连续光与脉冲光的跨阻电路设计

在连续光和脉冲光的光强检测电路中，使用跨阻放大器（TIA）将输入光电流转换为电压信号输出。对这两种应用的设计原理进行了详细分析和仿真，找出跨阻增益的计算方法，得出连续光的跨阻增益与反馈电阻有关系，而脉冲光的跨阻增益与反馈电容有关系，对实际应用场景提供了理论支撑。     

基于GaAs E/D PHEMT工艺的单片集成光接收芯片

设计并实现了一款适用于广电混合光纤同轴电缆网络(HFC)的高增益单片集成光接收芯片,该芯片主要包括跨阻放大器(TIA)、衰减器(VVA)和输出放大器三部分.跨阻放大器采用差分结构,相较于单端TIA提高了噪声性能,衰减器采用相位相消方式实现信号衰减,输出放大器为芯片补足增益并实现阻抗匹配.使用ADS仿真软件进行电路设计、版图设计、仿真验证,采用GaAs 0.25μm E/D PHEMT工艺进行了流片.测试结果表明,芯片实现了42 dB的最大增益,在0～3V控制电压下,0～28 dB的连续可调增益范围,工作频率为50 MHz～1 GHz,差分输入单端输出,输出负载为75 Ω,芯片面积1 412 μm×1 207 μm,芯片性能符合设计目标.     

一种用于生物信号采集的CMOS全差分前置跨阻放大器设计

针对生物信号微弱、变化范围大等特点设计了一种用于检测微弱电流的全差分跨阻放大器(TIA)电路结构。不同于传统电路的单端输入,该结构采用高增益的全差分两级放大器实现小信号输入及轨到轨输出。基于CSMC 0.18μm CMOS工艺,采用1.8V电源电压对设计的电路进行了仿真,仿真结果表明:TIA输入电流动态范围为100nA^10μA,最大跨阻增益达到104.38dBΩ,-3dB带宽为4MHz,等效输入噪声电流为1.26pA/Hz。对电路进行跨阻动态特性仿真表明,在输入电流为100nA时,输出电压的动态摆幅达到3.24mV,功耗仅为250μW,总谐波失真(THD)为-49.93dB。所设计的高增益、低功耗、宽输入动态范围TIA适用于生物医疗中极微小生物信号的采集,可作为模块电路集成在便携设备中。     

10Gb/s光接收机跨阻前置放大器芯片设计研究

采用0.18 μm BiCMOS工艺设计并实现了一种高增益、低噪声、宽带宽以及大输入动态范围的光接收机跨阻前置放大器.在寄生电容为250 fF的情况下,采用全集成的四级放大电路,合理实现了上述各项参数指标间的折中.测试结果表明:放大器单端跨阻增益为73 dB,-3 dB带宽为7.6 GHz,灵敏度低至-20.44 dBm,功耗为74 mW,最大差分输出电压为200 mV,最大输入饱和光电流峰-峰值为1 mA,等效输入噪声为17.1 pA/√Hz,芯片面积为800 μ.m×950μm.     

一种基于40 nm CMOS工艺的40 Gbit/s低噪声跨阻放大器

采用40 nm CMOS工艺,设计了一个工作在40 Gbit/s数据速率的高速低噪声跨阻放大器(TIA)。为了同时兼顾噪声和带宽性能,创造性提出了一种多级串联跨阻放大器结构。输入级采用基于反相器结构的伪差分跨阻放大器,通过增加反馈电阻来减小输入电流噪声,第二级的前向运放用来抑制后级均衡器的噪声,第三级用连续时间线性均衡器(CTLE)对前级不足的带宽进行补偿,后面的三级限幅放大器(LA)对电压信号进一步放大。限幅放大器利用并联电感峰化技术和负跨导技术来提高带宽和增益。最终,信号由输出驱动器(OD)输出到片外,输出驱动器采用T-COIL技术。仿真结果表明,整条链路可以实现84 dBΩ和63 dBΩ的跨阻增益,带宽分别为31 GHz和34 GHz,输入电流积分噪声(rms)为1.75 μA。     

一种宽输入动态范围跨阻放大器的设计

利用对数放大的增益可变性特点,设计出基于对数放大的跨阻放大器,克服了采用传统AGC调整跨阻的复杂性和低可靠性;同时,避免了采用肖特基二极管箝位方法的工艺局限性,有效扩展了跨阻放大器的输入动态范围。在详细分析跨阻动态特性及温度特性的基础上,分析了电路噪声性能,并进行了仿真验证。试验样片的测试结果进一步证明所提出的方法是有效的。     

