| 计算机芯片的散热研究 |
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| 引用本文： | 刘焕玲,邵晓东,贾建援,王卫东. 计算机芯片的散热研究[J]. 电子机械工程, 2005, 21(3): 15-17,21 |
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| 作者姓名： | 刘焕玲 邵晓东 贾建援 王卫东 |
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| 作者单位： | 西安电子科技大学机电工程学院,陕西,西安,710071;西安电子科技大学机电工程学院,陕西,西安,710071;西安电子科技大学机电工程学院,陕西,西安,710071;西安电子科技大学机电工程学院,陕西,西安,710071 |
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| 摘 要： | 论文针对计算机芯片的散热问题进行了研究，提出了一种采用微通道结构的散热系统设计方案，用热分析软件对微通道结构进行了数值仿真，并且指导了实验装置的设计。
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| 关 键 词： | 微通道结构 雷诺数 有限元 |
| 文章编号： | 1008-5300(2005)03-0015-03 |
Research on the Heat Sink for Computer Chip |
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| LIU Huan-ling,SHAO Xiao-dong,JIA Jian-yuan and WANG Wei-dong. Research on the Heat Sink for Computer Chip[J]. Electro-Mechanical Engineering, 2005, 21(3): 15-17,21 |
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| Authors: | LIU Huan-ling SHAO Xiao-dong JIA Jian-yuan WANG Wei-dong |
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| Affiliation: | Institute of Electromachanical Engineering, Xian University of Electronic Science and Technology,Institute of Electromachanical Engineering, Xian University of Electronic Science and Technology,Institute of Electromachanical Engineering, Xian University of Electronic Science and Technology and Institute of Electromachanical Engineering, Xian University of Electronic Science and Technology |
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| Abstract: | The heat dissipation of computer chip is studied in this paper. A new concept using micro-channel structure is suggested and the performance of the micro-channel structure is analyzed using the FEA (finite element analysis) software. The design of experimental device is guided by it. |
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| Keywords: | micro-channel Re FEA |
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