共查询到18条相似文献,搜索用时 109 毫秒
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微电子组装中Sn-Zn系无铅钎料的研究与开发 总被引:6,自引:3,他引:3
无铅钎料的研究开发是我国电子材料行业目前面临的紧迫课题.其中Sn-Zn系无铅钎料具有低的熔点,优良的力学性能,能获得可靠的钎焊接头,且其原材料丰富、价格便宜,有望替代Sn-Pb钎料.但该系钎料易氧化,抗腐蚀性较差,目前还未得到广泛的采用.介绍了开发新型无铅钎料应满足的要求,及几种有潜力的Sn-Zn系无铅钎料. 相似文献
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合金元素对Sn-Zn基无铅钎料高温抗氧化性的影响 总被引:15,自引:12,他引:15
研究了不同微量合金元素对Sn-Zn基无铅钎料高温抗氧化性的影响。钎料在液态下的表面颜色变化以及热重分析表明,Al、Cr能明显改善Sn-Zn基钎料的抗氧化性能。通过俄歇能谱深度剖析和X射线衍射分析探讨了合金元素的抗氧化机理:Al和Cr在钎料表面或亚表面富集,形成阻挡层,抑制了钎料的氧化。比较了合金元素对Sn-Zn基钎料润湿性能的影响,结果表明Al的加入不利于钎料的铺展。通过实验得出结论:Cr是一种比Al更具有吸引力的Sn-Zn基钎料的高温抗氧化合金元素。 相似文献
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Sn-Zn系无铅钎料最新进展 总被引:1,自引:0,他引:1
Sn-Zn系钎料熔点与传统Sn-37Pb钎料十分接近,成本低廉,被研究者所推崇。由于Zn的存在导致Sn-Zn钎料润湿性差及抗氧化性不足,阻碍了该钎料的发展。添加合金元素和纳米颗粒是改善Sn-Zn钎料组织和性能行之有效的方法之一,为国内外研究者所推崇。结合国内外Sn-Zn系无铅钎料最新研究成果,探讨添加微量的合金元素In、Ni、Cr、Ga、Bi、Cu、Al、Ag、稀土元素及纳米颗粒对钎料润湿性、抗氧化性、力学性能、显微组织和界面组织的影响,同时简述有关钎剂对Sn-Zn的影响,并对Sn-Zn系钎料的发展趋势进行分析与展望。 相似文献
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随着国际上禁止含铅钎料使用日期的临近,无铅软钎料的研究开发与推广应用已迫在眉睫。综述了近年来国内外在无铅软钎料领域的研究开发情况,着重介绍了近一两年来的研究成果及应用情况,并指出目前国内对于该领域最值得关注的Sn-Zn与Sn-Ag两个系列无铅钎料的研究相对滞后,应当加快这方面的研究开发与实用化的步伐,争取早日赶上国际水平。 相似文献
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无铅电子封装发展现状 总被引:5,自引:1,他引:4
KatsuakiSuganuma 《电子工业专用设备》2004,33(12):8-14
无铅钎焊方法现已成为环保型电子产品封装中的关键性技术。在几种替代选择的合金中,结合考虑了其他合金如Sn-Zn-Bi熏Sn-Cu熏Sn-Bi-Ag等,确认Sn-Ag-Cu合金族为无铅钎料的首选。通过采用对热力学和结构分析,结合CLAPHAD法等动力学计算方法,已经精确的测出了无铅合金体系的相图。当Sn-Zn蛐Cu体系中形成Cu-Zn化合物时,在大多数无铅钎料蛐Cu的界面处形成Cu6Sn5蛐Cu3Sn层。研究了在固态和钎料中的金属间化合物层的生长动力学熏也考虑到了蠕变和疲劳现象。在无铅钎料的许多未来应用中,需要更多的工作来建立合理的科学基础以推进它们的应用。 相似文献
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本文涵盖了自1995年至2005年所有涉及到无铅钎料的中国专利。报告的钎料范围是用于表面组装技术,有明确限定成分和成分质量比的Sn基无铅钎料(无铅焊料)。报告的主要内容包括无铅钎料专利的申请者情况及申请和授权情况;在申请专利钎料中Sn-Zn系、Sn-Ag系、Sn-Bi系和Sn-Cu系的数量分布情况以及钎料所含元素情况;国外申请者申请和授权情况;制备方法的情况。最后指出了我国的无铅钎料专利领域存在的问题和发展方向。 相似文献
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冷却速率对无铅钎料和焊点质量影响 总被引:1,自引:1,他引:0
阐述了再流焊冷却速率对无铅钎料和焊点质量的影响的研究现状.已有的研究结果表明:冷却速率对于无铅钎料的微观组织、拉伸性能、金属间化合物的形态和尺寸以及焊点中的凝固缺陷等都有显著的影响.选择合适的冷却速率可以提高焊点质量. 相似文献
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Sn-Zn alloys have been considered for use as lead-free solders. Their poor wetting and oxidation resistance properties are
the main obstacles that prevent them from becoming commercially viable solders. The effects of alloying elements, such as
lanthanum, titanium, aluminum, and chromium, on oxidation resistance, wetting properties, and tensile properties of eutectic
Sn-Zn solder are described herein. Results show the addition of alloying Ti, Al, and Cr can improve the oxidation resistance
of Sn-9Zn solder. La, Ti, and Cr do not have much effect on the wetting properties, whereas Al worsens the wetting. Differential
scanning calorimetry investigations reveal the solidus temperature of these solders to be ∼200°C. Addition of Cr improves
ductility while maintaining tensile strength. 相似文献
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从专利角度探讨Sn-Zn无铅焊料研究现状 总被引:1,自引:1,他引:0
