Cleaning Method of InSb [-1-1-1] B of n- InSb [111] A/B for growth of epitaxial layers by liquid phase epitaxy

The crystal structure of InSb [111] A/B surfaces shows that this structure is polarized. This means that the surfaces of InSb [111] A and InSb [1 1 1] B contain two different crystallized directions and they have different physical and chemical properties. Experiments were carried out on the InSb [111] A/B surfaces, showing that tartaric acid etchant could create a very smooth surface on the InSb [1 1 1] B without any traces of oxides and etch pit but simultaneously create etch pit on InSb [111] A surfaces. After lapping and polishing, some particles remained on the InSb [1 1 1] B surface, they could not be removed easily by standard cleaning process and if these particles remain on the surface of the substrate, the growth layer was not uniform and some island-like regions were observed. The purpose of this work is to remove these particles on the InSb [1 1 1] B surface. Some morphology images of both surfaces, InSb [111] A/B, will be presented.     

InSb(111)A面腐蚀坑成因分析

采用光学显微镜和光学轮廓仪分析了InSb晶片(111)A面经特定腐蚀剂腐蚀后出现的两种特征腐蚀坑,并通过多次腐蚀试验观察了这两种腐蚀坑形貌的演变。从理论上对腐蚀坑形貌的成因进行了分析,结果显示1类特征腐蚀坑的成因是由于晶片固有的位错缺陷,2类特征腐蚀坑可能是由于晶片表面存在一定深度的损伤层引起的。     

Optical characterization of [111]B InGaAs layers

Strain assessment of [111]B InGaAs/GaAs layers, of several compositions and variable thicknesses, has been performed by photoluminescence and Raman spectroscopies. Both the gap energy and GaAs-like LO frequency undergo a blue shift proportional to the residual strain, which can be thus determined. The critical layer thickness for [111]B orientation is found to be three times larger than for [001] layers grown simultaneously. In addition, two kinds of inhomogeneities in the relaxation are found: strain domains, demonstrated by the spectral and spatial resolution of photoluminescence excitation, micro-photoluminescence and micro-Raman experiments; and a change in the strain release with layer depth, obtained by Raman at different excitation energies.     

Plasma-Cleaned InSb (112)B for Large-Area Epitaxy of HgCdTe Sensors

Plasma etching of (112)B InSb to prepare this semiconductor for the heteroepitaxy deposition of CdTe and initial studies of CdTe epilayers grown by molecular beam epitaxy (MBE) on InSb (112)B substrates cleaned with various plasma treatments are presented. X-ray diffraction rocking curve maps of the MBE CdTe epilayers on 3-inch InSb (112)B substrates have full-width at half-maxima (FWHM) values in the range of 20 arcsec to 30 arcsec. An etch pit density analysis of the 3-inch CdTe epilayers reveals a defect density of 1.0 × 10⁷ cm⁻² and 7.7 × 10⁵ cm⁻² at the center and edge of the wafer, respectively. Evaluation of a standard HgCdTe annealing process suggests that the removal of the InSb substrate is likely to be needed prior to any postgrowth annealing in Hg overpressure. Finally, we present a low-energy helium plasma exposure of wet-etched InSb (112)B substrates that provides a uniform epi-ready surface that is nearly stoichiometric, and free of oxide and residual contaminants.     

Tuning the Au‐Free InSb Nanocrystal Morphologies Grown by Patterned Metal–Organic Chemical Vapor Deposition

A thorough study of direct InSb nanocrystal formations on patterned InAs (111)B substrates is provided. These nanostructures are created without the use of Au catalysts or initial InAs segments. Under the growth conditions generally used for selective‐area, catalyst‐free epitaxy, a wide range of InSb nanocrystal morphologies are observed. This is because the low‐energy InSb surfaces, studied by first‐principles calculations, are the {111} facets as opposed to the {110} facets. By controlling the V/III ratio during growth, different InSb nanostructures can be achieved. Using low V/III growth conditions, In droplets start to form and InSb nucleation takes place at the droplet–semiconductor interface only, resulting in vertical, self‐catalyzed InSb nanopillars.     

