Electrical properties of Si:H/<Emphasis Type="Italic">p</Emphasis>-Si structures fabricated by hydrogen implantation

Hydrogenated silicon (Si:H) layers and Si:H/p-Si heterostructures were produced by multiple-energy (3–24 keV) high-dose (5×10¹⁶–3×10¹⁷ cm^?2) hydrogen implantation into p-Si wafers. After implantation, current transport across the structures is controlled by the Poole-Frenkel mechanism, with the energy of the dominating emission center equal to E _c ?0.89 eV. The maximum photosensitivity is observed for structures implanted with 3.2×10¹⁷ cm^?2 of hydrogen and annealed in the temperature range of 250–300°C. The band gap of the Si:H layer E _g ≈2.4 eV, and the dielectric constant ?≈3.2. The density of states near the Fermi level is (1–2)×10¹⁷ cm^?3 eV^?1.     

Effect of Dislocation-related Deep Levels in Heteroepitaxial InGaAs/GaAs and GaAsSb/GaAs <Emphasis Type="Italic">p</Emphasis>–<Emphasis Type="Italic">i</Emphasis>–<Emphasis Type="Italic">n</Emphasis> Structures on the Relaxation time of Nonequilibrium Carriers

The results of an experimental study of the capacitance–voltage (C–V) characteristics and deep-level transient spectroscopy (DLTS) spectra of p⁺–p⁰–i–n⁰ homostructures based on undoped dislocationfree GaAs layers and InGaAs/GaAs and GaAsSb/GaAs heterostructures with homogeneous networks of misfit dislocations, all grown by liquid-phase epitaxy (LPE), are presented. Deep-level acceptor defects identified as HL2 and HL5 are found in the epitaxial p⁰ and n⁰ layers of the GaAs-based structure. The electron and hole dislocation-related deep levels, designated as, respectively, ED1 and HD3, are detected in InGaAs/GaAs and GaAsSb/GaAs heterostructures. The following hole trap parameters: thermal activation energies (E _t ), capture cross sections (σ _p ), and concentrations (N _t ) are calculated from the Arrhenius dependences to be E _t = 845 meV, σ _p = 1.33 × 10^–12 cm², N _t = 3.80 × 10¹⁴ cm^–3 for InGaAs/GaAs and E _t = 848 meV, σ _p = 2.73 × 10^–12 cm², N _t = 2.40 × 10¹⁴ cm^–3 for GaAsSb/GaAs heterostructures. The concentration relaxation times of nonequilibrium carriers are estimated for the case in which dislocation-related deep acceptor traps are involved in this process. These are 2 × 10^–10 s and 1.5 × 10^–10 s for, respectively, the InGaAs/GaAs and GaAsSb/GaAs heterostructures and 1.6 × 10^–6 s for the GaAs homostructures.     

Role of Si-doped Al<Subscript>0.3</Subscript>Ga<Subscript>0.7</Subscript>As layers in the high-frequency conductivity of GaAs/Al<Subscript>0.3</Subscript>Ga<Subscript>0.7</Subscript>As heterostructures under conditions of the quantum hall effect

The complex high-frequency conductivity of GaAs/Al_0.3Ga_0.7As heterostructures that are δ-doped and modulation-doped with silicon was investigated by acoustic methods under conditions of the integer quantum Hall effect. Both the real (σ₁) and imaginary (σ₂) parts of the complex conductivity σ(ω, H)=σ_i?iσ₂ were determined from the dependences of the absorption and velocity of surface acoustic waves on magnetic field. It is shown that, in the heterostructures with electron density n_s=(1.3–7)×10¹¹ cm^?2 and mobility μ=(1–2)×10⁵ cm²/(V s), the high-frequency conductivity near the centers of the Hall plateau is due to electron hopping between localized states. It is established that, with filling numbers 2 and 4, the conductivity of the Al_0.3Ga_0.7As:Si layer efficiently shunts the high-frequency hopping conductivity of the two-dimensional interface layer. A method of separating the contributions of the interface and Al_0.3Ga_0.7As:Si layers to the hopping conductivity σ(ω, H) is developed. The localization length of electrons in the interface layer is determined on the basis of the nearest neighbor hopping model. It is shown that, near the centers of the Hall plateau, both σ(ω, H) and n_s depend on the cooling rate of a GaAs/Al_0.3Ga_0.7As sample. As a result, the sample “remembers” the cooling conditions. Infrared light and static strain also change both σ(ω, H) and n_s. We attribute this behavior to the presence of two-electron defects (so-called DX^? centers) in the Al_0.3Ga_0.7As:Si layer.     

