| 钯含量对Ag-Cu-Pd钎料合金组织和性能的影响 |
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| 引用本文： | 郭菲菲,陈晓宇,史秀梅,齐岳峰,张国清,黄晓猛,祁宇. 钯含量对Ag-Cu-Pd钎料合金组织和性能的影响[J]. 有色金属科学与工程, 2017, 8(3): 64-68. DOI: 10.13264/j.cnki.ysjskx.2017.03.010 |
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| 作者姓名： | 郭菲菲 陈晓宇 史秀梅 齐岳峰 张国清 黄晓猛 祁宇 |
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| 作者单位： | 1.北京有色金属与稀土应用研究所，北京 100012 |
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| 基金项目： | 北京市人才培养资助项目（2013年） |
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| 摘 要： | 通过差热分析、扫描电镜显微组织分析、真空钎焊等手段，对不同Pd含量Ag-Cu-Pd钎料的熔化特性以及在无氧铜和镍上铺展性进行研究，并对铸态组织和钎焊界面组织进行分析.结果表明，随着Pd含量增加，Ag-Cu-Pd钎料的固相线温度、液相线温度有明显提高，固液相线温度间隔也随之增大；当Pd含量为10 %和20 %时钎料铺展性良好，且随着Pd含量增加，钎料合金铺展性降低，但当Pd增加到30 %时，钎料铺展性变差且有轻微侵蚀迹象；铸态Ag-Cu-Pd合金中Pd元素主要存在于富铜相中；Ag-28Cu-20Pd钎料焊接无氧铜板时的钎焊界面，形成连续的金属间化合物（IMC）层，钎料中Pd元素主要分布在IMC层上.
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| 关 键 词： | Ag-Cu-Pd合金 熔化特性 铺展性 钎焊界面 金属间化合物层 |
| 收稿时间： | 2017-03-23 |
Effect of Pd content on microstructure and properties of Ag-Cu-Pd solder |
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| Affiliation: | 1.Beijing Non-ferrous Metals and Rare Earth Research Institute, Beijing 100012, China2.Beijing Engineering Research Center of New Brazing Materials for Electronic Information, Beijing 100012, China |
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| Abstract: | The effects of Pd content on the melting properties, spreading properties on oxygen-free copper and nickel, as-cast organization of Ag-Cu-Pd solder, and brazing interface were studied. The results show that the solidus temperature and the liquidus temperature of Ag-Cu-Pd solder are obviously improved with the increase of Pd content. Accordingly, the temperature interval of solid-liquid phase line also increases. When Pd is 10 % and 20 %, the solder spreadability is optimal. In addition, the spreadability of solder alloy is reduced with the rising Pd content. When Pd is increased to 30 %, solder spreadability begins to deteriorate and there are signs of slight erosion. The Pd in Ag-Cu-Pd alloy is mainly present in the Cu-rich phase. The brazing interface forms a continuous intermetallic compound (IMC) layer when Ag-28Cu-20Pd solder is welded to the oxygen-free copper plate, with most of Pd distributing in IMC layer. |
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