脉冲激光退火纳米碳化硅薄膜的拉曼散射研究

采用XeCl准分子激光实现了碳化硅薄膜的脉冲激光晶化,对退火前后薄膜样品拉曼散射谱特征进行了分析,探讨了激光能量密度对纳米碳化硅薄膜结构和物相特性的影响.结果显示晶态纳米碳化硅薄膜的拉曼散射峰相对体材料的特征峰显著宽化和红移,并显示了伴随退火过程存在着硅和碳的物相分凝现象.随着激光能量密度的增大,薄膜的晶化度提高,晶化颗粒增大,而伴随的分凝程度逐渐减小.     

退火对CNx薄膜光学性质的影响

报道了退火对电子回旋共振(ECR)辅助脉)中激光溅射方法制备的CNx薄膜样品光学性质的影响，X射线衍射(XRD)结果显示CNx薄膜基本为无定形结构，但存在微量的多晶结构，拉曼散射谱显示所制备的CNx薄膜样品主要由C≡N、少量的C—C和微量的C≡N组成，随着退火温度的升高，拉曼散射谱不但在1357cm^-1附近出现了一个新峰(新峰对应无序的CN键)，而且C≡N和CN的相对含量比随着退火温度的提高大致呈先减小后增大再减小的趋势，从而证实在退火过程中部分N原子发生了迁移，椭偏仪所测量的CNx薄膜的光学常数表明退火温度对ε1、ε2、n、κ的大小和谱线的形状均产生了显著影响，结合拉曼散射谱可断定其原因为退火改变了CNx薄膜样品的内部结构和键结构，实验中得到的ε1、ε2、n、κ随光子能量的变化关系可用洛伦兹色散理论得到很好解释。     

非晶碳化硅薄膜和非晶锗-碳薄膜的拉曼散射研究

测量了用高频溅射法生长的非晶碳化硅薄膜的室温拉曼谱.观察到在400—600cm~(-1)、700-1000cm~(-1)、1200—1600cm~(-1)处的三个宽拉曼散射峰,分别对应于Si-Si、Si-C、C-C键.并发现在不同电阻率的样品中三个峰的相对强度有明显的差别.同时测量了高频溅射法生长的非晶锗-碳薄膜的室温拉曼谱.与非晶碳化硅薄膜不同,没有观察到对应于Ge-C 键的拉曼散射峰.     

衬底温度和氮气分压对氮化锌薄膜的性能影响

采用射频磁控溅射法在不同衬底温度和不同氮气分压下在石英玻璃衬底上制备氮化锌薄膜. 利用XRD和喇曼散射仪分析了样品的晶体结构和组成. 结果表明当氮气分压为1/2时可以生成多晶单一相的氮化锌薄膜. 利用霍尔效应和光学透过谱测量了样品的电学和光学性质. 结果表明衬底温度对样品的电学和光学性质有很大的影响. 衬底温度从100℃上升到300℃时,样品的电阻率从0.49降低到0.023Ω·cm. 电子浓度从2.7×1016升高到8.2×1019cm-3. 在衬底温度为200℃,氮气分压为1/2时,样品的光学带隙为1.23eV.     

衬底温度和氮气分压对氮化锌薄膜的性能影响

采用射频磁控溅射法在不同衬底温度和不同氮气分压下在石英玻璃衬底上制备氮化锌薄膜. 利用XRD和喇曼散射仪分析了样品的晶体结构和组成. 结果表明当氮气分压为1/2时可以生成多晶单一相的氮化锌薄膜. 利用霍尔效应和光学透过谱测量了样品的电学和光学性质. 结果表明衬底温度对样品的电学和光学性质有很大的影响. 衬底温度从100℃上升到300℃时,样品的电阻率从0.49降低到0.023Ω·cm. 电子浓度从2.7×1016升高到8.2×1019cm-3. 在衬底温度为200℃,氮气分压为1/2时,样品的光学带隙为1.23eV.     