Electron traps in thin layers of low-temperature-grown gallium arsenide with As-Sb nanoclusters

Electron traps in low-temperature-grown ～40-nm-thick GaAs layers containing nanometer As-Sb clusters have been studied using deep-level transient spectroscopy. Measurements at various bias voltages and small-amplitude filling pulses have allowed the identification of two groups (T1 and T2) of traps with substantially different thermal electron emission rates. It is shown that the density of traps T2 (with an activation energy of 0.56 ± 0.04 eV and electron capture cross section of 2 × 10^?13?10^?12cm²) is ～2 × 10¹²cm_?2, while the density of traps T1 (0.44 ± 0.02 eV and 2 × 10^?14?10^?13 cm², respectively) is ten times lower. It is assumed that, according to the existence of the two cluster groups observed in the layers under study, traps T2 are associated with clusters 4–7 nm in diameter and traps T1, with clusters up to ～20 nm in diameter.     

Electrical properties and low-temperature photolumincesence of Si-doped CdTe crystals

The CdTe:Si single crystals with Si concentration in the range of C _Si ⁰ =2×10¹⁸–5×10¹⁹ cm^?3 are grown by the Bridgman-Stockbarger method. The samples were of the n-and p-type with electrical conductivity σ=2×10^?1–8×10^?9 Ω^?1 cm^?1. Being heated in the temperature range 300–440 K, the p-CdTe crystals were annealed, and their conductivity decreased. The shape of the low-temperature (5–20 K) photoluminescence spectra of the samples are indicative of their high structural quality. The specific feature of the emission of the CdTe:Si crystals is its decrease in the intensity of all lines induced by donors as the samples are cut progressively closer to the ingot top. The results obtained indicate that the Si impurity, in contrast with Ge, Sn, and Pb, does not exhibit the compensating and stabilizing effect in CdTe.     

Electrical properties and luminescence spectra of light-emitting diodes based on InGaN/GaN heterostructures with modulation-doped quantum wells

The distribution of charged centers N(w), quantum efficiency, and electroluminescence spectra of blue and green light-emitting diodes (LED) based on InGaN/AlGaN/GaN p-n heterostructures were investigated. Multiple InGaN/GaN quantum wells (QW) were modulation-doped with Si donors in GaN barriers. Acceptor and donor concentrations near the p-n junction were determined by the heterodyne method of dynamic capacitance to be about N _A ≥ 1 × 10¹⁹ cm^?3 ? N _D ≥ 1 × 10¹⁸ cm^?3. The N(w) functions exhibited maxima and minima with a period of 11–18 (±2–3 nm) nm. The energy diagram of the structures has been constructed. The shifts of spectral peaks with variation of current (J=10^?6–3×10^?2 A) are smaller (13–12 meV for blue and 20–50 meV for green LEDs) than the corresponding values for the diodes with undoped barriers (up to 150 meV). This effect is due to the screening of piezoelectric fields in QWs by electrons. The dependence of quantum efficiency on current correlates with the charge distribution and specific features in the current-voltage characteristics.     

Conductivity of Ga<Subscript>2</Subscript>O<Subscript>3</Subscript>–GaAs Heterojunctions

The effect of annealing in argon at temperatures of T_an = 700–900°C on the I–V characteristics of metal–Ga₂O₃–GaAs structures is investigated. Samples are prepared by the thermal deposition of Ga₂O₃ powder onto GaAs wafers with a donor concentration of N _d = 2 × 10¹⁶ cm^–3. To measure theI–V characteristics, V/Ni metal electrodes are deposited: the upper electrode (gate) is formed on the Ga₂O₃ film through masks with an area of S _k = 1.04 × 10^–2 cm² and the lower electrode in the form of a continuous metallic film is deposited onto GaAs. After annealing in argon at T_an ≥ 700°C, the Ga₂O₃-n-GaAs structures acquire the properties of isotype n-heterojunctions. It is demonstrated that the conductivity of the structures at positive gate potentials is determined by the thermionic emission from GaAs to Ga₂O₃. Under negative biases, current growth with an increase in the voltage and temperature is caused by field-assisted thermal emission in gallium arsenide. In the range of high electric fields, electron phonon-assisted tunneling through the top of the potential barrier is dominant. High-temperature annealing does not change the electron density in the oxide film, but affects the energy density of surface states at the GaAs–Ga₂O₃ interface.     

