Interaction of infrared radiation with free carriers in mesoporous silicon

Features of absorption and reflection of infrared radiation in the range 500–6000 cm^?1 are investigated; these features are associated with free carriers in the layers of mesoporous Si (porosity, 60–70%) formed in single-crystal p-Si(100) wafers with a hole concentration of N _p ≈10²⁰ cm^?3. It is found that the contribution of free holes to the optical parameters of the samples decreases as the porosity of the material increases and further falls when the samples are naturally oxidized in air. The experimental results are explained in the context of a model based on the Bruggeman effective medium approximation and the Drude classical theory with a correction for additional carrier scattering in silicon residues (nanocrystals). A comparison between the calculated and experimental dependences yields a hole concentration in nanocrystals of N _p ≈10¹⁹ cm^?3 for as-prepared layers and shows a reduction of N _p when they are naturally oxidized.     

CdHgTe heterostructures for new-generation IR photodetectors operating at elevated temperatures

The parameters of multilayer Cd_xHg_1–xTe heterostructures for photodetectors operating at wavelengths of up to 5 μm, grown by molecular-beam epitaxy (MBE) on silicon substrates, are studied. The passivating properties of thin CdTe layers on the surface of these structures are analyzed by measuring the C–V characteristics. The temperature dependences of the minority carrier lifetime in the photoabsorption layer after growth and thermal annealing are investigated. Samples of p ⁺–n-type photodiodes are fabricated by the implantation of arsenic ions into n-type layers, doped with In to a concentration of (1–5) × 10¹⁵ cm^–3. The temperature dependences of the reverse currents are measured at several bias voltages; these currents turn out to be almost two orders of magnitude lower than those for n ⁺–p-type diodes.     

Diffusion of interstitial magnesium in dislocation-free silicon

The diffusion of magnesium impurity in the temperature range T = 600–800°C in dislocation-free single-crystal silicon wafers of p-type conductivity is studied. The surface layer of the wafer doped with magnesium by the ion implantation technique serves as the diffusion source. Implantation is carried out at an ion energy of 150 keV at doses of 5 × 10¹⁴ and 2 × 10¹⁵ cm^–2. The diffusion coefficient of interstitial magnesium donor centers (D _i ) is determined by measuring the depth of the p–n junction, which is formed in the sample due to annealing during the time t at a given T. As a result of the study, the dependence D _i (T) is found for the first time. The data show that the diffusion process occurs mainly by the interstitial mechanism.     

Tensoresistive effect in porous silicon layers with different morphology

The effect of elastic flexural strain on electrical conductivity of porous silicon with different pore morphology and different properties of depletion regions around the pores is studied. Porous layers are formed using anodic electrochemical etching of the p-and n-Si wafers and have a porosity of 5–68%. It is shown that specific features of variations in electrical conductivity of porous silicon under the effect of deformation depend on the structural characteristics of the porous material. In order to explain the results obtained, various physical models of the charge-carrier transport in porous silicon are used.     

ESR studies of nanocrystalline silicon films obtained by pulsed laser ablation of silicon targets

Nanocrystalline silicon films formed using laser ablation of silicon targets were studied using electron spin resonance. The measurements were performed in the X band with modulation of the magnetic field at a frequency of ～100 kHz at temperatures of 300 and 77 K. Two types of spectra were observed. The first type of spectra is related to the high concentration of dangling silicon bonds in Si nanocrystals and SiO_x sheaths of nanocrystals and are inherent in nanocrystalline silicon (nc-Si) films that do not exhibit photoluminescence in the visible region of the spectrum. The second type of spectra is related to the presence of E′ centers, nonbridging oxygen hole centers (NBOHC), and peroxide radicals and is characteristic of films with photoluminescence in the visible region of the spectrum, which indicates that high-barrier SiO₂ layers exist in these films. An increase in the photoluminescence intensity and a decrease in the signal of electron spin resonance were observed in porous nc-Si films exposed to atmospheric air for a long time.     

