| 新型焊头结构与运动机构的研究及开发 |
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| 引用本文： | 袁清珂,唐鹏,骆少明. 新型焊头结构与运动机构的研究及开发[J]. 四川大学学报(工程科学版), 2009, 41(5): 182-186 |
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| 作者姓名： | 袁清珂 唐鹏 骆少明 |
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| 作者单位： | 广东工业大学机电工程学院广东广州,510006 |
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| 基金项目： | 国家高技术研究发展计划 |
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| 摘 要： | 为实现LED芯片键合机对芯片的高速高精确地拾取、传送和粘贴等功能,本文综合运用曲柄摇杆机构和偏心轮机构开发了一种新型焊头结构与运动机构.首先,分析了焊头总成的工作过程和要求,研究了焊头机构的工作原理,设计了曲柄摇杆结构的运动参数,开发了端面偏心轮机构,讨论了焊头机构的运动时间序列.接着,应用pro/Engineer进行了零件和机构总成的结构设计,运用Mechanism/Pro建立了机构运动模型、驱动模型,实现了机构的运动仿真,分析了仿真结果,优化了焊头结构和机构参数.最后,通过实物样机的实际测试,验证了设计开发和仿真模型的正确性,所开发的焊头机构已成功应用于设备生产,提高了整机性能.
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| 关 键 词： | 半导体设备制造 产品开发 机构 运动学 焊头机构 |
| 收稿时间： | 2008-08-03 |
| 修稿时间： | 2008-11-12 |
The Research and Development of a New Kind of Head Structure and Motion Mechanism |
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| YUAN Qing-ke , TANG Peng , LUO Shao-ming , ZENG De-dong. The Research and Development of a New Kind of Head Structure and Motion Mechanism[J]. Journal of Sichuan University (Engineering Science Edition), 2009, 41(5): 182-186 |
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| Authors: | YUAN Qing-ke TANG Peng LUO Shao-ming ZENG De-dong |
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| Affiliation: | Guangdong University of Technology |
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| Abstract: | In this paper, a new kind of head structure and motion mechanism were developed by integrating synthetically a crank-rocker mechanism and a head face eccenter mechanism, that realize the operating functions of LED chip die bonders to drive chip of, such as picking up, carrying and bonding. Firstly, the working process and requirements of the head assembly were analyzed, the working theory of the head mecahniam was studied, the motion parameters of the crank-rocker mechanism were designed, a head face eccenter mechanism was developed, the motion time sequence of the excutive mechanisms was discussed. Secondly, the parts and assembly of the head structure and motion mechanism were designed by using pro/Engineer, the mechanim motion models and driving models were built, the motion simulation of the head mechanism was realized by using Mechanism/pro, the simulation results were analized, the head structure and mechanism parameters were optimized. Finally, the feasibility and rationality of the designed head mechanism and its simulation models were verified by testing the physical prototype, the developed head mechanism has been used in the whole equipment successfully, the performances of whole equipment have risen significantly. |
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| Keywords: | semiconductor device manufacture product development mechanism kinematics head mechanism |
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