用拉曼散射谱与远红外反射谱研究Ga_xIn_(1-x)As_ySb_(1-y)四元混晶的长波光学声子

报道了 MBE外延生长的 Gax In1 - x Asy Sb1 - y四元混晶的拉曼散射谱与远红外反射谱 ,并从拉曼散射谱中观察到了 Gax In1 - x Asy Sb1 - y四元混晶的晶格振动四模行为 ;从实验中还观察到低于 180 cm- 1的若干散射峰 ,提出它们可能是与次近邻原子间相互作用的晶格振动模式有关 ;从拉曼散射谱和红外反射谱中观察到了与 Gax In1 - xAsy Sb1 - y四元混晶多声子吸收过程的有关的现象     

Te元素掺杂Bi2Se3拓扑绝缘体纳米线的反弱局域效应

采用Au催化的固-液-气(VLS)方法制备了单晶Bi2Se3和Bi2(TexSe1-x)3 纳米线, 研究了单根纳米线器件的输运性质.在对单根Bi2(TexSe1-x)3(x=0.26)纳米线的低温磁输运测试中观察到反弱局域效应, 说明样品中存在较强的自旋-轨道耦合.结果表明, Te掺杂可以有效抑制体电导对输运过程的影响.通过对不同温度下的磁电导曲线进行拟合, 得到了电子的退相干长度lφ , lφ 从1.5 K时的389 nm减小至20 K时的39 nm, 遵循lφ∝T-0.96指数变化规律.分析表明, 在Te掺杂样品的输运过程中, 电子-电子散射和电子-声子散射均起到了十分重要的作用.     

退火对MOCVD法生长ZnO薄膜性能的影响

采用MOCVD方法在(001)Si衬底上生长ZnO薄膜,并在空气中800℃退火1 h.生长及退火样品的XRD图谱均显示了较强的(002)ZnO衍射峰,表明ZnO薄膜为c轴高取向生长.光电子能谱(XPS)分析显示,退火后ZnO薄膜从富Zn生长变为富O生长.在样品的室温PL 谱中,观察到未退火样品的紫外发射峰的中心为3.28 eV,并观察到退火样品位于3.30 eV的自由激子发射峰和位于3.23 eV的施主-受主对的复合发光峰.实验结果表明,退火后ZnO薄膜的晶体质量得到提高.     

Pb1-xMnxTe稀磁半导体外延薄膜的光学特性

采用分子束外延(MBE)方法在BaF2(111)衬底上生长了不同Mn组分的Pb1-xMnxTe(0≤x≤0.012)稀磁半导体薄膜.通过波长为3.0~11.0μm中红外透射谱的分析并应用透射光谱上干涉峰峰值的位置计算获得了Pb1-xMnxTe薄膜的折射率,由最小平方根拟合得到折射率的一阶Sellmeier色散关系.在吸收边附近,通过直接跃迁吸收系数与光子能量的关系外推得到其光学带隙.结果表明,在中红外区域其折射率随着Mn含量的增加而减小,其光学带隙则随着Mn含量的增加而增大,在温度T=295K时,随着Mn含量x由0变化到0.012,其光学带隙Eg由0.320eV增加到0.370eV.     

薄膜厚度对ZnO：Zr透明导电薄膜光电性能的影响

利用射频磁控溅射法在室温水冷玻璃衬底上制备出了可见光透过率高、电阻率低的ZnO:Zr透明导电薄膜.讨论了厚度对ZnO:Zr透明导电薄膜光学、电学性能的影响.当薄膜厚度为213 nm时,薄膜电阻率达到最小值1.81×10-3 Ω·cm.所制备的薄膜样品都具有高透光率,其可见光区平均透过率超过了93.0%.当薄膜厚度从125 nm增加到350 nm时,薄膜的光学带隙从3.58 eV减小到3.50 eV.     