利用CH4/H2/Ar及Cl2高密度等离子体对InSb的高速率刻蚀研究（英文）

利用感应耦合等离子体(ICP)进行了InSb刻蚀研究。为了实现高的刻蚀速率同时保证光滑的刻蚀表面,研究中在CH4/H2/Ar气氛中引入了Cl2。研究发现,对InSb的刻蚀速率随Cl2含量及ICP功率的升高而线性增加。当Cl2含量增加到超过12%或ICP功率大于900 W时,刻蚀表面变得粗糙,而易引起刻蚀损伤的直流偏压随ICP功率的升高而降低。此现象归因于刻蚀副产物InCl3在样品表面的聚集进而妨碍均匀刻蚀反应所致。当样品温度从20℃提高到120℃,刻蚀速率及表面粗糙度无明显变化。通过试验研究,实现了对InSb的高速率、高垂直度刻蚀,刻蚀速率大于500 nm/min,对SiO2掩模刻蚀选择比大于6,刻蚀表面光洁,刻蚀垂直度可达80°。     

A Coherently Strained Monoclinic [111]PbTiO3 Film Exhibiting Zero Poisson's Ratio State

[111]‐Oriented perovskite oxide films exhibit unique interfacial and symmetry breaking effects, which are promising for novel quantum materials as topological insulators and polar metals. However, due to strong polar mismatch and complex structural reconstructions on (111) surfaces/interfaces, it is still challenging to grow high quality [111] perovskite heterostructures, let alone explore the as‐resultant physical properties. Here, the fabrication of ultrathin PbTiO₃ films grown on a SrTiO₃(111) substrate with atomically defined surfaces, by pulsed laser deposition, is reported. High‐resolution scanning transmission electron microscopy and X‐ray diffraction reveal that the as‐grown [111]PbTiO₃ films are coherent with the substrate and compressively strained along all in‐plane directions. In contrast, the out‐of‐plane lattices are almost unchanged compared with that of bulk PbTiO₃, resulting in a 4% contraction in unit cell volume and a nearly zero Poisson's ratio. Ferroelectric displacement mapping reveals a monoclinic distortion within the compressed [111]PbTiO₃, with a polarization larger than 50 µC cm^?2. The present findings, as further corroborated by phase field simulations and first principle calculations, differ significantly from the common [001]‐oriented films. Fabricating oxide films through [111] epitaxy may facilitate the formation of new phase components and exploration of novel physical properties for future electronic nanodevices.     

Synchrotron white beam x-ray topography analysis of MBE grown CdTe/CdTe (111)B

The structural quality of CdTe(111)B substrates and MBE grown CdTe epilayers is examined with synchrotron white beam x-ray topography (SWBXT). Reflection SWBXT indicates that CdTe substrates with comparable x-ray double crystal rocking curve full width at half maximum values can have radically different defect microstructures, i.e. dislocation densities and the presence of inclusions. Dislocation mosaic structures delineated by SWBXT are consistent with the distribution of etch pits revealed by destructive chemical etch pit analysis. Direct one-to-one correspondence between distinct features of the topographic image and individual etch pits is demonstrated. Clearly resolved images of individual dislocations are obtained by carrying out transmission SWBXT. Our investigation demonstrates how, the extent of twinning in a CdTe epilayer is strongly influenced by the quality of the defect microstructure, and how dislocations propagate from an inclusion.     

Performance of polysilicon gate HfO/sub 2/ MOSFETs on [100] and [111] silicon substrates

Mobility dependence on Si substrate orientations was investigated for HfO/sub 2/ MOSFETs for the first time. High-temperature (600 /spl deg/C) forming gas (FG) annealing (HT-FGA) was applied on the devices on both [100] and [111] substrates to evaluate the mobility for optimal interfacial quality. Using HT-FGA, D/sub it/ of the [111] devices was reduced down below 1 /spl times/ 10/sup 12/ cm/sup -2/V/sup -1/. Similar to SiO/sub 2/ devices, NMOS mobility of the [111] devices was lower than that of the [100] devices at higher effective fields, while it was reversed for PMOSFETs.     

