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| 钛表面铜离子注入对细菌和细胞行为的影响 | |
| 引用本文： | 李昆强,乔玉琴,刘宣勇. 钛表面铜离子注入对细菌和细胞行为的影响[J]. 无机材料学报, 2020, 35(2): 158-164. DOI: 10.15541/jim20190105 |
| 作者姓名： | 李昆强 乔玉琴 刘宣勇 |
| 作者单位： | 1. 中国科学院 上海硅酸盐研究所, 高性能陶瓷和超微结构国家重点实验室, 上海 200050 2. 中国科学院大学 材料科学与光电子工程中心, 北京 100049 |
| 基金项目： | 国家重点研发计划(2016YFC1100604);国家自然科学基金重点项目(51831011);国家重点实验室主任青年基金(SKL201606)~~ |
| 摘 要： | 医用钛及其合金被广泛用作骨组织替换材料,但缺乏抗菌性,易导致细菌感染。铜具有良好的抗菌性能,将其引入到钛表面,可改善医用钛的抗菌性能;然而铜含量过高对细胞具有毒性。因此,需要调节铜的含量,实现铜的抗菌性能和细胞相容性之间的平衡。本研究采用等离子体浸没离子注入技术对医用钛进行表面改性,获得表面含铜量不同的样品,并研究改性钛表面对细菌和细胞行为的影响。结果表明,钛表面含铜量较低的样品能够促进大鼠骨髓间充质干细胞(rBMSCs)和人脐静脉内皮细胞(HUVECs)的增殖,但对大肠杆菌和金黄色葡萄球菌没有抑制能力;随着离子注入时间的延长,钛表面含铜量较高的样品抗菌能力显著提高,同时也未产生明显细胞毒性。因此,通过控制钛表面的铜含量,可以获得兼具良好抗菌性能和生物相容性的钛植入材料。 |
| 关 键 词： | 离子注入 生物相容性 铜 抗菌 |
| 收稿时间： | 2019-03-09 |
| 修稿时间： | 2019-04-03 |
Titanium Modified by Copper Ion Implantation: Anti-bacterial and Cellular Behaviors |
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| LI Kun-Qiang,QIAO Yu-Qin,LIU Xuan-Yong. Titanium Modified by Copper Ion Implantation: Anti-bacterial and Cellular Behaviors[J]. Journal of Inorganic Materials, 2020, 35(2): 158-164. DOI: 10.15541/jim20190105 | |
| Authors: | LI Kun-Qiang QIAO Yu-Qin LIU Xuan-Yong |
| Affiliation: | 1. The State Key Lab of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China 2. Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China |
| Abstract: | Titanium and its alloys have been wildly used as bone implants.However,it is still facing a severer issue:implant related infections due to the lack of antibacterial ability.Copper(Cu)has good antibacterial ability and can be used to improve the anti-infection capability of titanium.In this study,three kinds of Ti samples with different contents of Cu in the modified layer were prepared by plasma immersion ion implantation(PIII)technology,and their responses to bacteria and cells were explored in vitro.The results showed that the sample with low Cu content at the surface could promote the proliferation of rat bone marrow mesenchymal stem cells(rBMSCs)and human umbilical vein endothelial cells(HUVECs)but not inhibit the proliferation of Escherichia coli(E.coli)and Staphylococcus aureus(S.aureus).As the implantation time extends,antibacterial ability of the samples with high Cu content at the surface was significantly enhanced,and no obvious cytotoxicity was observed.Therefore,it is possible to acquire a balance between antibacterial ability and biocompatibility of Ti by controlling the contents of Cu in the modified layer. |
| Keywords: | ion implantation biocompatibility copper antibacterial |
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