Structural, electrical, and optical studies on rapid thermally processed ferroelectric BaTiO3 thin films prepared by metallo-organic solution deposition technique

Polycrystalline BaTiO₃ thin films having the perovskite structure were successfully produced on platinum coated silicon, bare silicon, and fused quartz substrate by the combination of the metallo-organic solution deposition technique and post-deposition rapid thermal annealing treatment. The films exhibited good structural, electrical, and optical properties. The electrical measurements were conducted on metal-ferroelectric-metal (MFM) and metal-ferroelectric-semiconductor (MFS) capacitors. The typical measured small signal dielectric constant and dissipation factor at a frequency of 100 kHz were 255 and 0.025, respectively, and the remanent polarization and coercive field were 2.2 μC cm⁻² and 25 kV cm⁻¹, respectively. The resistivity was found to be in the range 10¹⁰–10¹² Ω·cm, up to an applied electric field of 100 kV cm⁻¹, for films annealed in the temperature range 550–700 °C. The films deposited on bare silicon substrates exhibited good film/substrate interface characteristics. The films deposited on fused quartz were highly transparent. An optical band gap of 3.5 eV and a refractive index of 2.05 (measured at 550 nm) was obtained for polycrystalline BaTiO₃ thin film on fused quartz substrate. The optical dispersion behavior of BaTiO₃ thin films was found to fit the Sellmeir dispersion formula well.     

Al2O3 formation on Si by catalytic chemical vapor deposition

Catalytic chemical vapor deposition (Cat-CVD) has been developed to deposit alumina (Al₂O₃) thin films on silicon (Si) crystals using N₂ bubbled tri-methyl aluminum [Al(CH₃)₃, TMA] and molecular oxygen (O₂) as source species and tungsten wires as a catalyzer. The catalyzer dissociated TMA at approximately 600 °C. The maximum deposition rate was 18 nm min⁻¹ at a catalyzer temperature of 1000 °C and substrate temperature of 800 °C. Metal oxide semiconductor (MOS) diodes were fabricated using gates composed of 32.5-nm-thick alumina film deposited at a substrate temperature of 400 °C. The capacitance measurements resulted in a relative dielectric constant of 7.4, fixed charge density of 1.74×10¹² cm⁻², small hysteresis voltage of 0.12 V, and very few interface trapping charges. The leakage current was 5.01×10⁻⁷ A cm⁻² at a gate bias of 1 V.     

电极与介电层褶皱接触对压电式柔性电子皮肤性能的影响

提出了一种基于压电效应制备柔性电子皮肤的简单方法。为了研究纳米改性对柔性电子皮肤各层性能的影响，首先以纳米SiO₂粒子作为改性体，以聚二甲基硅氧烷(PDMS)作为基体，制备出SiO₂/PDMS复合柔性衬底，解决了在PDMS上磁控溅射沉积电极材料产生裂纹的现象，成功获得能够稳定工作的柔性电极。然后用钛酸钡/碳纳米管/聚二甲基硅氧烷(BaTiO₃/CNTs/PDMS)复合材料作为功能层，制备出一种五层结构的高灵敏性柔性电子皮肤，并找到一种通过改变基板粗糙度的简单方法构建电极与介电层的褶皱接触，进而提升柔性电极的电导率与柔性电子皮肤的压电响应信号。      

