| SiC单晶片加工技术的发展 |
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| 引用本文： | 肖强,李言,李淑娟.SiC单晶片加工技术的发展[J].新技术新工艺,2009(6):91-94. |
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| 作者姓名： | 肖强 李言 李淑娟 |
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| 作者单位： | 1. 西安理工大学,机械与精密仪器工程学院,陕西,西安,710048;西安工业大学,机电工程学院,陕西,西安,710032
2. 西安理工大学,机械与精密仪器工程学院,陕西,西安,710048 |
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| 摘 要： | SiC单晶的材质既硬且脆，加工难度很大。本文介绍了加工SiC单晶的主要方法，阐述了其加工原理、主要工艺参数对加工精度及效率的影响，提出了加工SiC单晶片今后主要研究的方向。
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| 关 键 词： | SiC单晶片 加工精度 加工效率 |
Development of Machining Technology on Slice of SiC Monocrystal |
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| XIAO Qiang,LI Yan,LI Shujuan.Development of Machining Technology on Slice of SiC Monocrystal[J].New Technology & New Process,2009(6):91-94. |
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| Authors: | XIAO Qiang LI Yan LI Shujuan |
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| Affiliation: | XIAO Qiang, LI Yan ,LI Shujuan (1. College of Mechanical and Precision Instrument Engineering, Xi＇an University of Technology, Xi＇an 710048,China; 2. College of Mechanical and Electronic Engineering,Xi＇an Technological University,Xi＇an 710032 ,China) |
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| Abstract: | As a kind of ceramics, SiC is very hard and crisp. It is difficult to machine SiC components accurately. In this paper the main methods of machining SiC are introduced, the machining principles and the influence of processing on machining precision and machining efficiency are also elaborated. The development trends and future prospects of machining SiC are put forward. |
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| Keywords: | Slice of SiC monocrystal Machining precision Machining efficiency |
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