The upper bound of tool edge radius for nanoscale ductile mode cutting of silicon wafer |
| |
| Authors: | S Arefin X P Li M Rahman K Liu |
| |
| Affiliation: | (1) Department of Mechanical Engineering, National University of Singapore, 10 Kent Ridge, Crescent, Singapore, 119260 |
| |
| Abstract: | For ductile mode cutting of brittle materials, such as silicon wafers, the undeformed chip thickness has to be smaller than
the tool edge radius. In practical application, for high production rate, the undeformed chip thickness is expected to be
as large as possible. Therefore, the tool edge radius is expected to be as large as possible. In this study, the upper bound
of the tool edge radius is investigated through cutting experiments. |
| |
| Keywords: | Cutting edge radius Ductile mode cutting Nanoscale Silicon wafer |
| 本文献已被 SpringerLink 等数据库收录！ |
|