Carrier drift mobility in porous silicon carbide

The time-of-flight technique was used to determine the drift mobilities of electrons and holes in porous silicon carbide produced by surface anodization of n-type 4H-SiC wafers. The electron and hole mobilities at 300 K in an electric field of 10⁴ V/cm were μ_e=6×10^?3 and μ_h=3×10^?3 cm² V^?1 s^?1, respectively. The low values of the mobilities are accounted for by carrier capture in localized states.     

Effect of the initial doping level on changes in the free-carrier concentration in porous silicon during ammonia adsorption

Infrared spectroscopy is used to investigate the effect of ammonia adsorption on the concentration of equilibrium charge carriers in porous-silicon layers with various initial types of dopants at different concentrations. It is found that ammonia adsorption results in an increase in the number of free electrons in n-type samples up to a level exceeding 10¹⁸ cm^?3. In p-type samples, a nonmonotonic dependence of the charge-carrier concentration on ammonia pressure is observed. The obtained results are accounted for by the appearance of adsorption-induced shallow donor states that, along with the initial-dopant and surface-defect states, specify the charge-carrier type and concentration in the silicon nanocrystals of the porous layer after ammonia adsorption.     

<Emphasis Type="Italic">p</Emphasis><Superscript>+</Superscript>-Si-<Emphasis Type="Italic">n</Emphasis>-CdF<Subscript>2</Subscript> heterojunctions

Boron diffusion and the vapor-phase deposition of silicon layers are used to prepare ultrashallow p⁺-n junctions and p⁺-Si-n-CdF₂ heterostructures on an n-CdF₂ crystal surface. Forward portions of the I–V characteristics of the p⁺-n junctions and p⁺-Si-n-CdF₂ heterojunctions reveal the CdF₂ band gap (7.8 eV), as well as allow the identification of the valence-band structure of cadmium fluoride crystals. Under conditions in which forward bias is applied to the p⁺-Si-n-CdF₂ heterojunctions, electroluminescence spectra are measured for the first time in the visible spectral region.     

Photoelectric properties of ZnO/CuPc/Si structures

n-ZnO:Al/CuPc/n(p)-Si structures were formed using vacuum-evaporation deposition of copper phthalocyanine (CuPc) layers on the surface of n-and p-Si wafers with subsequent magnetron-sputtering deposition of ZnO:Al layers on the CuPc surface. It is shown that the structures obtained exhibit a high photosensitivity (～80 V/W at T=300 K) in the spectral range 1.65–3.3 eV. The rectification factor and photovoltaic effect in these structures are discussed in relation to the properties of silicon substrates. It is concluded that the contact of phthalocyanine with diamond-like semiconductors (e.g., silicon) are promising for application in wide-band high-efficiency photovoltaic converters.     

Structural and Electrical Properties of Ag/<Emphasis Type="Italic">n</Emphasis>-TiO<Subscript>2</Subscript>/<Emphasis Type="Italic">p</Emphasis>-Si/Al Heterostructure Fabricated by Pulsed Laser Deposition Technique

We have investigated the structural and electrical characteristics of the Ag/n-TiO₂/p-Si/Al heterostructure. Thin films of pure TiO₂ were deposited on p-type silicon (100) by optimized pulsed laser ablation with a KrF-excimer laser in an oxygen-controlled environment. X-ray diffraction analysis showed the formation of crystalline TiO₂ film having a tetragonal texture with a strong (210) plane as the preferred direction. High purity aluminium and silver metals were deposited to obtain ohmic contacts on p-Si and n-TiO₂, respectively. The current–voltage (I–V) characteristics of the fabricated heterostructure were studied by using thermionic emission diffusion mechanism over the temperature range of 80–300 K. Parameters such as barrier height and ideality factor were derived from the measured I–V data of the heterostructure. The detailed analysis of I–V measurements revealed good rectifying behavior in the inhomogeneous Ag/n-TiO₂/p-Si(100)/Al heterostructure. The variations of barrier height and ideality factor with temperature and the non-linearity of the activation energy plot confirmed that barrier heights at the interface follow Gaussian distributions. The value of Richardson’s constant was found to be 6.73 × 10⁵ Am^?2 K^?2, which is of the order of the theoretical value 3.2 × 10⁵ Am^?2 K^?2. The capacitance–voltage (C–V) measurements of the heterostructure were investigated as a function of temperature. The frequency dependence (Mott–Schottky plot) of the C–V characteristics was also studied. These measurements indicate the occurrence of a built-in barrier and impurity concentration in TiO₂ film. The optical studies were also performed using a UV–Vis spectrophotometer. The optical band gap energy of TiO₂ films was found to be 3.60 eV.     

