金属微结构阵列的电铸成型技术研究

详细讨论了微结构的电铸特点，在分析微细电铸的电场与流场特性的基础上，深入研究了铸层厚度的不均匀现象及搅拌方式、电流密度对微细电铸质量的影响。得出：由于高深宽比胶膜存在，单一搅拌对电铸区域的影响只集中在微区的入口部分。扩散过程成为金属沉积的限制性因素；随着胶膜深宽比的增大，电场等势线弯曲的程度加大，导致电铸微区内金属离子传输能力不均匀。实验表明：微细电铸过程中，搅拌速度提高并不能改善金属沉积的传质条件，辅助超声的复合搅拌在相同条件下能提高金属沉积速度、减少铸层缺陷；最佳电流密度不宜超过0.9～1.0A/dm2。实现了高分辨率，侧壁陡直的金属微结构的电铸成型。

Experimental research on the micro electroforming of microstructure array

Discussed the characteristics of the micro electroforming process systematically and analyzed the property of the electric field and flow field. The asymmetry of the electroforming and the effect of the stirring mode, current density on the microstructure were studied in detail. From experiment it can be concluded that the effect of the pure stirring reach the entrance of the micro groove only, diffusion is the control factors of micro electroforming. The equipotential line curvature of electric field grew with the increasing aspect ratio of the deposit. Which result in the discrepancy of ion transferring capacity in the reaction area. The results showed that the stirring velocity could not improve transferring condition, while complex stirring (assistant with ultrasound) could help to the deposit velocity and get the perfect microstructure. The optimal current density was less than 0.9～1.0A/dm2 in the process. Based on the research high resolute electroforming microstructure with vertical wall was fabricated.