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化学镀镍工艺对金刚石/铜复合材料表面镀层性能的影响
引用本文:徐超, 贾成厂, 郭宏, 白智辉, 李明. 化学镀镍工艺对金刚石/铜复合材料表面镀层性能的影响[J]. 工程科学学报, 2013, 35(11): 1500-1506. DOI: 10.13374/j.issn1001-053x.2013.11.002
作者姓名:徐超  贾成厂  郭宏  白智辉  李明
作者单位:1. 北京科技大学材料科学与工程学院, 北京 100083;
基金项目:国家高技术研究发展计划(863计划)
摘    要:通过在金刚石/铜复合材料表面上化学镀镍的方法使表面金属化以改善其焊接性.研究了镀镍工艺对Ni-P合金镀层中磷含量的影响,以及不同磷含量对镀层的结合强度、耐蚀性和AgCu28钎料铺展性的影响,并对镀层的工艺与厚度进行了优化.AgCu28钎料在磷质量分数为5.8%~8.7%的镀层上均表现出较好的铺展性,且含磷8.7%的镀层比磷含量低的镀层的耐蚀性要好.综合考虑镀层与基体的结合强度和钎料在镀层上的铺展性,认为镀覆时间为10~20 min的镀层,即厚度为5~8μm时,镀层性能最理想.

关 键 词:金属基复合材料  化学镀  镀镍  镍磷合金  结合强度
收稿时间:2012-10-02

Effect of electroless nickel plating process on the properties of the plating layer on diamond/Cu composite materials
XU Chao, JIA Cheng-chang, GUO Hong, BAI Zhi-hui, LI Ming. Effect of electroless nickel plating process on the properties of the plating layer on diamond/Cu composite materials[J]. Chinese Journal of Engineering, 2013, 35(11): 1500-1506. DOI: 10.13374/j.issn1001-053x.2013.11.002
Authors:XU Chao  JIA Cheng-chang  GUO Hong  BAI Zhi-hui  LI Ming
Affiliation:1. School of Material Science and Technology, University of Science and Technology Beijing, Beijing 100083, China;2. General Research Institute for Nonferrous Metals, Beijing 100088, China
Abstract:Electroless nickel plating was used to improve the weldability of diamond/Cu composites. Experiments were performed to study the influence of nickel plating process on the phosphorous content of Ni-P alloy coatings as well as the effects of phosphorous content on the bond strength between the coatings and diamond/Cu substrates, the corrosion resistance of the coatings and the spreading area of AgCu28 filler on the coatings. Besides, the coating thickness and process were optimized. It is found that AgCu28 filler on the coatings with 5.8% to 8.7% phosphorus shows good spreadability, and the coating of 8.7% P has a better corrosion resistance than that with a lower P content. In comprehensive consideration with bond strength and filler spreadability on the coatings, the coating with 10 to 20 rain plating time, namely the thickness of 5 to 8 μm, is ideal. 
Keywords:metallic matrix composites  electroless plating  nickel plating  nickel-phosphorous alloys  bond strength
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