| 扩散硅压力传感器结构设计及封装工艺研究 |
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| 引用本文： | 刘沁,吕忠钢.扩散硅压力传感器结构设计及封装工艺研究[J].仪表技术与传感器,1996(10):18-19. |
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| 作者姓名： | 刘沁 吕忠钢 |
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| 作者单位： | 沈阳仪器仪表工艺研究所，沈阳仪器仪表工艺研究所，沈阳仪器仪表工艺研究所 沈阳市 110043，沈阳市 110043，沈阳市 110043 |
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| 摘 要： | 本文比较详细地探讨了现今应用很广的几种扩散硅压力传感器的结构及封装工艺,提出了全固态隔离膜片结构的基本封装形式,并对传感器结构设计和封装时必须注意的问题和基本参数进行了探讨。
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| 关 键 词： | 扩散硅 压力传感器 结构 封装 |
A Study of Structure Design and Packaging Techniques of Si Pressure Sensors |
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| Liu Qin,Lu Zhonggang and Chen Yanwen
Shenyang Institute of Instrumentation Technology,Shenyang ..A Study of Structure Design and Packaging Techniques of Si Pressure Sensors[J].Instrument Technique and Sensor,1996(10):18-19. |
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| Authors: | Liu Qin Lu Zhonggang and Chen Yanwen
Shenyang Institute of Instrumentation Technology Shenyang |
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| Affiliation: | Liu Qin,Lu Zhonggang and Chen Yanwen
Shenyang Institute of Instrumentation Technology,Shenyang 110043. |
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| Abstract: | An ail-solid isolation diaphragm structure of silicon pressure sensor packaging based on analysis of the structures and packaging techniques of pressure sensors widely used nowadays is proposed in this paper. Key issues and parameters of sensor structure design and packaging process arealso discussed. |
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| Keywords: | Silicon Pressure Sensor Structure Packaging |
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