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采用Ag-Cu-In-Ti钎料真空钎焊SiO2f/SiO2复合陶瓷与铌
引用本文:陈波,吴世彪,熊华平,李文文. 采用Ag-Cu-In-Ti钎料真空钎焊SiO2f/SiO2复合陶瓷与铌[J]. 焊接学报, 2016, 37(4): 47-51
作者姓名:陈波  吴世彪  熊华平  李文文
作者单位:北京航空材料研究院焊接与塑性成形研究所, 北京 100095
基金项目:国家自然科学基金资助项目(5990522,50475160,51275497,5140105004)
摘    要:设计了Ag-(15~26)Cu-(13~20)In-(3.1~6.9)Ti活性钎料,分别在780℃/20 min,780℃/40 min和800℃/10 min三种参数下实现了SiO2f/SiO2复合材料与铌的连接,分析了接头微观组织,测试了接头室温抗剪强度.其中800℃/10 min钎焊参数下的接头平均抗剪强度最高,达到21.6 MPa;微观分析结果表明,接头中靠近SiO2f/SiO2母材界面处形成了厚度约为2μm的连续扩散反应层,靠近铌的界面钎料与母材也形成了良好的结合.该钎焊参数下接头界面物相依次为:SiO2f/SiO2→TiO+TiSi2→TiO+Cu3Ti→Ag(s, s)+Ag3In+Cu(s, s)→Nb.

关 键 词:SiO2f/SiO2复合材料     钎焊   界面反应层   抗剪强度
收稿时间:2015-01-12

Joining of SiO2f/SiO2 composite to Nb using Ag-Cu-In-Ti brazing filler
CHEN Bo,WU Shibiao,XIONG Huaping and LI Wenwen. Joining of SiO2f/SiO2 composite to Nb using Ag-Cu-In-Ti brazing filler[J]. Transactions of The China Welding Institution, 2016, 37(4): 47-51
Authors:CHEN Bo  WU Shibiao  XIONG Huaping  LI Wenwen
Affiliation:Welding and Plastic Forming Division, Beijing Institute of Aeronautical Materials, Beijing 100095, China
Abstract:A novel Ag-(15~26)Cu-(13~20)In-(3.1~6.9)Ti active filler alloy was designed for joining of SiO2f/SiO2 composite to Nb at 780℃ for 20 min, 780℃ for 40 min and 800℃ for 10 min, respectively. The joints brazed with the filler alloy at 800℃ for 10 min presented the maximum average shear strength of 21.6 MPa. During the brazing process, the active element Ti diffused significantly from the Ag-Cu-In-Ti alloy to the surface of the SiO2f/SiO2 composite and a thin reaction layer with a thickness of 2 μm was formed close to the composite. Sound interface was also obtained between the filler alloy and Nb. The interface structure of the joint brazed with Ag-(15~26)Cu-(13~20)In-(3.1~6.9)Ti alloy can be described as the following sequence:SiO2f/SiO2→TiO+TiSi2→TiO+Cu3Ti→Ag(s, s)+Ag3In+Cu(s,s)→Nb.
Keywords:SiO2f/SiO2 composite  Nb  brazing  reaction layer  shear strength
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