氮化铝填充三元乙丙橡胶复合材料的导热性能

采用随机顺序添加算法(RSA),应用均匀化理论建立了三维代表体积单元(RVE)模型,数值研究了氮化铝均匀分布与随机分布下三元乙丙橡胶复合材料的导热性能。制备了氮化铝(AlN)/三元乙丙橡胶复合材料,并测试了不同填充量下体系的热导率。将数值模拟得到的热导率与实验结果及理论模型进行对比,结果发现,随着氮化铝填充量的增加,导热网链的形成更加容易,复合材料的热导率随之逐步增大;在相同体积分数下,实验测量值最大;均匀分布时的数值结果与Maxwell模型及Hamilton-Crosser模型结果基本一致;填充粒子在基体中的随机性分布会导致热导率的波动,其平均值要高于均匀分布模拟值;随机分布模型模拟结果更贴近实验测量值,可以用来更好地预测球形颗粒填充复合材料的导热性能。     

多层石墨/硅树脂导热复合材料的制备与性能

以硅树脂为基体材料, 多层石墨为导热填料, 采用旋转搅拌球磨法制备了多层石墨/硅树脂导热复合材料, 研究了填料对多层石墨/硅树脂复合材料热导率、 热膨胀系数(CTE)和热稳定性的影响。结果表明, 多层石墨在硅树脂中分散性良好。多层石墨/硅树脂复合材料的热导率随多层石墨填充量的增加而增大, 填充质量分数为45%时, 热导率达到2.26 W·(m·K)^-1, 超过此值之后热导率开始下降。随着填料的增加, 多层石墨/硅树脂复合材料热膨胀系数减小。与纯硅树脂相比, 多层石墨/硅树脂复合材料热稳定性高。相同填充量下多层石墨/硅树脂比SiC/硅树脂、 AlN/硅树脂的热导率高得多, 这说明径厚比大的片状填料更易形成有效接触和导热网链。     

多层石墨/硅树脂导热复合材料的制备与性能

以硅树脂为基体材料,多层石墨为导热填料,采用旋转搅拌球磨法制备了多层石墨/硅树脂导热复合材料,研究了填料对多层石墨/硅树脂复合材料热导率、热膨胀系数(CTE)和热稳定性的影响.结果表明,多层石墨在硅树脂中分散性良好.多层石墨/硅树脂复合材料的热导率随多层石墨填充量的增加而增大,填充质量分数为45％时,热导率达到2.26W· (m· K)-1,超过此值之后热导率开始下降.随着填料的增加,多层石墨/硅树脂复合材料热膨胀系数减小.与纯硅树脂相比,多层石墨/硅树脂复合材料热稳定性高.相同填充量下多层石墨/硅树脂比SiC/硅树脂、AlN/硅树脂的热导率高得多,这说明径厚比大的片状填料更易形成有效接触和导热网链.     

有机硅基导热硅脂的改性及渗油机理研究

针对目前传统导热硅脂渗油现象严重的问题,以铝粉和银粉为填料制备有机硅基导热硅脂,采用硅烷偶联剂改性粉体、添加聚硅氮烷改性硅油、添加纳米氮化铝粒子3种方法改善导热硅脂的渗油性能,分别测试其在高温加热和热循环实验后的渗油性能。结果表明,3种改性导热硅脂的渗油抑制性能相较市售导热硅脂明显改善,其中添加纳米氮化铝粒子的导热硅脂渗油抑制效果最佳,其分油量为0. 049%(质量分数)。改性导热硅脂经过热循环后,渗油性未发生明显变化。     

低迁移绝缘导热硅脂界面材料的制备及其性能研究

本研究针对航天器界面材料对高导热、绝缘、低迁移特性的要求,基于分子链缠结理论,自制长链烷基改性硅油(AMS)和含氟碳长链改性硅油(FPS)作为基体,以类球状氮化铝和片状氮化硼为导热填料,制得低迁移绝缘导热硅脂界面材料.通过不同粒径填料的粒径复配、发挥不同形貌填料的协同作用、填料表面改性等,导热硅脂的导热性能可达2.51 W/(m·K),其体积电阻为3.1×1015Ω·cm,击穿电压为10.1 kV·mm-1.对以自制改性硅油为基体制得的导热硅脂进行迁移性能测试,同时对基体硅油进行表面张力和接触角测试,结果表明,导热硅脂的迁移特性与基础油在迁移测试板上的接触角具有相关性.通过引入长支链增加硅油分子链缠结、改善基础油在涂覆面上的接触角,可有效降低导热硅脂的迁移.     