一种低噪声大动态范围跨阻放大器的设计

基于CMOS反相器结构跨阻放大器,提出了一种低噪声大动态范围跨阻放大器电路结构。对电路进行跨阻分析和噪声分析,从而指导电路设计。采用XFAB 0.6μm CMOS工艺提供的PDK,在Cadence SpectreS环境下进行电路设计、版图设计、仿真验证等。测试结果表明,该电路静态功耗为112 mW,最大跨阻增益为91.2 kΩ,带宽为146.7 MHz（-端）及168.4 MHz（＋端）,波形失真小。该电路已经运用到光接收机中,性能良好。     

2.5Gb/Scmos光接收机跨阻前置放大器

给出了一种利用0.35μm CMOS工艺实现的2.5Gb/s跨阻前置放大器。此跨阻放大器的增益为59 dB*Ω,3dB带宽为2GHz,2GHz处的等效输入电流噪声为0.8×10-22 A2/Hz。在标准的5V电源电压下,功耗为250mW。PCML单端输出信号电压摆幅为200mVp-p。整个芯片面积为1.0mm×1.1mm。     

一种高增益、大带宽跨阻放大器的设计

作为激光近炸引信中探测与目标识别核心元件的光电探测器,其性能取决于光电二极管和相应的放大电路。针对引信、制导应用对光电探测器的要求,提出一种新型高增益、大带宽跨阻放大器设计。该跨阻放大器由两级放大电路构成,第一级由两个对称的RGC（Regulated Cascode）结构组成,消除光电二极管漏电流对直流工作点影响,隔离光电二极管寄生电容提升工作带宽;第二级放大电路由三个级联的电流复用反相放大器构成,是跨阻放大器的主要增益级;最后以射级跟随器输出,为后续系统提供足够的电压摆幅。 该电路基于SMIC 0.35μm 标准CMOS工艺设计,仿真结果表明：跨阻增益为110.2dBΩ,带宽为46.7MHz,40MHz处的等效输入噪声电流谱密度低至1.09pA/ ,带宽内等效输出噪声电压为5.37mV。测试结果表明,跨阻放大器增益约为109.3 dBΩ,输出电压信号上升时间约为7.8ns,等效输出噪声电压大小为6.03mV,功耗约为10mW,对应芯片面积为1560×810μm2。 关键字：跨阻放大器、高增益、大带宽、RGC、反相放大器     

一种应用于CMUT的高增益低噪声跨阻放大器

设计了一种应用于微电容超声换能器(CMUT)的高增益、低噪声跨阻放大器。采用调节型共源共栅结构作为跨阻放大器的输入级,实现了低输入阻抗、宽频带,有效隔离了CMUT的静态电容和输入寄生电容对带宽的影响。输出级采用两级反相放大器,实现了高增益,提高了带负载能力。基于GF 0.18 μm CMOS工艺,电路采用Cadence Spectre软件进行仿真。结果表明,低频跨阻增益为115.5 dB·Ω,单位增益频率为1.65 GHz,-3 dB带宽为10 MHz,等效输入电流噪声为1.1 pA·Hz-1/2@1 MHz,能满足CMUT工作频率200 kHz~2 MHz的带宽要求和微弱电流信号的检测要求。该电路采用正负3.3 V供电,功耗为98 mW,芯片尺寸为145 μm×115 μm。     

Improved voltage gain of transimpedance amplifier by AlGaAs/InGaAsdoped-channel FET's

AlGaAs/InGaAs doped-channel FET's were investigated, and were utilized for transimpedance (TZ) amplifier circuits. Due to a high current density, a high gain linearity, and high gate breakdown and turn-on voltages of device characteristics, the AlGaAs/InGaAs doped-channel FET is shown to increase the noise margins and voltage gain in a buffered FET logic (BFL) inverter circuit, as compared with the circuit performance built by GaAs MESFET's. This amplifier also improves transimpedance gain, dynamic signal level, and the 3-dB frequency bandwidth. The transimpedance gain-bandwidth product (Z_T ·BW) is 17 GHz·kΩ, which is much higher than in previous published reports     

DC to 40-GHz broad-band amplifiers using AlGaAs/GaAs HBT's

In this paper, we report two types of broad-band amplifiers implemented with AlGaAs/GaAs HBT's. One is a Darlington feedback amplifier and the other is a transimpedance amplifier. In the former circuit, a dc gain of 9.5 dB and a -3-dB bandwidth of 40 GHz were achieved. In the latter circuit, a transimpedance gain of 50 dBΩ and a -3-dB bandwidth of 27 GHz were achieved. To our best knowledge, they are the highest speed in each circuit configuration     

