首页 | 本学科首页   官方微博 | 高级检索  
     


Synthesis of novel copper nanoparticles/ternary polymer blend nanocomposites and their structural,thermal and rheological properties and AC impedance
Authors:Uzma Khalil  Sajjad Haider  Muhammad Saleem Khan  Adnan Haider  Rawaiz Khan  Abdulaziz A Alghyamah  Waheed A Almasry  Mohamed Bououdina
Affiliation:1. Jinnah College for Women, University of Peshawar, Pakistan;2. National Center of Excellence in Physical Chemistry, University of Peshawar, Pakistan;3. Department of Chemical Engineering, King Saud University, Riyadh, Saudi Arabia;4. Department of Nano, Medical and Polymer Materials, Yeungnam University, Gyeongsan, South Korea;5. Departments of Physics, University of Bahrain, Kingdom of Bahrain
Abstract:Copper nanoparticles (Cu NPs)/ternary polymer blend nanocomposites were synthesized via a solution‐casting technique. The nanocomposites were studied for their structural, thermal, rheological and electric properties. Scanning electron micrographs and atomic force micrographs showed no phase separation between the polymers, a narrow size distribution of Cu NPs (in the range 25–43 nm) and good dispersion of Cu NPs in the polymer matrix. Energy‐dispersive X‐ray analysis confirmed the presences of Cu in the matrix. X‐ray diffraction data showed a characteristic face‐centred cubic architecture for Cu unit cell and interaction of the Cu NPs with oxygen‐carrying polymers. Thermogravimetric analysis showed an increase in the degradation temperature (from 254 to 268 °C) and three‐step degradation of the nanocomposites. Rheological analysis showed an increase in the complex viscosities and storage modulus for the nanocomposites. AC impedance studies showed increased ionic conductivities and decreased bulk resistance for the nanocomposites. All these studies suggested interactions between Cu NPs and polymer matrix and the formation of a network structure. © 2017 Society of Chemical Industry
Keywords:ternary polymer blend  nanocomposites  Cu NPs  rheology  ionic conductivities
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号