High-efficiency dual-junction GaInP/GaAs tandem solar cells obtained by the method of MOCVD

Monolithic dual-junction GaInP/GaAs solar cells grown by the MOCVD method were studied. The conditions of the growth of ternary Ga _x In_1?x P and Al _x In_1?x P alloys lattice-matched to GaAs are optimized. Technology for fabrication of a tunneling diode with a high peak current density of 207 A/cm² on the basis of heavily doped n ⁺⁺-GaAs:Si and p ⁺⁺-AlGaAs:C layers is developed. Cascade GaInP/GaAs solar cells obtained as a result of relevant studies featuring a good efficiency of the solar-energy conversion both for space and terrestrial applications. The maximum value of the GaInP/GaAs solar-cell efficiency was 30.03% (at AM1.5D, 40 suns).     

Raman and infrared spectroscopy of GaN nanocrystals grown by chloride-hydride vapor-phase epitaxy on oxidized silicon

Raman and infrared spectroscopy were applied to study nanocrystalline GaN films grown by chloride-hydride vapor-phase epitaxy on SiO₂/Si(111) substrates at T=520°C. It was ascertained that GaN nanocrystals are formed on the oxidized silicon surface at a rate of 10^?2 nm/s. It was shown that the peaks in the Raman spectra E₂(high)=566 cm^?1 and A₁(LO)=730 cm^?1 correspond to the elastically strained GaN wurtzite structure. It was detected that a peak related to E₁(TO)=558 cm^?1 arises in the infrared spectra, which shows that elastic stresses in the nanocrystals are insignificant.     

Diffusion of chromium into epitaxial gallium arsenide

Diffusion of Cr into epitaxial GaAs in an open system in the temperature range of 750–850°C was studied. Temperature dependences of the diffusion coefficient and solubility of Cr in GaAs were determined. Temperature dependences of the diffusion coefficient and solubility of Cr are described by the Arrhenius equation with the parameters D ₀ = 1.9 × 10⁹ cm²/s and E = 4.1 ± 0.2 eV for the diffusion coefficient and N ₀ = 2.3 × 10²⁴ cm^?3 and E ₀ = 1.9 ± 0.4 eV for solubility. The effect of protective SiO₂ filmon the Cr diffusion coefficient and morphology of the GaAs surface after diffusion was studied.     

Traps with near-midgap energies at the bonded Si/SiO<Subscript>2</Subscript> interface in silicon-on-insulator structures

Capture centers (traps) are studied in silicon-on-insulator (SOI) structures obtained by bonding and hydrogen-induced stratification. These centers are located at the Si/SiO₂ interface and in the bulk of the split-off Si layer. The parameters of the centers were determined using charge deep-level transient spectroscopy (Q-DLTS) with scanning over the rate window at fixed temperatures. Such a method allows one to study the traps near the Si midgap at temperatures near 295 K. It is shown that the density of traps with a continuous energy spectrum, which are located at the bonded Si/SiO₂ interface, decreases by more than four orders of magnitude at the mid-gap compared with the peak density observed at the activation energy E _a ≈0.2–0.3 eV. The capture centers are also found in the split-off Si layer of the fabricated SOI structures. Their activation energy at room temperature is E _a =0.53 eV, the capture cross section is 10^?19 cm², and the concentration is (0.7–1.7)×10¹³ cm^?3. It is assumed that these capture centers are related to deep bulk levels induced by electrically active impurities (defects) in the split-off Si layer close to the Si/SiO₂ interface.     

Special features of radiation-defect annealing in silicon <Emphasis Type="Italic">p-n</Emphasis> structures: The role of Fe impurity atoms

Deep-level transient spectroscopy is used to study the formation of complexes that consist of a radiation defect and a residual impurity atom in silicon. It is established that heat treatment of the diffused Si p⁺-n junctions irradiated with fast electrons lead to the activation of a residual Fe impurity and the formation of the FeVO (E_0.36 trap) and FeV₂ (H_0.18 trap) complexes. The formation of these traps is accompanied by the early (100–175°C) stage of annealing of the main vacancy-related radiation defects: the A centers (VO) and divacancies (V₂). The observed complexes are electrically active and introduce new electron (E_0.36: E _t ^e =E _c -0.365 eV, σ _n =6.8×10^?15 cm²) and hole (H_0.18: E _t ^h =E _v +0.184 eV, σ _p =3.0×10^?15 cm²) levels into the silicon band gap and have a high thermal stability. It is believed that the complex FeVO corresponds to the previously observed and unidentified defects that have an ionization energy of E _t ^e =E _c ?(0.34–0.37) eV and appear as a result of heat treatment of irradiated diffused Si p⁺-n junctions.     