Monolithic GaAs transimpedance amplifiers for fiber-optic receivers

The authors describe the design of transimpedance amplifiers using GaAs MESFET technology. A GaAs transimpedance preamplifier for fiber-optic receivers has been fabricated with two gain stages and an inducer-FET load structure that reduces noise. The two-stage amplifier design provides increased open-loop gain as compared with a single-stage design, and greater closed-loop stability than a three-stage amplifier. An automatic-gain-control (AGC) circuit that varied the value of the feedback resistor was incorporated into the design     

BiCMOS variable gain transimpedance amplifier for automotive applications

A new BiCMOS variable gain transimpedance amplifier with a large area integrated photodiode for automotive applications is presented. Through careful control of the input pole position and the frequency response of the core amplifier, the bandwidth of the transimpedance amplifier varies from 112 to 300 MHz when its gain changes from 14.2 kOmega to 400 Omega. The proposed circuit configuration maintains a high voltage across a common anode photodiode, and its bandwidth in highest gain varies from 121 to 102 MHz over a temperature range of -40 to +140degC. Simulation results in a 0.6 mum Si BiCMOS technology are given. The amplifier consumes 16 mW from a 3.3 V supply.     

A 3 GHz transimpedance OEIC receiver for 1.3-1.55 μm fiber-opticsystems

A high-performance metal-semiconductor-metal high-electron-mobility transistor (MSM-HEMT) transimpedance photoreceiver fabricated using OMCVD-grown InAlAs/InGaAs heterostructures on an InP substrate is discussed. This is the first demonstration of a monolithically integrated receiver amplifier that incorporates a cascode amplifier stage and a Schottky diode level-shifting stage implemented on InP-based optoelectronic integrated circuit (OEIC) photoreceivers. The transimpedance amplifier has an open-loop gain of 5.7 and a bandwidth of 3.0 GHz, which represent the highest gain and the highest speed performance reported for 1.3-1.55-μm-wavelength OEIC receivers     

Bandwidth enhancement of transimpedance amplifier by acapacitive-peaking design

Using a capacitive-peaking (C-peaking) technique to increase the bandwidth of a transimpedance amplifier has been proposed. An analytical model for determining the peaking capacitance in the Butterworth-type transimpedance amplifier design has been derived. Based on this approach, we can design a larger bandwidth of a transimpedance amplifier. The low-frequency transimpedance gain in our fabricated amplifier is 0,95 kΩ, and the 3 dB bandwidth of the transimpedance amplifier is enhanced from 1.1 to 2.3 GHz without sacrificing its low-frequency gain by this C-peaking technique     

应用于10Gb/s光接收机的全差分CMOS跨阻前置电路设计

设计了一种的低成本、低功耗的10 Gb/s光接收机全差跨阻前置放大电路。该电路由跨阻放大器、限幅放大器和输出缓冲电路组成,其可将微弱的光电流信号转换为摆幅为400 mVpp的差分电压信号。该全差分前置放大电路采用0.18 m CMOS工艺进行设计,当光电二极管电容为250 fF时,该光接收机前置放大电路的跨阻增益为92 dB,-3 dB带宽为7.9 GHz,平均等效输入噪声电流谱密度约为23 pA/(0~8 GHz)。该电路采用电源电压为1.8 V时,跨阻放大器功耗为28 mW,限幅放大器功耗为80 mW,输出缓冲器功耗为40 mW,其芯片面积为800 m1 700 m。     

40-GHz transimpedance amplifier with differential outputs using InP-InGaAs heterojunction bipolar transistors

High-gain and high-bandwidth transimpedance amplifiers (TIAs) are required for fiber-optic receiver modules. This paper reports on the design, fabrication, and characterization of a 40-Gb/s TIA for SONET/SDH STS-768/STM-256 applications based on an InP-InGaAs single heterojunction bipolar transistor (SHBT) process developed at Vitesse Semiconductor Corporation (Vitesse Indium Phosphide Release 1 or VIP-1). This amplifier consists of a single-ended input transimpedance pre-amplifier and a differential output post-amplifier. The measured differential transimpedance is 1800 /spl Omega/ with -3-dB bandwidth greater than 40 GHz. The high gain of this circuit eliminates the need for a standalone limiting amplifier between the conventional transimpedance pre-amplifier and the demultiplexer in short-reach applications.     

一种跨阻放大器的设计

文章提出了一种基于调节型共源共栅电路结构（RGC）的跨阻放大器,采用0.5μm的标准互补型金属氧化物半导体（CMOS）工艺进行设计,仿真。测试结果表明,该电路具有69.93dB的跨阻增益,830MHz的-3dB带宽。在输入电流为1μA时,其输出电压的动态摆幅达到4.5mV,在5V电源电压下功耗仅为63.16mW。