硅片上集成高介电调谐率的柱状纳米晶BaTiO3铁电薄膜

钛酸钡(BaTiO₃)具有优异的介电、铁电、压电和热释电等性能, 在微电子机械系统和集成电路领域具有广泛的应用。降低BaTiO₃薄膜的制备温度使其与现有的CMOS-Si工艺兼容, 已成为应用研究和技术开发中亟需解决的问题。本研究引入与BaTiO₃晶格常数相匹配的LaNiO₃作为缓冲层, 以调控其薄膜结晶取向, 在单晶Si(100)基底上450 ℃溅射制备了结构致密的柱状纳米晶BaTiO₃薄膜。研究表明：450 ℃溅射温度在保持连续柱状晶结构和(001)择优取向的前提下, 能获得相对较大的柱状晶粒(平均晶粒直径27 nm), 一定残余应变也有助于其获得了较好的铁电和介电性能。剩余极化强度和最大极化强度分别达到了7和43 μC·cm^-2。该薄膜具有良好的绝缘性, 在 0.8 MV·cm^-1电场下, 漏电流密度仅为10^-5 A·cm^-2。其相对介电常数ε_r展现了优异的频率稳定性：在1 kHz时ε_r为155, 当测试频率升至1 MHz, ε_r仅轻微降低至145。薄膜的介电损耗较小, 约为0.01~0.03 (1 kHz ~ 1 MHz)。通过电容-电压测试, 该薄膜材料展示出高达51%的介电调谐率, 品质因子亦达到17(@1 MHz)。本研究所获得的BaTiO₃薄膜在介电调谐器件中有着良好的应用前景。     

原子层沉积工艺制备催化薄膜厚度对生长碳纳米管阵列的影响

通过原子层沉积(ALD)工艺在硅基底依次沉积氧化铝缓冲层薄膜和氧化铁催化薄膜, 然后利用管式炉进行水辅助化学气相沉积(WACVD)生长垂直碳纳米管阵列(VACNTs)。结果表明: ALD工艺制备的氧化铁薄膜经还原气氛热处理可形成碳纳米管阵列生长所需的纳米催化颗粒; 氧化铁薄膜厚度与纳米催化颗粒大小以及生长出的碳纳米管阵列的结构密切相关。当氧化铁薄膜厚度为1.2 nm时, 生长出的碳纳米管阵列管外径约为10 nm, 管壁层数约为5层, 阵列高度约为400 μm。增大氧化铁薄膜的厚度, 生长出的碳纳米管阵列外径和管壁数增加, 阵列高度降低。实验还在硅基底侧面观察到了VACNTs, 表明ALD工艺可在三维结构上制备催化薄膜用于生长VACNTs。     

TaN薄膜的等离子体增强原子层沉积及其抗Cu扩散性能

使用Ta[N(CH₃)₂]₅和NH₃等离子体作为反物用等离子体增强原子层沉积工艺生长了TaN薄膜,借助原子力显微镜、X射线光电子能谱、四探针和X射线反射等手段研究了薄膜的性能与工艺条件之间的关系。结果表明,TaN薄膜主要由Ta、N和少量的C、O组成。当衬底温度由250℃提高到325℃时Ta与N的原子比由46:41升高到55:35,C的原子分数由6%降低到2%。同时,薄膜的密度由10.9 g/cm³提高到11.6 g/cm³,电阻率由0.18 Ω?cm降低到0.044 Ω?cm。与未退火的薄膜相比,在400℃退火30 min后TaN薄膜的密度平均提高了~0.28 g/cm³,电阻率降低到0.12~0.029 Ω?cm。在250℃生长的3 nm超薄TaN阻挡层在500℃退火30 min后仍保持良好的抗Cu扩散性能。     

Quantitative analysis of tungsten, oxygen and carbon concentrations in the microcrystalline silicon films deposited by hot-wire CVD

In order for hot-wire chemical vapor deposition to compete with the conventional plasma-enhanced chemical vapor deposition technique for the deposition of microcrystalline silicon, a number of key scientific problems should be cleared up. Among these points, the concentration of tungsten (nature of the filament), as well as the concentration of oxygen and carbon (elements issued when vacuum is broken between two runs), should not exceed threshold values, beyond which electronic properties of the films could be degraded, as in the case of monocrystalline silicon. Quantitative chemical analysis of these elements has been carried out using the secondary ion mass spectrometry technique through depth profiles. It has been shown that for a high effective filament surface area (S_f=27 cm²), the W content increases steadily from 5×10¹⁴ to 2×10¹⁸ atoms cm⁻³ when the filament temperature T_f increases from 1500 to 1800 °C. For a fixed T_f, the W content increases with the effective surface area S_f. Thus, considering our reactor geometry, the W content does not exceed the detection limit (5×10¹⁴ atoms cm⁻³) when T_f and S_f are limited to 1600 °C and 4 cm², respectively. For O and C elements, under deposition conditions of high dilution of silane in hydrogen (96%), O and C concentrations approaching 10²⁰ atoms cm⁻³ have been obtained. The introduction of an inner vessel inside the reactor, the addition of a load-lock chamber and a decrease in substrate temperature to 300 °C have led to a drastic decrease in these contents down to 3×10¹⁸ atoms cm⁻³, compatible with the realization of 6% efficiency HWCVD μc-Si:H solar cells.     

