首页 | 本学科首页   官方微博 | 高级检索  
     

基于半导体制冷的巧克力3D打印成型条件研究
引用本文:周世浩,谭跃刚,张帆,陈飞,蒋世齐.基于半导体制冷的巧克力3D打印成型条件研究[J].机电工程,2017,34(4).
作者姓名:周世浩  谭跃刚  张帆  陈飞  蒋世齐
作者单位:1. 武汉理工大学机电工程学院,湖北武汉,430070;2. 武汉理工大学信息工程学院,湖北武汉,430070
基金项目:湖北省科技支撑计划项目,中央高校基本科研业务费资助项目
摘    要:针对自然环境温度较高时巧克力3D打印模型高度受限的问题,研究了满足巧克力3D打印的成型条件,在10℃~16℃之间为巧克力3D打印的最佳成型温度,以此为依据,利用fluent从热力学仿真角度,采用半导体制冷方法构建了3D打印成型环境,分析了影响成型条件的箱体空间、半导体制冷器功率多因素间的相互关系及外界温度对成型条件的影响,得出了巧克力3D打印机的设计依据。通过一定箱体空间及外界温度下是否安装半导体制冷器的巧克力3D打印对比实验,验证了设计的正确性。研究结果表明,半导体制冷能很好地改善巧克力3D打印成型环境,可以解决自然环境下巧克力3D打印的成型高度问题。

关 键 词:巧克力3D打印  成型条件  半导体制冷

Chocolate 3D print modeling conditions based on semiconductor refrigeration
ZHOU Shi-hao,TAN Yue-gang,ZHANG Fan,CHEN Fei,JIANG Shi-qi.Chocolate 3D print modeling conditions based on semiconductor refrigeration[J].Mechanical & Electrical Engineering Magazine,2017,34(4).
Authors:ZHOU Shi-hao  TAN Yue-gang  ZHANG Fan  CHEN Fei  JIANG Shi-qi
Abstract:Aiming at limited height of the Chocolate 3D printing when the temperature of natural environment is high,chocolate 3D printing modeling conditions was studied,the optimum modeling temperature of chocolate 3D printing is from 10 centigrade to 16 centigrade,and on this basis,from the view of thermodynamic simulation using fluent,3D printing modeling environment was constructed by adopting semiconductor refrigeration method,the relationship among multiple factors of the housing space and the power of semiconductor coolers that affect the modeling conditions,including the influence of ambient temperature on the modeling conditions were analyzed,and the design basis of chocolate 3D printer was reached.3D printing comparative experiments of whether installing semiconductor coolers through certain housing space and at ambient temperature were conducted,which verifies the validity of the design.The results indicate that semiconductor refrigerator can greatly improve the chocolate 3D printing modeling conditions,as well as solve the problem of Chocolate 3D printing modeling height under the condition of natural environment.
Keywords:chocolate 3D printing  modeling conditions  semiconductor refrigeration
本文献已被 CNKI 万方数据 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号