| Sn-0.3Ag-0.7Cu-xSb无铅钎料润湿性 |
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| 引用本文： | 张亮,TuKN,孙磊,郭永环,何成文. Sn-0.3Ag-0.7Cu-xSb无铅钎料润湿性[J]. 焊接学报, 2015, 36(1): 59-62 |
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| 作者姓名： | 张亮 TuKN 孙磊 郭永环 何成文 |
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| 作者单位： | 1.江苏师范大学机电工程学院, 徐州 221116;Department of Materials Science and Engineering, University of California, Los Angeles, CA 90095 |
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| 基金项目： | 国家自然科学基金资助项目(51475220);江苏省自然科学基金资助项目(BK2012144);江苏省省属高校自然科学基金资助项目(12KJB460005) |
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| 摘 要： | 研究了微量Sb元素对Sn-0.3Ag-0.7Cu无铅钎料润湿性的影响,采用润湿平衡法探讨了Sn-0.3Ag-0.7Cu-xSb钎料在不同氛围和不同钎剂条件下的润湿性能.结果表明,微量的Sb元素可以显著提高Sn-0.3Ag-0.7Cu无铅钎料润湿性.在氮气氛围条件下,Sn-0.3Ag-0.7Cu-xSb钎料的润湿性得到显著改善,主要基于氮气氛围减小熔融钎料的氧化.辅助不同的钎剂,钎料的润湿性差异较大,选择合适的钎剂可以明显提高Sn-0.3Ag-0.7Cu-xSb钎料的润湿性.
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| 关 键 词： | 无铅钎料 润湿性 氛围 钎剂 |
| 收稿时间： | 2013-11-05 |
Wettability of Sn-0.3Ag-0.7Cu-xSb lead-free solders |
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| ZHANG Liang,TU K N,SUN Lei,GUO Yonghuan and HE Chengwen. Wettability of Sn-0.3Ag-0.7Cu-xSb lead-free solders[J]. Transactions of The China Welding Institution, 2015, 36(1): 59-62 |
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| Authors: | ZHANG Liang TU K N SUN Lei GUO Yonghuan HE Chengwen |
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| Affiliation: | 1.School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou 221116, China;Department of Materials Science and Engineering, University of California, Los Angeles 90095, USA2.Department of Materials Science and Engineering, University of California, Los Angeles 90095, USA3.School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou 221116, China |
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| Abstract: | Effect of Sb on the wettability of Sn-0.3Ag-0.7Cu lead-free solders was investigated, with different atmospheres and fluxes, the wetting balance tester was used to analyze the wettability of Sn-0.3Ag-0.7Cu-xSb solders. The results indicates that small amount of Sb can enhance the wettability of Sn-0.3Ag-0.7Cu solders. With the N2 atmosphere, the wettability of Sn-0.3Ag-0.7Cu-xSb can be increased obviously, which can be attributed to the resistance of oxidation (molten solder). Combing different fluxes, the wettability of lead-free solder can represent variation, the suitable flux can improve the wettability of Sn-0.3Ag-0.7Cu-xSb solders. |
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| Keywords: | lead-free solders wettability atmosphere flux |
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