分子束外延InSb薄膜材料的表面微观形貌研究

用原子力显微镜等方法研究了在InSb (001)衬底和(001)偏(111)B面2°衬底上分子束外延生长的同质外延薄膜和掺Al薄膜样品表面的微观形貌。对比了不同衬底同质外延时生长模式的差异,并观察了加入Al后引入的交叉影线,分析了其产生的原因。研究表明,使用有偏角的衬底更有利于减少分子束外延薄膜的表面缺陷。     

Long-storage-time MIS capacitors formed on InSb films grown by MOCVD

Metalorganic chemical vapor deposition (MOCVD) for epitaxially grown InSb has been explored for infrared (IR) detector applications that incorporate a metal-insulator-semiconductor (MIS) device structure. InSb epilayers were attempted on InSb substrates with the (111)A, (111)B, and (100) surface orientations using an MOCVD process at 450° C. SiO₂ insulator films were formed on these epilayers using a photon-assisted CVD process. Successful MIS fabrication was most reproducible on the (100) surface, where a large-area, featureless morphology was routinely attained. MIS devices were characterized by standard analyses of capacitance-voltage (C-V) and transient-capacitance (C-t) measurements as a function of temperature between 77 and 110 K. Epilayers that had net donor concentrations of about 1 to 3 × 10¹⁵ cm⁻³, the lowest achieved, demonstrated improvement for IR detector applications. For example, MIS storage times in deep depletion at 77 K exceeded 150 ms, about an order of magnitude longer than those typically measured in control samples of commercially available InSb grown by the Czochralski process. Longer storage times correlated with enhanced generation lifetimes. These relative improvements are attributed to a lower density of thermally induced defects in the epilayer material.     

Sensitivity of Strained and Unstrained Structure Growth on GaAs (111)B

Compared with traditional (100) surfaces, the growth window for achieving high-quality photonic device structures on (111) GaAs by conventional molecular beam epitaxy (MBE) is very narrow. However, strained and unstrained structures produced on (111) substrates offer a new class of electronic and optoelectronic devices that benefit from the piezoelectric effect—a feature not accessible on symmetric (100) orientations—and additional material choices, such as InAs and InGaAs. In this work, we report on a series of investigations of strained and unstrained structures that include GaAs, AlGaAs/GaAs, and InAs/GaAs quantum layers deposited on epi-ready GaAs (111)B 2° → [2[`1][`1] 2\bar{1}\bar{1} ] Si-doped substrates by conventional MBE.     

W[111]尖端场发射电子枪的工作特性

本文报道了单晶W[111]尖端的制作,以及由W[111]尖端阴极,第一、二阳极组成的三极场发射电子枪(FEG)的工作特性。实验结果表明,这种FEG在枪室真空为510-7Pa,加速电压在30kV的条件下,其虚源半径为1.6nm;亮度为3.8109A/cm2.sterad;场发射电流为1A时,束流稳定性为5%(10min内)。说明它是一种较理想的点状电子源,在实际应用中具有广泛发展前景。     

InSb的电感耦合等离子体刻蚀技术研究

随着InSb红外焦平面探测器的发展,焦平面阵列规模越来越大,像元面积越来越小.湿法刻蚀因其各向同性的特点,导致像元钻蚀严重,越来越难满足大规格InSb焦平面器件的要求.研究了以Ar/CH4/H2作为刻蚀气体,利用电感耦合等离子体(ICP)刻蚀大规格InSb晶片的初步研究结果,研究不同RF功率、腔体压力和Ar的含量对刻蚀速率、表面形貌的影响及InSb表面残留聚合物的去除方法.     

InSb红外焦平面器件台面刻蚀工艺研究

传统的湿法腐蚀工艺由于各向同性的特点,象元钻蚀严重,导致器件占空比下降,限制了锑化铟大面阵红外焦平面的发展。基于电感耦合等离子体(ICP)刻蚀技术,以BCl3/Ar为刻蚀气体,研究了不同气体配比、工作压力、RF功率对刻蚀效果的影响,获得了适用于锑化铟焦平面制备工艺的干法刻蚀技术。     