BaTiO3陶瓷的低温冷烧结制备及性能研究

近年来, 冷烧结低温制备陶瓷引起了很大关注, 并在BaTiO₃陶瓷的制备上取得了一定进展。为了提高冷烧结BaTiO₃陶瓷性能, 本研究采用水热法制备了分散性好、粒径为100 nm的四方相(晶格参数c/a为1.0085) BaTiO₃粉末。采用0.1 mol/L的乙酸在100 ℃/1 h的条件下对粉末进行水热活化处理。以质量分数10% Ba(OH)₂·8H₂O为熔剂, 在350 MPa、400 ℃/1 h的条件下对粉体进行冷烧结, 最后经600 ℃/0.5 h退火获得了相对密度为96.62%、晶粒尺寸为180 nm, 常温介电(ε_r)为2836, 介电损耗(tanδ)低至0.03的BaTiO₃陶瓷。乙酸处理后高活性粉末表面形成的非晶钛层有效促进了陶瓷的致密化, 抑制了杂相的生成和晶粒长大, 提高了介电性能, 大幅改善了冷烧结BaTiO₃陶瓷出现的介电弥散现象, 从而实现了BaTiO₃陶瓷的低温冷烧结制备。     

核-壳结构界面对纳米Ag掺杂BaTiO3@PDA/P(VDF-HFP)复合膜介电和储能性能影响

为改善聚偏氟乙烯（PVDF）基复合材料界面相容性,提高其电性能,利用聚多巴胺（PDA）成功包覆了纳米钛酸钡（BaTiO₃）,并引入纳米Ag离子制备出具有核-壳结构的Ag镶嵌BaTiO₃@PDA-Ag颗粒。以介电聚合物聚偏氟乙烯-六氟丙烯（P（VDF-HFP））为基体,采用溶液流延法制备了BaTiO₃@PDA-Ag/P（VDF-HFP）复合材料厚膜。利用FTIR和XPS验证了BaTiO₃@PDA-Ag/P（VDF-HFP）复合材料结构和形貌,并用宽频介电频谱仪和铁电测试仪分别比较了PDA包覆前后的不同BaTiO₃含量的BaTiO₃@PDA-Ag/P（VDF-HFP）复合膜在低电场下的介电性能和高电场下的电极化性能。结果表明,BaTiO₃@PDA-Ag质量分数为20wt%的BaTiO₃@PDA-Ag/P（VDF-HFP）复合膜在10 Hz下介电常数（ε_r）达到了25,介电损耗（tanδ）仅为0.1,在175 M·Vm-1电场下电极化强度（D_m）为6.2 μC·cm-2,200 M·Vm-1时储能密度（U_e）达到了6.9 J·cm-3,高于其它界面未处理复合膜。以上结果可为此类介电复合材料界面结构处理和电性能研究提供参考。      

添加BaTiO3的热压烧结Si3N4陶瓷的力学和介电性能

本研究以Al₂O₃和Nd₂O₃为烧结助剂, 采用热压烧结法制备Si₃N₄陶瓷, 系统研究了添加BaTiO₃对Si₃N₄陶瓷力学和介电性能的影响。研究结果表明, 随着BaTiO₃含量的增加, 相对密度、抗弯强度和维氏硬度都随之降低, 而断裂韧性有所升高; 即使添加5wt%~20wt%的BaTiO₃, Si₃N₄陶瓷的抗弯强度依然可以保持在600 MPa以上。Si₃N₄陶瓷的介电常数可以提高到9.26~11.50, 而介电损耗保持在10^-3量级。在Si₃N₄陶瓷中未检测到BaTiO₃结晶相, 可以认为Si₃N₄陶瓷介电常数的提高主要来源于烧结过程中形成的TiN。这些结果有助于拓展Si₃N₄陶瓷的应用领域。     

