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超高压熔渗法制备铜/金刚石复合材料的热导率*
引用本文:何金珊,张海龙,张洋,李建伟,王西涛. 超高压熔渗法制备铜/金刚石复合材料的热导率*[J]. 材料研究学报, 2014, 28(5): 321-324. DOI: 10.11901/1005.3093.2013.880
作者姓名:何金珊  张海龙  张洋  李建伟  王西涛
作者单位:北京科技大学新金属材料国家重点实验室 北京 100083
基金项目:国家自然科学基金51271017;中央高校基本科研业务费FRFTP-13-033A资助项目~~
摘    要:用超高压熔渗法制备了金刚石体积分数为90%的铜/金刚石复合材料, 其热导率为662 Wm-1K-1, 比用其它方法制备的这种材料的热导率高。SEM、EDS和XRD的表征结果表明, 这种铜/金刚石复合材料的界面结合良好, 金刚石与铜之间有过渡层, 部分金刚石相互连通。

关 键 词:复合材料  热导率  超高压熔渗法  铜/金刚石  
收稿时间:2013-11-20

Thermal Conductivity of Cu/Diamond Composites Produced by High Pressure Liquid Infiltration Method
Jinshan HE,Hailong ZHANG,Yang ZHANG,Jianwei LI,Xitao WANG. Thermal Conductivity of Cu/Diamond Composites Produced by High Pressure Liquid Infiltration Method[J]. Chinese Journal of Materials Research, 2014, 28(5): 321-324. DOI: 10.11901/1005.3093.2013.880
Authors:Jinshan HE  Hailong ZHANG  Yang ZHANG  Jianwei LI  Xitao WANG
Abstract:The Cu/diamond composites containing 90% (volume fraction) diamond particles were prepared at 1200°C under a pressure of 5 GPa by high pressure liquid infiltration method, giving a measured thermal conductivity of 662 Wm-1K-1. The characterization of composites by means of SEM, EDS and XRD shows that the interfacial bonding of Cu/diamond is strong, and a transition layer exists between diamond and Cu. Besides, some diamond particles are found to be inter-connected. The Cu/diamond composites fabricated by this method exhibited a thermal conductivity far superior to those produced by other means.
Keywords:composites  thermal conductivity  high pressure liquid infiltration  Cu/diamond  
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