Effects of predoping and implantation conditions on diffusion of silicon in gallium arsenide subjected to electron-beam annealing

Measurements of capacitance-voltage characteristics and Rutherford backscattering were used to study the parameters of silicon diffusion from preliminarily formed n-type layers into semi-insulating GaAs under electron-beam annealing and conventional heat treatment. The layers were doped with either sulfur or silicon. The degree of ²⁸Si electrical activation and ²⁸Si diffusion coefficient are found to depend on the dopant used to form the n-type layer and on the implantation conditions (continuous or pulsed-repetitive, with a pulse width of 1.3×10^?2 s and duty factor of 100).     

Iodine Doping of CdTe and CdMgTe for Photovoltaic Applications

Iodine-doped CdTe and Cd_1?x Mg _x Te layers were grown by molecular beam epitaxy. Secondary ion mass spectrometry characterization was used to measure dopant concentration, while Hall measurement was used for determining carrier concentration. Photoluminescence intensity and time-resolved photoluminescence techniques were used for optical characterization. Maximum n-type carrier concentrations of 7.4 × 10¹⁸ cm^?3 for CdTe and 3 × 10¹⁷ cm^?3 for Cd_0.65Mg_0.35Te were achieved. Studies suggest that electrically active doping with iodine is limited with dopant concentration much above these values. Dopant activation of about 80% was observed in most of the CdTe samples. The estimated activation energy is about 6 meV for CdTe and the value for Cd_0.65Mg_0.35Te is about 58 meV. Iodine-doped samples exhibit long lifetimes with no evidence of photoluminescence degradation with doping as high as 2 × 10¹⁸ cm^?3, while indium shows substantial non-radiative recombination at carrier concentrations above 5 × 10¹⁶ cm^?3. Iodine was shown to be thermally stable in CdTe at temperatures up to 600°C. Results suggest iodine may be a preferred n-type dopant compared to indium in achieving heavily doped n-type CdTe.     

Leakage currents over the Surface of CdHgTe-based photodiodes

The leakage current I _p over the surface of Cd_xHg_1−x Te-based photodiodes that have a cutoff wavelength of the photosensitivity spectrum of λ=9.8–11.6 μm and are fabricated by implanting Zn⁺⁺ ions into the p-type solid solution is investigated. The surface character of the I _p current is indicated by a coordinate shift of the peak in the sensitivity profile of n ⁺-p junctions, which is measured in a scanning mode by the beam of a CO₂ laser with a wavelength of 10.6 μm, with an increase in voltage U across the photodiode and the shift of spectral characteristics to shorter wavelengths with increasing U. __________ Translated from Fizika i Tekhnika Poluprovodnikov, Vol. 38, No. 7, 2004, pp. 890–895. Original Russian Text Copyright ? 2004 by Biryulin, Turinov, Yakimov.     

Optical and electrical properties of thin wafers fabricated from nanocrystalline silicon powder

The infrared transmittance spectra and dark conductivity of wafers fabricated from nanocrystalline silicon powder (nc-Si) have been studied. The initial nc-Si powder is first synthesized by laser-induced silane dissociation, with the temperature of the surrounding buffer gas varied from 20 to 250°C, and then compacted at pressures from 10⁸ to 10⁹ Pa. It is found that compaction of the nc-Si powder results in formation of Si-H, Si-CH_x, and O_y-Si-H_x structures (x, y=1–3). The formed structures break down under annealing, with the Si-H and Si-CH_x complexes disintegrating at the lowest annealing temperature (t = 160°C). The dark conductivityof the nc-Si wafers is shown to increase along with the buffer gas temperature at which the starting powder was prepared. Two temperature regions are found in which the dark conductivity behaves in radically different ways. At wafer temperatures T ≥ 270 K, conductivity is mediated by free carriers, whereas, at lower temperatures, electron transport is governed by hopping conduction over localized states in the band gap.     