氟化石墨改性适配器PTFE层摩擦磨损性能研究

目的研究适配器PTFE层氟化石墨填充改性后的摩擦磨损性能,提高适配器的耐磨性。方法以质量分数为2%,5%,8%,11%的氟化石墨为填料制备PTFE基复合材料,分别在20,40,60,80 r/min的转速下测试试样摩擦因数。通过三维视频显微镜采集试样表面磨损数据,并计算其体积磨损率。扫描电子显微镜(SEM)观察磨痕微观形貌。结果同一转速下,试样的摩擦因数随着氟化石墨质量分数的增加而增大。填充氟化石墨能显著降低试样的体积磨损率,填充物质量分数超过8%后,试样体积磨损率趋于稳定,试样摩擦因数得到明显增大。结论氟化石墨填充PTFE层可显著提高适配器的耐磨性,但质量分数不能超过8%,否则,会造成适配器与运输筒间的摩擦因数增大,增加航天器装填及出筒阻力。     

PEEK与纳米SiO_2填充PTFE复合材料的摩擦磨损性能研究

通过机械共混、冷压成型、烧结的方法制备聚醚醚酮(PEEK)与纳米Si O2颗粒共同填充改性聚四氟乙烯(PTFE)复合材料试样。利用MRH-3型环-块摩擦磨损实验机对不同配方比例的复合材料在不同实验条件下进行摩擦学性能实验。利用扫描电镜对试样磨损后的摩擦表面形貌和钢环表面的转移膜进行观察和分析。结果表明,填充5%PEEK的PTFE复合材料的摩擦系数达到最低值;10%PEEK/PTFE复合材料中添加不同体积比的纳米Si O2填料可以显著地降低材料的体积磨损率,其中5%Nano-Si O2/10%PEEK/PTFE复合材料的体积磨损率最小;载荷和速度的变化对Nano-Si O2/PEEK/PTFE复合材料的摩擦磨损性能的影响显著,而环境温度的变化对该复合材料的摩擦系数与磨损率的影响不明显。     

两种炭材料的载流摩擦磨损性能比较

以两种炭材料作为销试样,用铬青铜作为盘试样,在HST-100摩擦磨损实验机上比较了两种炭材料的载流摩擦磨损性能.结果表明:炭/炭复合材料的载流摩擦磨损性能受速率、载荷和电流的影响较小,而浸金属炭材料的载流摩擦磨损性能受速率、载荷和电流的影响较大.炭/炭复合材料的摩擦因数和磨损率显著低于浸金属炭材料,具有更优的载流摩擦磨损性能.     

多壁碳纳米管/三元乙丙橡胶复合材料的热电效应及其力学性能研究

以经处理过的多壁碳纳米管(MW-CNTs)为导热导电填料、三元乙丙橡胶(EPDM)为基体,采用机械共混法制备了MW-CNTs/EPDM复合材料。研究了碳纳米管填料在低填充量(6%)下对复合材料体积电阻率、热导率、热稳定性及力学性能的影响,并通过扫描电镜观察分析MW-CNTs在复合材料中的分布。结果表明:处理后的MWCNTs在EPDM基质中能形成良好的聚合物填料界面,分散均匀,形成有效的导电导热网链。复合材料的体积电阻率随着MW-CNTs填充量的增加而呈数量级的递减,导热系数随之增加,热稳定性提高,填充后的复合材料具有较好的物理机械性能。     

氮化铝/氮化硼/碳纳米管/硅橡胶复合材料的力致填料取向对导热性能的影响

随着科学技术的发展,电子元器件发热量大幅度增加,因此开发兼具高导热和高绝缘性能材料日益迫切。以甲基乙烯基硅橡胶（SR）为基体,碳纳米管（CNTs）、六方氮化硼（BN）以及氮化铝（AlN）为导热填料,通过机械共混法制备导热复合材料。研究3种导热填料复配对复合材料的导热性能、绝缘性能和力学性能的影响,研究填料取向对复合材料导热性能的影响,研究材料表面温升与加热时间的关系。采用Agari模型预测复合材料的理论热导率。通过热红成像、扫描电子显微镜、X射线衍射分析、热重分析等对复合材料进行表征。结果表明：随着复配导热填料中AlN用量的减少,BN和CNT_S用量的增加,复合材料的热导率逐渐升高;当AlN为80 phr,BN为68 phr,CNTs为2 phr时,复合材料的垂直热导率为1.857 W·m^-1·K^-1,平行热导率为2.853 W·m^-1·K^-1,体积电阻率为2.18×10¹² Ω·cm,拉伸强度达4.3 MPa,复合材料的综合性能较好。     