无铅焊料的研发及专利权的保护是我国电子行业亟待解决的问题。文中结合中国专利权的特点,描述了世界各国在无铅焊料专利上的竞争以及Sn-Zn无铅焊料的专利申请状况,并据此分析了Sn- Zn无铅焊料的研发及应用状况、专利Sn-Zn无铅焊料的特点以及应用障碍,以期对我国自主知识产权的Sn-Zn无铅焊料的研发及无铅专利保护有所帮助。 相似文献
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Flux development for lead-free solders containing zinc 总被引:1,自引:0,他引:1
New lead-free solders containing zinc are promising candidates to replace near-eutectic tin-lead solders because the solders
melt at lower temperatures than Sn-Ag-base solders. They also possess good mechanical and fatigue properties and are less
expensive. However, the contact angle on copper for Sn-Zn solders is high when fluxes used for Sn-Pb solders are utilized.
A novel approach for flux development to improve wetting of copper surfaces by tin-zinc eutectic solder was developed: tin
containing organic compounds, which decomposes at soldering temperatures and produces metallic tin on surfaces to be soldered
was added to several specially formulated fluxes. This process improves wetting of copper surfaces by molten tin-zinc eutectic
solder. Fluxes were developed that give a contact angle as low as 20°. 相似文献
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The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements 总被引:25,自引:0,他引:25
The Sn-Zn alloys have been considered as lead-free solders. It is well known that their poor properties of wetting and oxidation
resistance are the main problems to prevent them from becoming commercially viable solders. In this paper, trace rare earth
(RE) elements of mainly Ce and La have been used as alloying elements into the Sn-9Zn alloy. The results indicated that with
the RE addition the originally coarse β-Sn grains in the microstructure of the alloy were refined. The tensile strength significantly
increased with only a slight decrease in ductility. The surface tension was decreased, resulting in great improvement in wetting
properties with rosin-based active flux. 相似文献
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无铅焊料在清华大学的研究与发展 总被引:2,自引:0,他引:2
清华大学材料科学与工程系电子材料与封装技术研究室研制了6个系列的无铅焊料:Sn-3.5Ag添加Cu或Bi; Sn-3.5Ag-1.0Cu添加In或Bi; Sn-Ag-Cu-In添加Bi; Sn-Ag-Cu添加Ga; Sn-Zn添加Ga; Sn-Zn添加多种元素。重点介绍了Sn-Zn添加多种元素。对6个系列无铅焊料的研究取得了较好的实验结果,得到比较理想的低温焊料体系,有的合金熔点已非常接近铅锡共晶焊料熔点183℃。 相似文献
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Solder joints used in electronic applications undergo reflow operations. Such operations can affect the solderability, interface
intermetallic layer formation and the resultant solder joint microstructure. These in turn can affect the overall mechanical
behavior of such joints. In this study the effects of reflow on solderability and mechanical properties were studied. Nanoindentation
testing (NIT) was used to obtain mechanical properties from the non-reflow (as-melted) and multiple reflowed solder materials.
These studies were carried out with eutectic Sn-3.5Ag solders, with or without mechanically added Cu or Ag reinforcements,
using Cu substrates. Microstructural analysis was carried out on solder joints made with the same solders using copper substrate. 相似文献