列，分析了接地板碗状变形与正弦周期变形对阵列辐射性能的影响。仿真数据与图表反映了接地板变形对阵列天线电性能的影响规律。

Simulation Analysis of Influence of Grounding Plate Deformation on Electrical Performance of Microstrip Arrays

In view of the grounding plate deformation during manufacture and service of the microstrip array antenna, the effects of bowl deformation and sine periodic deformation on the electrical performance of the antenna are simulated and analyzed. Firstly, the regular microstrip patch antenna is equivalent to two radiation slots and the effect of the grounding plate deformation on the port characteristics and radiation performance of the antenna is studied. Then the resonant frequency and impedance matching of the antenna are adjusted by changing the length of patch and the position of feed point. On this basis, a rectangular array of 4×4 patch arrays is established and the effects of bowl deformation and sine periodic deformation on radiation performance of the array are analyzed. Simulation data and charts reflect the effect law of grounding plate deformation on the electrical performance of array antenna.