高热导率Ag-AlN/聚丙烯酸酯导电胶黏剂的制备与性能

分别采用无钯化学镀法和溶液聚合法制备了Ag-AlN和聚丙烯酸酯胶黏剂,并采用超声辅助溶液共混法制备了高热导率Ag-AlN/聚丙烯酸酯导电胶黏剂。采用XRD、EDS和SEM等对Ag-AlN的结构进行分析。结果表明:经过高温和酸性清洗液清洗等处理, AlN表面的杂质被除去,并且在AlN表面形成致密的Al₂O₃层,采用无钯化学镀法制备的Ag-AlN具有优异的电导率和热导率,其电导率由AlN的10-13 S/cm提高到了7.06×102 S/cm,热导率由AlN的170 W/(m·K)提高到了230 W/(m·K)。经过计算, Ag-AlN表面的Ag镀层质量分数约为13%, Ag镀层的厚度约为80 nm。当导电胶黏剂中Ag-AlN填料的质量分数为50%时, Ag-AlN/聚丙烯酸酯导电胶黏剂的电导率为1.9 S/cm,热导率为3.1 W/(m·K)。      

Synergetic effect of thermal conductive properties of epoxy composites containing functionalized multi-walled carbon nanotubes and aluminum nitride

This study investigates the thermal conductivity of epoxy composites containing two hybrid fillers which are multi-walled carbon nanotubes (MWCNTs) and aluminum nitride (AlN). To form a covalent bonds between the fillers and the epoxy resin, poly(glycidyl methacrylate) (PGMA) were grafted onto the surface of nano-sized MWCNTs via free radical polymerization and micro-sized AlN was modified by zirconate coupling agent. Results show that functionalized fillers improve thermal conductivity of epoxy composites, due to the good dispersion and interfacial adhesion, which is confirmed by scanning electron microscope. Furthermore, the hybrid fillers provide synergetic effect on heat conductive networks. The thermal conductivity of epoxy composites containing 25 vol.% modified AlN and 1 vol.% functionalized MWCNTs is 1.21 W/mK, comparable to that of epoxy composites containing 50 vol.% untreated AlN (1.25 W/mK), which can reduce the half quantity of AlN filler used.     

The role of conductive fillers on the rheological behavior and electrical conductivity of multi-functional shear thickening fluids (M-STFs)

Multi-functional shear thickening fluids (M-STFs) with both shear thickening behavior and electrical conductivity have a great potential for usage in a variety of applications ranging from intelligent anti-impact and vibration damping structures to effective electric mechanical platforms. However, the influences of conductive fillers on the rheological behavior and electrical conductivity of M-STFs remained unclear. In this study, the role of conductive fillers including multi-walled carbon nanotubes (MWCNTs), carbon nanofibers (CNFs), and mixtures of MWCNT/CNF was investigated through the response surface methodology (RSM) in the temperature range of 0 °C to 60 °C. The individual and combined effects of filler content, temperature, and type of fillers on the electrical resistance and rheological behavior of M-STFs were studied. The results revealed the significant role of conductive fillers on the rheological properties and electrical conductivity of M-STFs. It is found that the initial viscosity of M-STF increases with increasing the filler content. Moreover, the M-STFs containing CNF exhibits higher electrical conductivity and lower percolation threshold (0.4 wt%). The results of this work provide new insights for the development of novel STF-based systems with multi-functional properties.     

Highly thermally conductive POSS-g-SiCp/UHMWPE composites with excellent dielectric properties and thermal stabilities

Polyhedral oligomeric silsesquioxane grafting thermally conductive silicon carbide particle (POSS-g-SiCp) fillers, are performed to fabricate highly thermally conductive ultra high molecular weight polyethylene (UHMWPE) composites combining with optimal dielectric properties and excellent thermal stabilities, via mechanical ball milling followed by hot-pressing method. The POSS-g-SiCp/UHMWPE composite with 40 wt% POSS-g-SiCp exhibits relative higher thermal conductivity, lower dielectric constant and more excellent thermal stability, the corresponding thermally conductive coefficient of 1.135 W/mK, the dielectric constant of 3.22, and the 5 wt% thermal weight loss temperature of 423 °C, which holds potential for packaging and thermal management in microelectronic devices. Agari’s semi-empirical model fitting reveals POSS-g-SiCp fillers have strong ability to form continuous thermally conductive networks.     

