| 电沉积铜镍纳米多层膜的机理 |
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| 引用本文： | 薛江云, 吴继勋, 杨德钧. 电沉积铜镍纳米多层膜的机理[J]. 工程科学学报, 1996, 18(S2): 46-49. DOI: 10.13374/j.issn1001-053x.1996.s2.010 |
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| 作者姓名： | 薛江云 吴继勋 杨德钧 |
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| 摘 要： | 采用动电位扫描、循环伏安法以及交流阻抗等方法,研究了从柠檬酸盐体系中电沉积铜镍纳米多层膜的电沉积机理。研究结果表明:在研究体系中铜的沉积是扩散控制的电极过程,而镍的沉积则是首先形成类似Ni(OH)ads的吸附中间产物,而后在电极上进一步还原为原子态。
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| 关 键 词： | 交流阻抗 电沉积 铜镍合金 多层膜 |
| 收稿时间： | 1996-06-15 |
Mechanism of Electeodeposition of Cu/Ni Multilayer Thin Film |
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| Xue Jiangyun, Wu Jixun, Yang Dejun. Mechanism of Electeodeposition of Cu/Ni Multilayer Thin Film[J]. Chinese Journal of Engineering, 1996, 18(S2): 46-49. DOI: 10.13374/j.issn1001-053x.1996.s2.010 |
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| Authors: | Xue Jiangyun Wu Jixun Yang Dejun |
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| Abstract: | The mechanism of electrodeposition of Cu/Ni multilayer thin films from citrate salt electrolyte has been studied by means of potentodynamic sweep, cyclic voltammetry sweep and AC impendence.The results indicated that the copper deposition is mass transfer controlled process and nickel deposition is related to the absorbed intermediate species such as Ni(OH)ads. The nickel ions first form Ni(OH)ads,then was deoxygenated to nickel on the electrode surface. |
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| Keywords: | AC Impendence electrodeposition Cu/Ni alloy multilayer film |
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