Preparation of (Ti1−xAlx)N films from mixed alkoxide solutions by plasma CVD

(Ti_1−xAl_x)N films were prepared on a Si wafer at 700°C from toluene solution of alkoxides (titanium tetraetoxide and aluminum tri-butoxide) in an Ar/N₂/H₂ plasma by the thermal plasma chemical vapor deposition (CVD) method. The films were characterized by X-ray diffraction, X-ray photoelectron spectroscopy, scanning electron microscopy, electrical resistivity, and Vickers micro-hardness. Single phase TiN formed at an Al atomic fraction of 0–0.2, with a mixed TiN and AlN phase occurring up to 0.6 and single phase AlN forming above 0.8. The films had relatively sooth surfaces, 0.4 μm thick at an Al atomic fraction of 0.2, and thickened with increasing Al fraction. The atomic concentration of Ti, Al, N, O, and C determined from their respective XPS areas showed that the Ti and Al contents of the films changes with the solution composition in a complementary way. The impurities were about 10 at.% oxygen and carbon. The electrical resistivity was almost unchanged from the value of 10³ μΩ cm at 0–0.6 Al but then suddenly increased to 10⁴ μΩ cm at higher Al contents. The hardness showed a synergic maximum of about 20 GPa at an Al fraction of 0.6–0.8.     

BaTiO3纳米线的制备及其复合物介电和储能性能研究

采用两步水热法合成钛酸钡(BaTiO₃)纳米线, 并以此为填充物, 聚偏氟乙烯六氟丙烯(P(VDF-HFP))为聚合物基体制备介电复合物, 研究不同含量BaTiO₃纳米线对复合物的介电及储能性能的影响。采用X射线衍射仪、扫描电镜、透射电镜、阻抗分析仪和铁电工作站等表征BaTiO₃纳米线及其复合物的物相、微观结构、介电和储能性能。结果表明: BaTiO₃纳米线具有典型的四方相, 且在聚合物基体中具有良好的分散性与相容性。相同频率下, 复合物的介电常数随着BaTiO₃纳米线含量的增加而增加。含量为20vol%的复合物, 在1 kHz频率下其介电常数取得最 大值30.69。含量为5vol%的复合物, 在场强为240 kV/mm时, 获得了最大的储能密度与放电能量密度, 分别为4.89和2.58 J/cm³。     

Enhanced ferroelectric properties of multilayer SrBi2Ta2O9/SrBi2Nb2O9 thin films for NVRAM applications

Ferroelectric SrBi₂Ta₂O₉/SrBi₂Nb₂O₉ (SBT/SBN) multilayer thin films with various stacking periodicity were deposited on Pt/TiO₂/SiO₂/Si substrate by pulsed laser deposition technique. The X-ray diffraction patterns indicated that the perovskite phase was fully formed with polycrystalline structure in all the films. The Raman spectra showed the frequency of the O–Ta–O stretching mode for multilayer and single layer SrBi₂(Ta_0.5Nb_0.5)₂O₉ (SBNT) samples was 827–829 cm⁻¹, which was in between the stretching mode frequency in SBT (813 cm⁻¹) and SBN (834 cm⁻¹) thin films. The dielectric constant was increased from 300 (SBT) to 373 at 100 kHz in the double layer SBT/SBN sample with thickness of each layer being 200 nm. The remanent polarization (2P_r) for this film was obtained 41.7 μC/cm², which is much higher, compared to pure SBT film (19.2 μC/cm²). The coercive field of this double layer film (67 kV/cm) was found to be lower than SBN film (98 kV/cm).     