Preparation, Properties and Application of C/C-SiC Composites Fabricated by Warm Compacted-in situ Reaction

Carbon fibre reinforced carbon and SiC dual matrices composites (C/C-SiC) show superior tribological properties, high thermal shock resistance and good abrasive resistance, and they are promising candidates for advanced brake and clutch systems. The microstructure, mechanical properties, friction and wear properties, and application of the C/C-SiC composites fabricated by warm compacted-in situ reaction were introduced. The results indicated that the composites were composed of 50-60 wt pct carbon, 2-10 wt pct residual silicon and 30-40 wt pct silicon carbide. The C/C-SiC brake composites exhibited good mechanical properties. The value of flexural strength and compressive strength could reach 160 and 112 MPa, respectively. The impact strength was about 2.5 kJ·m^-2. The C/C-SiC brake composites showed excellent tribological performance, including high coefficient of friction (0.38), good abrasive resistance (1.10 μm/cycle) and brake steadily on dry condition. The tribological properties on wet condition could be mostly maintained. The silicon carbide matrix in C/C-SiC brake composites improved the wear resistance, and the graphite played the lubrication function, and right volume content of graphite was helpful to forming friction film to reduce the wear rate. These results showed that C/C-SiC composites fabricated by warm compacted-in situ reaction had excellent properties for use as brake materials.     

纳米碳管增强炭/炭复合材料的研究进展

纳米碳管(CNTs)具有独特的结构、优异的力学性能、热稳定性与传导性能,是炭/炭(C/C)复合材料理想的增强体.综述了纳米碳管增强炭/炭(CNTs/C/C)复合材料的制备方法,讨论了该复合材料的微观结构、摩擦学性能和传导性能,并展望了CNTs/C/C复合材料的潜在应用和发展趋势.     

高温导热绝缘涂料

以环氧改性有机硅树脂为基体, 氮化硅、 氧化铝混合填料为导热粒子制备了导热绝缘涂料。研究了涂料力学性能、 热导率、 电绝缘性、 热稳定性等性能。结果表明: 在填料质量分数40％及较佳的氧化铝与氮化硅质量比时, 涂层拉伸强度为8.02MPa, 断裂延伸率为1.27％, 附着力达到572.2N · cm-2, 热导率高达1.25W · (m · K)-1, 介电常数5.7, 体、 表电阻率分别为3×1013Ω · cm与4.3×1013Ω, 可长期在200℃下使用。与不使用导热填料的环氧改性有机硅树脂涂层相比具有较高的传热能力。      

纳米Ag链的制备及其在聚氨酯基柔性导电复合材料中的应用

针对柔性聚合物基导电复合材料的导电性差和柔性差这2个关键问题,分别从导电填料的柔性化及降低填料含量2方面着手,以脱氧核糖核酸（DNA）大分子链作为模板,制备了大小均一、链状排列的柔性纳米Ag链及纳米Ag链填充的聚氨酯基柔性导电复合材料。利用SEM对纳米Ag链/Ag包Cu粉/聚氨酯导电复合材料的界面结构进行了表征,探讨了纳米Ag链/Ag包Cu粉/聚氨酯导电复合材料导电性及柔性的机制。研究发现:保持导电填料总质量分数为76%、纳米Ag链的质量分数为4%时,纳米Ag链/Ag包Cu粉/聚氨酯导电复合材料的电阻率及形变前后的电阻变化比值达到最佳值,分别为2.13×10-4 Ω·cm和3.6;当以纳米Ag链为单一填料时,制得的纳米Ag链/聚氨酯导电复合材料具有优异的柔性;泡沫法制备的纳米Ag链/聚氨酯导电复合材料可以在低填料质量分数时达到更高的导电性,当纳米Ag链质量分数为60%时,方阻为56 Ω/sq,低于共混法制备的填料质量分数为65%时的纳米Ag链/聚氨酯导电复合材料（98 Ω/sq）。      

Mechanical, thermal and electrical properties of aluminum nitride/polyetherimide composites

The mechanical, thermal and electrical properties of modified AlN/polyetherimide (PEI) composites were investigated. It revealed that the surface of AlN modified by silane could effectively increase the adhesion with matrix, which was beneficial for AlN to reinforce the polyetherimide matrix. After silane modification, the AlN showed good dispersion and wetibility in the polyetherimide matrix and imparted excellent mechanical, electrical and thermal properties. The tensile strength, modulus, electrical and thermal stability were improved with the increasing of AlN content. The tensile strength of AlN/PEI composites increased by 27% when 12.6 vol.% AlN was added to neat polyetherimide. The thermal conductivity of the 57.4 vol.% AlN/PEI composites increased three times compared with neat polyetherimide. Test results indicate that the silane grafted AlN incorporated into the polyetehetimide matrix effectively enhance the thermal stability, thermal conductivity and mechanical properties of the polyetherimide composites.