| 电脉冲处理对热镀锌镀层生长动力学影响 |
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| 引用本文： | 薛庆国, 孙伟, 王静松, 曹立军, 孙昊延, 王精华. 电脉冲处理对热镀锌镀层生长动力学影响[J]. 工程科学学报, 2012, 34(7): 783-787. DOI: 10.13374/j.issn1001-053x.2012.07.010 |
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| 作者姓名： | 薛庆国 孙伟 王静松 曹立军 孙昊延 王精华 |
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| 作者单位： | 1. 北京科技大学钢铁冶金新技术国家重点实验室, 北京 100083; |
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| 摘 要： | 采用正交试验的方法,研究了电脉冲处理对热镀锌镀层生长动力学的影响.以合金层生长速率时间指数为评价指标对电脉冲处理效果进行了优化.正交试验结果表明,电脉冲处理参数中电容量是主要影响因素,处理时间影响不明显,在电容量200μF,电压700 V,频率2 Hz,处理时间30 s的条件下作用效果较好.在此参数条件下的热镀锌实验结果表明:合金层的生长受到抑制,厚度减薄,组织变得均匀致密;合金层生长速率时间指数由0.717下降到0.428,合金层的生长方式由界面反应和扩散联合控制转变为仅受扩散控制.
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| 关 键 词： | 钢板 表面处理 热镀锌 电脉冲 正交设计 生长动力学 生长速率 |
| 收稿时间： | 2011-05-27 |
Effect of electro-pulse modification on the growth kinetics of hot dip galvanizing |
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| XUE Qing-guo, SUN Wei, WANG Jing-song, CAO Li-jun, SUN Hao-yan, WANG Jing-hua. Effect of electro-pulse modification on the growth kinetics of hot dip galvanizing[J]. Chinese Journal of Engineering, 2012, 34(7): 783-787. DOI: 10.13374/j.issn1001-053x.2012.07.010 |
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| Authors: | XUE Qing-guo SUN Wei WANG Jing-song CAO Li-jun SUN Hao-yan WANG Jing-hua |
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| Affiliation: | 1. State Key Laboratory of Advanced Metallurgy, University of Sciences and Technology Beijing, Beijing 100083, China;2. Technology Center, Tianjin Iron & Steel Group Co. Ltd., Tianjin 300301, China |
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| Abstract: | The influence of electro-pulse modification on the growth kinetics of hot-dip galvanizing coatings was studied through an orthogonal test method. The time exponent of growth rate was taken as an evaluation index to optimize the treatment effect of electropulse modification. Orthogonal experiment results show that pulse capacitance has the most significant influence on the growth of the alloy layer, but the influence of treating time is little. The effect of electro-pulse modification would be better in the condition of the capacitance of 200 μF, the voltage of 700 V, the pulse frequency of 2 Hz, and the treating time of 30 s. Hot-dip galvanizing experimental results at these optimum parameters show that the growth of the alloy layer is inhibited, the coating thickness is decreased, and the structure is more dense and uniform. The time exponent of growth rate decreases from 0.717 to 0.428. The growth pattern of the alloy layer transforms from integrated control by interface reaction and diffusion to independent control by diffusion. |
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| Keywords: | plates surface treatment hot dip galvanizing electric pulse orthogonal design growth kinetics growth rate |
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