α籽晶促进低温反应溅射沉积α-Al2O3薄膜

分别使用反应溅射Al+α-Al₂O₃(15% α-Al₂O₃,质量分数)复合靶和在金箔基体表面预植α-Al₂O₃籽晶,促进α-Al₂O₃薄膜的低温沉积。使用扫描电子显微镜(SEM)、掠入射X射线衍射(GIXRD)和能谱仪(EDS)等方法表征薄膜样品的表面形貌、相结构和元素组成。结果表明,在射频反应溅射Al+α-Al₂O₃复合靶、沉积温度为560℃条件下能在Si(100)基体上沉积出化学计量比的单相α-Al₂O₃薄膜;使用射频反应溅射Al靶、沉积温度为500℃条件下能在预植α-Al₂O₃籽晶(籽晶密度为10⁶/cm²)的金箔表面沉积出化学计量比的单相α-Al₂O₃薄膜。两种研究方案的结果均表明,α-Al₂O₃籽晶能促进低温沉积单相α-Al₂O₃薄膜。     

Vertically Oriented Titania Nanotubes Prepared by Anodic Oxidation on Si Substrates

Vertically oriented titania nanotube arrays were fabricated by anodization of titanium film deposited on silicon substrates under different processing conditions. The anodic formation of nanoporous titania on silicon substrate was investigated in aqueous solutions mixed with highly corrosive Na₂SO₄/NaF/citric acid. In the result of the anodization of titanium film deposited at room temperature, a very thin layer of ~70 nm having a worm-like structure was grown on the top of the porous layer. But, in the case of titanium film deposited at 500deg, vertically oriented TiO₂ nanotube arrays were formed. The average tube outer diameter of the nanotube was 74 nm to 100 nm. The longest nanotube of 681 mum was obtained at 15 V and 30 min. The current density transient curve recorded during anodization under a constant voltage showed a typical behavior for self-organized pore formation.     

晶粒尺寸对细晶钛酸钡陶瓷介电、压电和铁电性能的影响

以采用水热法制备的BaTiO₃粉体作为原料, 利用普通烧结法和两步烧结法制备出晶粒尺寸为0.25~10.15 μm的BaTiO₃陶瓷, 研究了晶粒尺寸效应对BaTiO₃陶瓷的介电、压电以及铁电性能的影响。结果表明: BaTiO₃陶瓷的四方相含量随着陶瓷晶粒尺寸的增大而增加; 当晶粒尺寸在1 μm以上时, 室温相对介电常数(ε° )和压电系数(d₃₃)随着晶粒尺寸的减小而增大, 并在晶粒尺寸为1.12 μm时分别达到最大值5628和279 pC/N, 然后两者随着晶粒尺寸的进一步减小而迅速下降。BaTiO₃陶瓷的剩余极化强度P_r随晶粒尺寸的增大而提高, 而矫顽场E_c却呈现出相反的趋势。晶粒尺寸对介电性能和压电性能的影响是由于90°电畴尺寸和晶界数量的变化。晶粒的晶体场和晶粒表面钉扎作用的变化影响了电畴, 进而改变电滞回线。     

Direct liquid injection metal-organic chemical vapor deposition of HfO2 thin films using Hf(dimethylaminoethoxide)4

Hf(OCH₂CH₂NMe₂)₄, [Hf(dmae)₄] (dmae=dimethylaminoethoxide) was synthesized and used as a chemical vapor deposition precursor for depositing Hf oxide (HfO₂). Hf(dmae)₄ is a liquid at room temperature and has a moderate vapor pressure (4.5 Torr at 80 °C). It was found that HfO₂ film could be deposited as low as 150 °C with carbon level not detected by X-ray photoelectron spectroscopy. As deposited film was amorphous but when the deposition temperature was raised to 400 °C, X-ray diffraction pattern showed that the film was polycrystalline with weak peak of monoclinic (020). Scanning electron microscope analysis indicated that the grain size was not significantly changed with the increase of the annealing temperature. Capacitance–voltage measurement showed that with the increase of annealing temperature, the effective dielectric constant was increased, but above 900 °C, the effective dielectric constant was decreased due to the formation of interface oxide. For 500 Å thin film, the dielectric constant of HfO₂ film annealed at 800 °C was 20.1 and the current–voltage measurements showed that the leakage current density of the HfO₂ thin film annealed at 800 °C was 2.2×10⁻⁶ A/cm² at 5 V.     