Interaction of infrared radiation with free carriers in mesoporous silicon

Features of absorption and reflection of infrared radiation in the range 500–6000 cm^?1 are investigated; these features are associated with free carriers in the layers of mesoporous Si (porosity, 60–70%) formed in single-crystal p-Si(100) wafers with a hole concentration of N _p ≈10²⁰ cm^?3. It is found that the contribution of free holes to the optical parameters of the samples decreases as the porosity of the material increases and further falls when the samples are naturally oxidized in air. The experimental results are explained in the context of a model based on the Bruggeman effective medium approximation and the Drude classical theory with a correction for additional carrier scattering in silicon residues (nanocrystals). A comparison between the calculated and experimental dependences yields a hole concentration in nanocrystals of N _p ≈10¹⁹ cm^?3 for as-prepared layers and shows a reduction of N _p when they are naturally oxidized.     

Effects of Nb Content on the Ferroelectric and Dielectric Properties of Nb/Nd-Co-doped Bi<Subscript>4</Subscript>Ti<Subscript>3</Subscript>O<Subscript>12</Subscript> Thin Films

Nd/Nb-co-substituted Bi_3.15Nd_0.85Ti_3?x Nb _x O₁₂ (BNTN _x , x = 0.01, 0.03, 0.05 and 0.07) thin films were grown on Pt/Ti/SiO₂/Si (100) substrates by chemical solution deposition. The effects of Nb content on the micro-structural, dielectric, ferroelectric, leakage current and capacitive properties of the BNTN _x thin films were investigated. A low-concentration substitution with Nb ions in BNTN _x can greatly enhance its remanent polarization (2P _r) and reduce the coercive field (2E _c) compared with those of Bi₄Ti₃O₁₂ (BIT) thin film. The highest 2P _r (71.4 μC/cm²) was observed in the BNTN_0.03 thin film when the 2E _c was 202 kV/cm. Leakage currents of all the films were on the order of 10^?6 to 10^?5 A/cm², and the BNTN_0.03 thin film has a minimum leakage current (2.1 × 10^?6 A/cm²) under the high electric field (267 kV/cm). Besides, the C–V curve of the BNTN_0.03 thin film is the most symmetrical, and the maximum tunability (21.0%) was also observed in this film. The BNTN_0.03 thin film shows the largest dielectric constant and the lowest dielectric loss and its maximum Curie temperature is 410 ± 5°C.     

Photoluminescence of electron-hole plasma in semi-insulating undoped GaAs

The dependence of the photoluminescence spectrum of electron-hole plasma in semi-insulating undoped GaAs on the concentration of the background carbon impurity N_C(3×10¹⁵ cm^?3≤N_C≤4×10¹⁶ cm^?3) is studied at 77 K. It is established that the density of the electron-hole plasma, which is equal to n _e?h ≈1.1×10¹⁶ cm^?3 in crystals with the lowest impurity concentration at an excitation intensity of 6×10²² photons/(cm² s), decreases considerably as the value of N_C increases in the range mentioned above. A decrease in the density of the electron-hole plasma with increasing N_C is attributed to the effect of fluctuations in the carbon concentration N_C, which give rise to a nonuniform distribution of interacting charge carriers and to localization of holes in the tails of the density of states of the valence band.     

Special features of formation and characteristics of Ni/21<Emphasis Type="Italic">R</Emphasis>-SiC Schottky diodes

The Ni/n-21R-SiC(0001) and \(Ni/n - 21R - SiC(000\bar 1)\) surface-barrier structures formed on 21R-SiC crystals doped to a concentration of (1–2)×10¹⁸ cm^?3 and grown by the Lely method were investigated prior to and after rapid thermal annealing (RTA) in vacuum (10^?2 Pa) in the temperature range of 450–1100°C. Using X-ray diffraction analysis and Auger analysis, it is shown that cubic NiSi₂ and orthorhombic δ-Ni₂Si and NiSi silicides coexist with pure Ni in starting samples. The RTA brings about a polymorphic transformation of these phases, which causes the transformation of a barrier contact to a rectifying one independently of the SiC face type, even at T?600°C. The physicochemical mechanisms of degradation of these barrier structures are discussed.     