Structure of [110] tilt grain boundaries in zirconia bicrystals

Cubic stabilized zirconia bicrystals with [110] symmetric tilt grain boundaries were fabricated by diffusion bonding of two single crystals with the composition of ZrO2-9.6mol%Y2O3. The structures of symmetric tilt small angle grain boundary and two types of symmetric tilt sigma3 grain boundaries with different grain boundary planes were observed by transmission electron microscopy (TEM). High-resolution transmission electron microscopy (HREM) observations clarified that the [110] small angle tilt grain boundary consists of periodic array of b = a/2[110] type edge dislocations. This result is consistent with Frank's dislocation model for small angle grain boundary. HREM observation also revealed that the 70.5 degrees sigma3 grain boundary shows atomically coherent grain boundary structure with the boundary plane of [111], while the 109.5 degrees sigma3 grain boundary accompanies grain boundary facets taking [111]/[115] asymmetric grain boundary plane. Because of the very low surface energy of [111] plane and/or high lattice matching of [111] and [115] type planes, the grain boundary faceting may be preferred in spite of increasing grain boundary area to about 6%. TEM-energy-dispersive X-ray spectroscopy (EDS) analyses were performed on both sigma3 grain boundaries, and the segregation of yttrium ions to the boundaries was detected in both cases. The amount of segregation is about the same in both sigma3 boundaries. It can be concluded that the segregation of yttrium ions to sigma3 grain boundary exists in cubic zirconia.     

Merging Nanowires and Formation Dynamics of Bottom-Up Grown InSb Nanoflakes

Indium Antimonide (InSb) is a semiconductor material with unique properties, that are suitable for studying new quantum phenomena in hybrid semiconductor-superconductor devices. The realization of such devices with defect-free InSb thin films is challenging, since InSb has a large lattice mismatch with most common insulating substrates. Here, the controlled synthesis of free-standing 2D InSb nanostructures, termed as “nanoflakes”, on a highly mismatched substrate is presented. The nanoflakes originate from the merging of pairs of InSb nanowires grown in V-groove incisions, each from a slanted and opposing {111}B facet. The relative orientation of the two nanowires within a pair, governs the nanoflake morphologies, exhibiting three distinct ones related to different grain boundary arrangements: no boundary (type-I), Σ3- (type-II), and Σ9-boundary (type-III). Low-temperature transport measurements indicate that type-III nanoflakes are of a relatively lower quality compared to type-I and type-II, based on field-effect mobility. Moreover, type-III nanoflakes exhibit a conductance dip attributed to an energy barrier pertaining to the Σ9-boundary. Type-I and type-II nanoflakes exhibit promising transport properties, suitable for quantum devices. This platform hosting nanoflakes next to nanowires and nanowire networks can be used to selectively deposit the superconductor by inter-shadowing, yielding InSb-superconductor hybrid devices with minimal post-fabrication steps.     

Topography and Dislocations in (112)B HgCdTe/CdTe/Si

Scanning electron microscopy (SEM), atomic force microscopy (AFM), and x-ray diffraction (XRD) measurements all indicate an approximate factor of ten increase in the Everson etch pit density (EPD) over standard Nomarski microscopy Everson EPD determination. A new (112)B CdTe/Si EPD etch has also been demonstrated which reduces the surface roughness of the etched epilayer and makes etch pit density determination less problematic.     

InSb晶片的机械加工损伤层研究

结合X射线衍射技术以及逐层化学 腐蚀剥离损伤层的方法,定量分析了InSb晶体 由于切割、研磨、抛光等工艺所引入的损伤层的深度,并探讨了 损伤层结构及引入因素。研究结果表明,切割加工是引入InSb晶 片表面损伤层的主要工序,其表面损伤层的深度达 到16 μm左右;双面研磨的InSb晶片表面的损伤层深度约 为12 μm;经机械化学抛光加工后的InSb晶片表面的损伤层深 度明显减小,约为2 μm。     

Suppression of twin formation in CdTe(111)B epilayers grown by molecular beam epitaxy on misoriented Si(001)

CdTe(lll)B layers have been grown on misoriented Si(001). Twin formation inside CdTe(lll)B layer is very sensitive to the substrate tilt direction. When Si(001) is tilted toward [110] or [100], a fully twinned layer is obtained. When Si(001) is tilted toward a direction significantly away from [110], a twin-free layer is obtained. Microtwins inside the CdTe(111)B layers are overwhelmingly dominated by the lamellar twins. CdTe(111)B layers always start with heavily lamellar twinning. For twin-free layers, the lamellar twins are gradually suppressed and give way to twin-free CdTe(111)B layer. The major driving forces for suppressing the lamellar twinning are the preferential orientation of CdTe[11-2] along Si[1-10] and lattice relaxation. Such preferential orientation is found to exist for the CdTe(111)B layers grown on Si(001) tilted toward a direction between [110] and [100].