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1.
近场无线通信(NFC)是一种已经被广泛应用的短距无线通信技术.其中最常见的是将NFC技术应用于移动支付和门禁访问控制等应用.从技术上讲,这些应用利用NFC模拟卡模式将NFC设备模拟成银行卡或门禁卡,然后等待外部阅读器验证.在这类应用场景下,选取合适的安全认证方案是非常重要的.首先,介绍了现有的NFC认证系统和安全方案并分析了系统安全需求和潜在的安全风险.然后,采用Hash、AES和口令Key动态更新机制,提出了一种适用于NFC移动设备的双向认证安全方案,并设计了自同步机制.最后,利用GNY逻辑以形式化证明的形式证明了方案的安全性,分析表明该方案能解决伪造、重放攻击、窃听、篡改、异步攻击等安全问题.  相似文献   

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Wireless Networks - Near Field Communication (NFC) is a promising technology that facilitate E-commerce through contactless communications. In the past decade, the NFC characteristics such as...  相似文献   

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A wide range of reliability prediction methods is available today for electronic systems. This article classifies the commonly used and referred to reliability prediction methodologies into some categories easy to understand. A set of selected methods, which are of relevance to many industries, the aerospace industry among others, are reviewed and the possibility they offer to address the stated objectives is assessed. Their respective advantages and shortcomings are the basis for the recommendation we make to use the methods in a combined fashion (simultaneously or successively) along the product development process.  相似文献   

5.
Several research groups have been actively pursuing antimonide-based electronic devices in recent years. The advantage of narrow-bandgap Sb-based devices over conventional GaAs- or InP-based devices is the attainment of high-frequency operation with much lower power consumption. This paper will review the progress on three antimonide-based electronic devices: high electron mobility transistors (HEMTs), resonant tunneling diodes (RTDs), and heterojunction bipolar transistors (HBTs). Progress on the HEMT includes the demonstration of Ka- and W-band low-noise amplifier circuits that operate at less than one-third the power of similar InP-based circuits. The RTDs exhibit excellent figures of merit but, like their InP- and GaAs-based counterparts, are waiting for a viable commercial application. Several approaches are being investigated for HBTs, with circuits reported using InAs and InGaAs bases.  相似文献   

6.
安全电子时间戳系统的设计方案   总被引:5,自引:0,他引:5  
刘军  吴贵臣  翁亮 《通信学报》2003,24(2):64-70
在电子政务与电子商务系统中,机要电子文档、重要商业合同与电子交易等都需要安全、准确、权威的统一时间,因些有必要在电子数据信息流中加入时间标识,即时间戳。本文主要分析了安全电子时间戳系统设计的一般方法及应注意的一些因素,并结合我国实际给出了一种电子时间戳系统的设计方案。  相似文献   

7.
We present a new protocol for electronic transactions which is not only secure but also anonymous, the latter characteristic being obtained by associating an encryption device with a chip card. Security is ensured by the use of encryption, electronic signature and authentication. In order to check the validity of the security properties enforced by the protocol, a model and a specification are provided. The protocol modeling language is a process algebra with value passing extended by an observation mechanism allowing the specification of security levels, by cryptographic primitives, and by a function call feature on private channels allowing the modeling of interactions with the crypto-system. The anonymity is expressed by an information flow property. The verification method, based on cosimulation, is proved consistent and complete and analysis confirms that this approach ensures not only anonymity (thanks to the fact that the client never discloses to the merchant any information permitting his identification), but also the quasi-impossibility of any fraudulent transaction.  相似文献   

8.
电子投票是电子政务的一项重 要内容,它以密码学为基础,运用 现代计算机网络技术和通信技术来 实现投票功能。与传统的手工投票 方式相比,它提供了更高的效率和 更大的灵活性,不仅可以减少通常 投票活动在组织、计票和安全保密 等方面所需花费的大量人力和物 力,而且为投票者提供了极大的方 便性。 当前,我国已基本形成电子政 务建设的总体结构和总体技术框 架,其中,总体技术框架以公钥基 础设施(PKI)、授权管理基础设施 (PMI)、可信时间戳服务系统为基 础,其核心是PKI技术。本文利用PKI 及匿名通道协议,提出了一个基于 PKI的安全电子投票方案,该方案可 以方便、有效地在电子政务系统的 架构上来实现。  相似文献   

9.
本文介绍了我们已经实现的一个基于Internet的安全电子商务系统,它已成功地嵌入到当前流行的Netscape浏览器和服务器中,本文主要讨论了基于涉及基于设计级的安全需求,系统体系结构,系统功能和使用的关键技术,全安机制的设计和实现是我们的重点。  相似文献   

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RFID电子铅封是口岸管理部门现阶段普遍采用的一种监管技术手段,但传统方法存在运行成本高、安全性低及应用范围窄等不足。对此提出了一种新颖的基于NFC的智能防伪电子铅封系统,通过采用NFC手机、注册认证机制、RSA加密以及防伪验证等技术,使得系统具有安全性高、成本低等特点,且不需要专用设备支持就可以实现物流运输全过程的有效监管,为内地供港鲜活农产品"直通放行"监管新模式奠定坚实的技术基础。  相似文献   