VOLTE容灾机制研究及优化方案

_{本文首先对VOLTE现网网络结构及容灾机制进行研究分析,发现现存容灾机制中存在的缺点和不确定性,针对其中的问题,针对性地进行了深入研究和分析,创新的提出了1种快速容灾抢通方案,以达到提升VOLTE业务运维能力和用户业务感知的目的。}     

Calculation of energy band gaps in quaternary iii/v alloys

The dielectric theory of electronegativity is applied to the calculation of the compositional dependence of the energy band gap for quaternary III/V alloys of type A_l-xB_xC_1-yD_y and A_1-x-yB_xC_yD. The departure from linearity of E_G versus x and y is taken to be the sum of two terms, the intrinsic or virtual crystal term and the extrinsic term due to effects of aperiodicity which for one type of alloy may occur on both sublattices. Rather than simply treating the quaternary as an average of the bounding ternary systems, as has been common in the past, the intrinsic departure from linearity is calculated by assuming E_h,i,C, and D_av to vary linearly with x and y. The result is a smaller intrinsic deviation from linearity and a much better fit to existing data in the system Ga_1-xIn_xAs_1-y P_y. The calculation is also applied to three systems where no data exist but which are of great interest because of their potential application for the fabrication of lattice matched tandem solar cells: Ga_l-xA1_xAs_l-ySb_y. Ga_1-x-yA1_xIn_yAs, and GaAs_1-x-yP_xSb_y.     

Al2O3/GaSb p-MOSFET器件电学性质模拟

利用泊松方程和连续性方程对Al2O3/GaSb p-MOSFET进行二维数值分析,研究其在高场和载流子速度饱和下的电学特性以及漏极电流的开关电流比.与实验研究相对比,沟道长度为0.75 μm的GaSb p-MOS器件获得漏极电流最大为61.2mA/mm.改变沟道长度和GaSb衬底的掺杂浓度,由于高k介质栅电容效应和低阈值电压,漏极电流变化不大.在理想条件下,该器件获得超过三个数量级的漏极开关电流比以及较低的夹断漏电流(10-15A/μm).结果表明,基于高k介质的GaSb MOSFET是III-V族p沟道器件良好的候选材料.     

Transport properties of thermoelectric materials for coolers

The Seebeck coefficient, thermal conductivity, electrical conductivity and Hall coefficient of cooler grade, p-and n-type ternary alloys of Bi₂Te₃-Sb₂Te₃-Sb₂Se₃ were measured between 10 and 300 K. Between 300 K and about 150 K the temperature dependence of the transport properties can be explained by assuming nondegeneracy and a lattice scattering mechanism. The difference between the temperature dependence of the Hall effect in n-and p-type alloys can be explained by the presence of sub-bands of light and heavy holes in the valence band of p-type alloys.     

Low pressure metalorganic chemical vapor deposition of InP and related compounds

The low pressure metalorganic chemical vapor deposition epitaxial growth and characterization of InP, Ga_0.47In_0.53 As and Ga_xIn_1-xAs_yP_1-y, lattice-matched to InP substrate are described. The layers were found to have the same etch pit density (EPD) as the substrate. The best mobility obtained for InP was 5300 cm² V⁻¹S⁻¹ at 300 K and 58 900 cm² V⁻¹ S⁻¹ at 77₂K, and for GaInAs was 11900 cm² V⁻¹ S⁻¹ at 300 K, 54 600 cm² V⁻¹ S⁻¹ at 77 K and 90 000 cm V⁻¹S⁻¹ at 2°K. We report the first successful growth of a GaInAs-InP superlattice and the enhanced mobility of a two dimensional electron gas at a GaInAs -InP heterojunction grown by LP-MO CVD. LP MO CVD material has been used for GaInAsPInP, DH lasers emitting at 1.3 um and 1.5 um. These devices exhibit a low threshold current, a slightly higher than liquid phase epitaxy devices and a high differential quantum efficiency of 60%. Fundamental transverse mode oscillation has been achieved up to a power outpout of 10 mW. Threshold currents as low as 200 mA dc have been measured for devices with a stripe width of 9 um and a cavity length of 300 um for emission at 1.5 um. Values of T in the range 64–80 C have been obtained. Preliminary life testing has been carried out at room temperature on a few laser diodes (λ = 1.5μm). Operation at constant current for severalthousand hours has been achieved with no change in the threshold current.     

