| 防溴型环氧树脂电路板热解动力学分析 |
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| 引用本文： | 王芳,刘玉卿,海热提. 防溴型环氧树脂电路板热解动力学分析[J]. 化工学报, 2011, 62(10): 2945-2950. DOI: 10.3969/j.issn.0438-1157.2011.10.038 |
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| 作者姓名： | 王芳 刘玉卿 海热提 |
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| 作者单位： | 北京化工大学化学工程学院,北京,100029 |
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| 基金项目： | “十一五”国家科技支撑计划项目(2008BAC46B05)~~ |
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| 摘 要： | 引言印刷电路板(printed circuit boards,PCBs)作为一种热固性复合材料,被广泛应用于电子元件与电动控制等多种工业领域[1-2]。印刷电路板主要由玻璃纤维、环氧树脂以及多种金属材料组成[3]其中环氧树脂被认为是最难降解回收的废旧塑料之一[4]。
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| 关 键 词： | 防溴型环氧树脂 电路板 热解动力学 热重 |
Pyrolysis kinetics of anti-Br printed circuit boards made epoxy resin |
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| WANG Fang,LIU Yuqing,HAI Reti. Pyrolysis kinetics of anti-Br printed circuit boards made epoxy resin[J]. Journal of Chemical Industry and Engineering(China), 2011, 62(10): 2945-2950. DOI: 10.3969/j.issn.0438-1157.2011.10.038 |
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| Authors: | WANG Fang LIU Yuqing HAI Reti |
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| Affiliation: | WANG Fang,LIU Yuqing,HAI Reti(College of Chemical Engineering,Beijing University of Chemical Technology,Beijing 100029,China) |
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| Abstract: | Use of anti Br printed circuit boards（PCBs） made epoxy resin is more and more popular and can generate large amount of solid wasteTheir thermo stability and characteristics of pyrolysis reaction including kinetics was investigated in atmosphere of argon using thermo gravimetric(TG)analysis at various hearting rates(5,10,20,30℃·min-1).The kinetic parameters of pyrolysis reaction including activation energy E were determined by Kissinger’s differentiation and Flynn Wall Ozawa’s integration methodsA study by Coats Redfern method indicated that the Valensi equation was a good approximation of the thermal decomposition reaction kinetics, the order of decomposition reaction was 2, the average activation energy E160.62 kJ·mol-1, and the thermal decomposition mechanism function α+(1-α)×ln(1-α). |
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| Keywords: | anti-Br type epoxy resin printed circuit boards pyrolysis kinetics thermo gravimetric analysis |
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