12.
One-dimensional (1-D) nanostructures have been the focus of current researches due to their unique physical properties and potential applications in nanoscale electronics and optoelectronics. They address and overcome the physical and economic limits of current microelectronic industry and will lead to reduced power consumption and largely increased device speed in next generation electronics and optoelectronics. This paper reviews the recent development on the device applications of 1-D nanostructures in electronics and optoelectronics.First, typical 1-D nanostructure forms, including nanorods,nanowires, nanotubes, nanobelts, and hetero-nanowires,synthesized from different methods are briefly discussed.Then, some nanoscale electronic and optoelectronicdevices built on 1-D nanostructures are presented,including field-effect transistors (FETs), p-n diodes,ultraviolet (UV) detectors, light-emitting diodes (LEDs),nanolasers, integrated nanodevices, single nanowire solar cells, chemical sensors, biosensors, and nanogenerators.We then finalize the paper with some perspectives and outlook towards the fast-growing topics.  相似文献   

13.
Highly conducting and transparent cadmium oxide films have been deposited on Corning 7059 glass substrates by ion-beam sputtering and by spray pyrolysis. The electrical and optical properties of CdO films prepared by the two techniques are similar. Typical films of 0.5 μm thickness have electrical resistivities of (2–5) × 10-3 ohm-cm, carrier concentrations of approximately 1020 cm-3, and an optical transmission of higher than 70% in the wavelength range of 600–900 nm. An optical bandgap of 2.4–2.42 eV was deduced from the optical transmission data.  相似文献   

14.
Starting with exploratory work in the 1930s and development work in the 1940s a variety of two-terminal and three-terminal solid-state device structures have been proposed, fabricated, and developed. This work parallels the development effort on vacuum electronic devices, and the two technologies share many applications. The solid-state and vacuum electronic devices work in tandem to enable numerous commercial and military systems. Solid-state device development is closely linked to semiconductor materials growth and processing technology, and advances such as the introduction of heterojunction growth technology, permit complex multiple layer device structures to be fabricated and optimized for maximized device performance. This work has been very successful and a variety of high-performance diodes and transistors are now available for use from UHF into the millimeter-wave spectrum, approaching terahertz frequencies. The development, operating principles, and state-of-the-art of various diode and transistor structures are reviewed.  相似文献   

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引 言 随着网络的普及,电子商务对金融服务行业将产生巨大的影响。付费系统及其相关金融机构将在电子商务领域扮演极其重要的角色。安全电子交易协议(SET)凭其高安全性成为公开网络上最受欢迎的电子付费协议之一。但为了满足众多  相似文献   

17.
Self-assembled GexSi1−x islands were grown on Si(0 0 1) substrates by solid source molecular beam epitaxy. Two different morphological shapes with different sizes were evolved by tuning the growth time at a constant deposition temperature. Micro-Raman analysis was carried out to investigate the composition, intermixing and strain of resultant islands. The observed broad infra-red photoluminescence signal from grown samples was associated with radiative recombination of holes confined in the Ge islands and electrons localized in the Si buffer layer. The PL peak position and intensity were found to be influenced by the islands size and intermixing of Si and Ge. The electrical properties of the islands were studied through photoexcited I-V characteristics and current imaging using conducting mode atomic force microscopy.  相似文献   

18.
Multilayer diamond heat spreaders for electronic power devices   总被引:1,自引:0,他引:1  
Single layer diamond and multilayer diamond heat spreader substrates are prepared and bonded to device wafers of silicon and gallium arsenide. Metallization schemes for the diamond surface and the backside of the device wafers are described. Bonding of the device wafers to the diamond substrates using the high thermal conductivity gold–tin eutectic solder is carried out. Characterization of the bond for the distribution of different elements in the metallization layers and the solder, for the presence of microscopic defects such as voids and cracks, for the adhesion strength and for the stability of the bond under thermal cycling is performed. The heat spreader characteristics of the substrates with single and multlayer diamond are determined using infrared imaging of the bonded device wafers and compared with that of wafers bonded to metal substrates. Modeling and analysis of the effectivethermal conductivity showed that the multilayer diamond substrates are better heat spreaders and reduce the device temperature so that the life of the electronic devices is prolonged.  相似文献   

19.
在终端上安全部署数字证书是基于PKI的C-V2X直连通信安全机制发挥作用的先决条件。针对传统离线灌装方法成本高的缺点,本文提出一种基于4G/5G网络GBA开放安全能力的新型C-V2X终端初始安全配置方案。利用USIM在用户标识、根密钥、GBA能力及硬件安全环境方面的固有优势,V2X终端能够在最初阶段通过4G/5G网络与CA中心实现双向身份认证并建立安全连接,随后在线申请数字证书,自主完成安全初始化。该方案可避免生产线安全环境的升级改造,极大地降低企业C-V2X技术引入成本,具有简单有效、安全可靠、兼容性好、成熟度高和扩展性强的特点。  相似文献   

20.
研究了一种简化电力电子装置通讯电路的方案,将控制器和驱动电路之间多路并行信号转化成串行信号,并且在一台单相逆变器上进行了实验验证,使逆变器得到了很好的输出波形.  相似文献   

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