| 预加热器在消除焊点渗锡不良缺陷中的应用 |
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| 引用本文： | 胡志勇. 预加热器在消除焊点渗锡不良缺陷中的应用[J]. 计算机工程, 2008, 34(Z1) |
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| 作者姓名： | 胡志勇 |
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| 作者单位： | 华东计算技术研究所,上海,200233 |
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| 摘 要： | 针对部分元器件在焊接时发生的引脚渗锡不良现象,介绍了通过预加热器来解决引脚渗锡.利用预加热器完满实现了器件引脚焊点处的良好渗锡,消除了通孔内焊料凹陷的缺陷.
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| 关 键 词： | 预加热器 通孔组装技术 焊接 电子组装 |
Application of Heater in Elimination Fluid Defect of Solder Point |
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| HU Zhi-yong. Application of Heater in Elimination Fluid Defect of Solder Point[J]. Computer Engineering, 2008, 34(Z1) |
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| Authors: | HU Zhi-yong |
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| Affiliation: | HU Zhi-yong (East-China Institute of Computer Technology,Shanghai 200233) |
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| Abstract: | At some time,electronic component may occur a defect of fluid solder point in soldering.This paper introduces a solution method using a heater.Using heater implements well soldering,eliminates the detect of assembly through hole. |
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| Keywords: | heater assembly technology through hole soldering electronic packaging |
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