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电路板复合材料微小孔加工技术
引用本文:林有希,高诚辉,陈志华.电路板复合材料微小孔加工技术[J].工具技术,2006,40(6):28-32.
作者姓名:林有希  高诚辉  陈志华
作者单位:福州大学机械工程及自动化学院,福州大学,福州大学 350002福州市
摘    要:介绍树脂基复合材料印刷电路板的机械钻削和激光钻削微小孔加工技术,分析了影响钻削质量的因素以及加工过程中易出现的各种缺陷和改进措施。机械钻削微小孔时,轴向力和切削扭矩是导致各种加工缺陷的主要因素,低进给量、高主轴转速可明显提高钻削质量。激光钻削时,选择合适的激光功率及减少激光照射时间可提高钻削质量。

关 键 词:复合材料  印刷电路板  微小孔加工
收稿时间:2005-08
修稿时间:2005-08

Small Diameter Drilling Technology in Polymer Matrix Composite of PCB
Lin Youxi,Gao Chenghui,Chen Zhihua.Small Diameter Drilling Technology in Polymer Matrix Composite of PCB[J].Tool Engineering(The Magazine for Cutting & Measuring Engineering),2006,40(6):28-32.
Authors:Lin Youxi  Gao Chenghui  Chen Zhihua
Abstract:The methods of machine drilling and laser drilling of small diameter hole in printed circuit board made of polymer matrix composites are recommended. The factors to affect drilling quality and the process defects during drilling are analyzed. Thrust force and torque are the main factors to cause the defects in machine drilling. Drilling quality can be improved by setting low feed rate and high cutting speed. Choosing appropriate laser power and reducing laser irradiation time in laser drilling can also improve drilling quality.
Keywords:composite  printed circuit board(PCB)  small diameter drilling
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