| 超声振动辅助磨削弧区的单颗磨粒切厚特征 |
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| 引用本文： | 张坤,殷振,戴晨伟,苗情,程祺辉. 超声振动辅助磨削弧区的单颗磨粒切厚特征[J]. 金刚石与磨料磨具工程, 2022, 42(1): 88-96. DOI: 10.13394/j.cnki.jgszz.2021.0109 |
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| 作者姓名： | 张坤 殷振 戴晨伟 苗情 程祺辉 |
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| 作者单位： | 苏州科技大学 机械工程学院，江苏 苏州 215009 |
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| 基金项目： | 国家自然科学基金;江苏省自然科学基金;江苏省高等学校自然科学研究面上项目;江苏省研究生科研与实践创新计划项目 |
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| 摘 要： | 为准确描述超声振动下的单颗磨粒切厚特征，实测多层金属结合剂金刚石砂轮表面的相邻2颗磨粒的周向间距以及磨粒出刃高度；依据超声振动辅助磨削的磨粒运动轨迹方程及相邻磨粒运动轨迹干涉理论，采用等分线法，利用MATLAB软件求解磨粒在完整接触弧区的单颗磨粒切厚值，并分析各主要参数对单颗磨粒切厚特征的影响。结果表明:相邻磨粒间距、相邻磨粒高度差对单颗磨粒切厚的影响均呈线性变化；单颗磨粒切厚随超声振幅的增大而线性增大，且随超声振动频率的增大而阶段性变化；超声振动辅助磨削的单颗磨粒切厚特征受砂轮转速、磨削深度的影响较大，受工件进给速度的影响相对较小。
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| 关 键 词： | 超声振动 磨削 单颗磨粒切厚 数值计算 |
| 收稿时间： | 2021-07-13 |
Undeformed chip thickness characteristics in grain-workpiece contact zone in ultrasonic vibration assisted grinding |
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| ZHANG Kun,YIN Zhen,DAI Chenwei,MIAO Qing,CHENG Qihui. Undeformed chip thickness characteristics in grain-workpiece contact zone in ultrasonic vibration assisted grinding[J]. Diamond & Abrasives Engineering, 2022, 42(1): 88-96. DOI: 10.13394/j.cnki.jgszz.2021.0109 |
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| Authors: | ZHANG Kun YIN Zhen DAI Chenwei MIAO Qing CHENG Qihui |
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| Affiliation: | School of Mechanical Engineering, Suzhou University of Science and Technology, Suzhou 215009, Jiangsu, China |
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| Abstract: | To accurately describe the undeformed chip thickness characteristics in ultrasonic vibration assisted grinding, the grain space and grain protrusion height of a metal bond multi-layer diamond wheel were measured. According to the particle trajectory equation of ultrasonic vibration assisted grinding and the trajectory interference theory of two nearby grains, the undeformed chip thickness in a complete grain-workpiece contact zone was solved by using the bisector method and MATLAB software. Then the influence of the main parameters on the undeformed chip thickness characteristics was analyzed. The results show that the undeformed chip thickness varies linearly against the distance between adjacent grains and the height difference of adjacent grains, increases linearly with the increase of ultrasonic amplitude and changes periodically with the increase of ultrasonic vibration frequency. In ultrasonic vibration assisted grinding, the undeformed chip thickness characteristics are greatly affected by the grinding wheel speed and grinding depth, and relatively less affected by the workpiece feed speed. |
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