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表面粗糙度对化学机械抛光工艺过程流动性能的影响
引用本文:魏红波,谭援强,高太元,李明军.表面粗糙度对化学机械抛光工艺过程流动性能的影响[J].润滑与密封,2009,34(8).
作者姓名:魏红波  谭援强  高太元  李明军
作者单位:1. 湘潭大学数学与计算科学学院,湖南湘潭,411105
2. 湘潭大学机械工程学院,湖南湘潭,411105
3. 中国科学院力学研究所,北京,100085
基金项目:国家自然科学基金项目,教育部新世纪人才项目 
摘    要:采用随机中点位移法通过计算机模拟抛光垫和晶片的基于分形的粗糙表面,构造了一种新的膜厚方程.在新膜厚方程的基础上分析了一般润滑方程及带离心项的润滑方程对化学机械抛光(CMP)过程中抛光液的压力分布以及无量纲载荷和转矩的影响.结果表明,考虑抛光垫和晶片表面的粗糙程度的影响时,抛光液的压力分布有一定的波动,且压力最大值有所增大,压力最小值有所减小;此外无量纲载荷和转矩的数值也变小.

关 键 词:化学机械抛光  润滑方程  粗糙表面  分形

Effection of Surface Roughness on Fluid Performance in the Chemical Mechanical Polishing Process
Wei Hongbo,Tan Yuanqiang,Gao Taiyuan,Li Mingjun.Effection of Surface Roughness on Fluid Performance in the Chemical Mechanical Polishing Process[J].Lubrication Engineering,2009,34(8).
Authors:Wei Hongbo  Tan Yuanqiang  Gao Taiyuan  Li Mingjun
Affiliation:1.School of Mathematics and Computational Science;Xiangtan University;Xiangtan Hunan 411105;China;2.School of Mechanical Engineering;3.Institute of Mechanics;Chinese Academy of Sciences;Beijing 100085;China
Abstract:The rough surface was simulated based on the fractal of pad and wafer by using random midpoint displacement method via computer,and a modified film thickness equation was presented.Based on the modified film thickness,the effect of surface roughness on pressure distribution,dimensionless load and torque in the course of the chemical mechanical polishing(CMP) was analyzed by the general lubrication equation and the modified lubrication equation with centrifugal force.The results show that when considering th...
Keywords:chemical mechanical polishing  lubrication equation  rough surfaces  fractal  
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