Characterization of the CH4/H2/Ar high density plasma etching process for HgCdTe

High density plasma etching of mercury cadmium telluride using CH₄/H₂/Ar plasma chemistries is investigated. Mass spectrometry is used to identify and monitor etch products evolving from the surface during plasma etching. The identifiable primary etch products are elemental Hg, TeH₂, and Cd(CH₃)₂. Their relative concentrations are monitored as ion and neutral fluxes (both in intensity and composition), ion energy and substrate temperature are varied. General insights are made into surface chemistry mechanisms of the etch process. These insights are evaluated by examining etch anisotropy and damage to the remaining semiconductor material. Regions of process parameter space best suited to moderate rate, anisotropic, low damage etching of HgCdTe are identified.     

Characterization of a rapid thermal anneal TiNxOy/TiSi2 contact barrier

In this paper, the physical and electrical properties of a TiN_xO_y/TiSi₂ dual layer contact barrier are reported. The TiN_xO_y/TiSi₂ barrier was formed by rapidly annealing a Ti thin film on Si in an N₂ ambient. During this process, the Ti film surface reacts with N₂ to form a TiN_xO_y skin layer and the bulk of the Ti film reacts with Si to form an underlying TiSi₂ layer. The influences of rapid thermal anneal (RTA) conditions on the TiN_xO_y layer were investigated by varying the RTA temperature from 600 to 1100° C and cycle duration from 30 to 100 s. It is found that the resulting TiN_xO_y and TiSi₂ layer thicknesses are dependent on RTA temperature and the starting Ti thickness. For a starting Ti thickness of 500Å, 150Å thick TiN_xO_y and 800Å thick TiSi₂ are obtained after an RTA at 900° C for 30 s. The TiN_xO_y thickness is limited by a fast diffusion of Si into Ti to form TiSi₂. When a Ti film is deposited on SiO₂, Ti starts to react with SiO₂ from 600° C and a significant reduction of the SiO₂ thickness is observed after an RTA at 900° C. The resulting layer is composed of a surface TiN_xO_y layer followed by a complex layer of titanium oxide and titanium suicide. In addition, when Ti is depos-ited on TiSi₂, thicker TiN_xO_y and TiSi₂ layers are obtained after RTA. This is because the TiSi₂ layer retards the diffusion of Si from the underlying substrate into the Ti layer. NMOSFETs were fabricated using the TiN_xO_y/TiSi₂ as a contact barrier formed by RTA at 900° C for 30 s and a significant reduction of contact resistance was obtained. In addition, electromigration test at a high current density indicated that a significant improvement in mean time to failure (MTF) has been obtained with the barrier.     

Research of SiO2/InP structure prepared by photo-CVD

The SiO₂ film as an insulator in InP MOS structure was grown by mercury-sensitized photo induced chemical-vapor deposition (photo-CVD) utilizing gaseous mixture of monosilane (SiH₄) and nitrous oxide (N₄O) under 253.7 nm ultraviolet light irradiation. The PHOTOX SiO₂ film (i.e., SiO₂ film prepared by photo-CVD system) deposited at 250° C has a refractive index of 1.46 and breakdown field strength of 7.0 MV/cm. The 1 MHz capacitance-voltage characteristics of the InP MOS diode was measured to study the interface state densities. The minimum value is 1.2 × 10¹¹ cm⁻²eV⁻¹ for the sample prepared at a substrate temperature of 250° C.     

新形势下河北移动全业务支撑策略研究

随着铁塔公司的成立及国家在“宽带中国”“提速降费”等一系列通信领域的重大战略实施,全业务运营越来越成为河北移动保持领先,实现卓越的重要支点。基于此河北移动启动大规模综合业务区建设,由传统传输网围绕基站建设转向全业务支撑。河北移动将综合业务区建设与全业务机房的选取统筹安排,建设综合业务区与全业务机房的联络光缆,将综合业务区光缆网成为承载重要集客数据专线和4G拉远站的载体,合理、有序、迅速实现“一张光缆网”的建设,鼎力支撑全业务及4G的发展。     

Structure of organometallic chemical vapor deposited BaTiO3 thin films on LaAIO3

BaTiO₃ thin films grown on LaA1O₃ by organometallic chemical vapor deposition were characterized with cross-sectional high resolution transmission electron microscopy. Epitaxy was confirmed for the films grown on (100) oriented substrates. The films displayed an aaxis orientation. The interface between the film and substrate was nearly atomically abrupt. Partial relaxation of the films was observed as a result of misfit dislocation formation.