Low-temperature (77 K) impurity breakdown in <Emphasis Type="Italic">p</Emphasis>-type 4<Emphasis Type="Italic">H</Emphasis>-SiC

The impact ionization of acceptors in aluminum-doped 4H-SiC epitaxial films (Al concentration 2 × 10¹⁵ cm^?3) at a temperature of 77 K is studied. It is found that the impact-ionization coefficient exponentially depends on the reverse electric field: α _p = α*_pexp(?F*/F). The largest ionization coefficient is α* _p = 7.1 × 10⁶ cm^?3 s^?1, and the threshold field is F* = 2.9 × 10⁴ V/cm.     

The effect of damaging radiation (<Emphasis Type="Italic">p,e, γ</Emphasis>) on photovoltaic and tunneling GaAs and GaSb <Emphasis Type="Italic">p-n</Emphasis> junctions

The properties of multiple-junction solar cells depend on the properties of the constituent photovoltaic and tunneling p-n junctions. In this study, the properties of the space-charge region for photovoltaic and tunneling p-n junctions were examined using the dark current-voltage characteristics for two semiconductors: GaSb (a narrow-gap semiconductor) and GaAs (a wide-gap semiconductor). The effects of irradiation with protons (the energy of 6.78 MeV and the maximum fluence of 3 × 10¹² cm^?2), electrons (the energy of 1 MeV and the maximum fluence of 3 × 10¹⁶ cm^?2), and γ-ray photons (the energy of 1.17–1.33 MeV and the maximum dose of 17 Mrad) on the lifetime of charge carriers in the space-charge region of photovoltaic p-n junctions and on the peak current of connecting tunneling p-n junctions were studied. The coefficients of the damage for the inverse lifetime are determined for photovoltaic p-n junctions. The coefficients of equivalence between the used types of radiation are determined; these coefficients are found to be almost independent, on the order of magnitude, of the type and material of the p-n-junction (and nearly equal for photovoltaic GaAs p-n junctions and tunneling GaAs and GaSb p-n junctions).     

Thermoelectric figure of merit in solid solutions with phonon scattering by off-center impurities

The Seebeck coefficient and the electrical and thermal conductivities (S, σ, and κ) of ternary PbTe_1?xSe_x (x=0.1 and 0.3) and quaternary PbTe_1?2xSe_xS_x (x=0.025, 0.05, 0.1, and 0.15) solid solutions have been studied. Polycrystalline samples with an electron density of (0.5–5.0)×10¹⁸ cm^?3 were used; their quality was monitored by comparing the measured and calculated mobility values at 85 K. A considerable decrease in mobility and an anomalous trend in the σ(T) curve near 77 K were revealed in quaternary alloys with x?0.1; for x=0.15, unusual behavior of κ(T) was also found. According to estimates, the lattice thermal conductivity of this material is temperature-independent in the 80-to 300-K temperature range. This means that a reduction in phonon-phonon scattering with an increase in temperature is completely compensated by an increase in the scattering on impurities. The observed anomalies of σ(T) and κ(T) are considered assuming the possible of off-center location of sulfur atoms at the lattice sites. The thermoelectric figure of merit Z of the studied alloys has been determined in the range 80–300 K. In spite of decreasing mobility, the maximum Z was obtained in a quaternary compound with x=0.1: at 300 K, Z_max=2×10^?3 K^?1 with a carrier density of ～3×10¹⁸ cm^?3; at 175 K, Z_max=1.5×10^?3 K^?1 with the density decreasing to 5×10¹⁷ cm^?3. The obtained data indicate that the introduction of off-center impurities rises Z at T?300 K.     

Special features of charge transport in PbGa<Subscript>2</Subscript>Se<Subscript>4</Subscript> crystals

The current-voltage (I-V) characteristics of PbGa₂Se₄ single crystals grown by the Bridgman-Stockbarger method with a resistivity of 10¹⁰–10¹² Ω cm were measured. The value of the majority carrier mobility μ=14 cm² V^?1 s^?1, calculated by the differential method of analysis of I-V characteristics, makes it possible to evaluate a number of parameters: the carrier concentration at the cathode (n_c0=2.48 cm^?3), the width of the contact barrier d_c=5.4×10^?8 cm, the cathode transparency D _c ^* =10^?5–10^?4 eV, and the quasi-Fermi level E_F=0.38 eV. It is found that a high electric field provides the charge transport through PbGa₂Se₄ crystals in accordance with the Pool-Frenkel effect. The value of the dielectric constant calculated from the Frenkel factor is found to be equal to 8.4.