Mechanical properties of a-C:H and a-C:H/SiOx nanocomposite thin films prepared by ion-assisted plasma-enhanced chemical vapor deposition

a-C:H and a-C:H/SiO_x nanocomposite thin films were deposited on silicon, aluminum and polyimide substrates at 25 °C in an asymmetric 13.56 MHz r.f.-driven plasma reactor under heavy ion bombardment. Fourier transform infrared spectra of the films indicate that the nanocomposite filmsappears to consist of an atomic scale random network of a-C:H and SiO_x. Raman spectroscopy revealed that the sp² carbon fraction in the nanocomposite film was reduced compared with the a-C:H film. The intrinsic stress of both films increased with increasing negative bias voltage (−V_dc) at the substrate. However, the nanocomposite films exhibited lower intrinsic stress compared w with a-C:H-only films. Especially, a thin SiO_x-rich interlayer was very effective in reducing the film stress and enhancing the bonding strength at the interface. The interlayer allowed deposition of thick films of up to 5 μm. Also, the nanocomposite films were stable in 0.1 M NaOH solution and showed good microhardness.     

Effects of argon and oxygen addition to the CH4-H2 feed gas on diamond synthesis by microwave plasma enhanced chemical vapor deposition

In order to investigate the effects of argon and oxygen on diamond synthesis, the behaviors of diamond deposition using microwave plasma chemical vapor deposition method have been studied by varying the concentrations of argon and oxygen in the methane-hydrogen gas mixture. Diamond films were deposited on silicon wafer under the conditions of substrate temperatures: 1073 1173 K, total reaction pressure: 5333 Pa (40 Torr), methane concentrations: 0.5 5.0%, and they were characterized by scanning electron microscopy, Raman spectroscopy and optical emission spectroscopy. The deposition rates of diamond films were enhanced by adding argon into the methane-hydrogen system, but nondiamond carbon phases in the films also increased. It resulted from the increase of hydrocarbon radicals in the plasma. As oxygen was added, the quality of deposited diamond films was improved due to the decrease of C₂ radicals and increase of OH radicals in the plasma. Simultaneous addition of 0.3% oxygen and 20% argon has been able to effectively suppress the formation of nondiamond carbon components and increase the deposition rate of diamond films. It appears that the ionized argon (Ar⁺) and excited argon atoms (Ar*) may activate the various chemical species and promote the reactions between the gas phase species and oxygen in the plasma.     

Microstructures of microcrystalline silicon thin films prepared by hot wire chemical vapor deposition

Undoped hydrogenated microcrystalline silicon (μc-Si:H) thin films were prepared at low temperature by hot wire chemical vapor deposition (HWCVD). Microstructures of the μc-Si:H films with different H₂/SiH₄ ratios and deposition pressures have been characterized by infrared spectroscopy X-ray diffraction (XRD), Raman scattering, Fourier transform (FTIR), cross-sectional transmission electron microscopy (TEM) and small angle X-ray scattering (SAXS). The crystallization of silicon thin film was enhanced by hydrogen dilution and deposition pressure. The TEM result shows the columnar growth of μc-Si:H thin films. An initial microcrystalline Si layer on the glass substrate, instead of the amorphous layer commonly observed in plasma enhanced chemical vapor deposition (PECVD), was observed from TEM and backside incident Raman spectra. The SAXS data indicate an enhancement of the mass density of μc-Si:H films by hydrogen dilution. Finally, combining the FTIR data with the SAXS experiment suggests that the Si---H bonds in μc-Si:H and in polycrystalline Si thin films are located at the grain boundaries.