Radiation-induced bistable centers with deep levels in silicon <Emphasis Type="Italic">n</Emphasis> <Superscript>+</Superscript>–<Emphasis Type="Italic">p</Emphasis> structures

The method of deep level transient spectroscopy is used to study electrically active defects in p-type silicon crystals irradiated with MeV electrons and α particles. A new radiation-induced defect with the properties of bistable centers is determined and studied. After keeping the irradiated samples at room temperature for a long time or after their short-time annealing at T ～ 370 K, this defect does not display any electrical activity in p-type silicon. However, as a result of the subsequent injection of minority charge carriers, this center transforms into the metastable configuration with deep levels located at E_V + 0.45 and E_V + 0.54 eV. The reverse transition to the main configuration occurs in the temperature range of 50–100°C and is characterized by the activation energy ～1.25 eV and a frequency factor of ～5 × 10¹⁵ s^–1. The determined defect is thermally stable at temperatures as high as T ～ 450 K. It is assumed that this defect can either be a complex of an intrinsic interstitial silicon atom with an interstitial carbon atom or a complex consisting of an intrinsic interstitial silicon atom with an interstitial boron atom.     

Dielectric waveguide for middle and far infrared radiation

The possibility of using the normal skin effect in dielectric waveguides for long-wavelength radiation is analyzed. A design of a waveguide integrated with a heterolaser is suggested, in which an undoped layer of GaAs is clad between heavily-doped n- and p-Al _x Ga_{1 ? x} As alloy layers, reflecting radiation because of the normal skin effect. It is shown that an efficient waveguide can be formed using n-Al _x Ga_{1 ? x} As layers with x < 0.45 and the electron concentration N > 5 × 10¹⁸ cm^?3 and p-Al _x Ga_{1 ? x} As layers of any composition with the hole concentration P ≥ 3 × 1019 cm^?3.     

Conductivity of Ga<Subscript>2</Subscript>O<Subscript>3</Subscript>–GaAs Heterojunctions

The effect of annealing in argon at temperatures of T_an = 700–900°C on the I–V characteristics of metal–Ga₂O₃–GaAs structures is investigated. Samples are prepared by the thermal deposition of Ga₂O₃ powder onto GaAs wafers with a donor concentration of N _d = 2 × 10¹⁶ cm^–3. To measure theI–V characteristics, V/Ni metal electrodes are deposited: the upper electrode (gate) is formed on the Ga₂O₃ film through masks with an area of S _k = 1.04 × 10^–2 cm² and the lower electrode in the form of a continuous metallic film is deposited onto GaAs. After annealing in argon at T_an ≥ 700°C, the Ga₂O₃-n-GaAs structures acquire the properties of isotype n-heterojunctions. It is demonstrated that the conductivity of the structures at positive gate potentials is determined by the thermionic emission from GaAs to Ga₂O₃. Under negative biases, current growth with an increase in the voltage and temperature is caused by field-assisted thermal emission in gallium arsenide. In the range of high electric fields, electron phonon-assisted tunneling through the top of the potential barrier is dominant. High-temperature annealing does not change the electron density in the oxide film, but affects the energy density of surface states at the GaAs–Ga₂O₃ interface.     

High-voltage (900 V) 4 <Emphasis Type="Italic">H</Emphasis>-SiC Schottky diodes with a boron-implanted guard <Emphasis Type="Italic">p-n</Emphasis> junction

High-voltage (900 V) 4H-SiC Schottky diodes terminated with a guard p-n junction were fabricated and studied. The guard p-n junction was formed by room-temperature boron implantation with subsequent high-temperature annealing. Due to transient enhanced boron diffusion during annealing, the depth of the guard p-n junction was equal to about 1.7 μm, which is larger by approximately 1 μm than the projected range of 11 B ions in 4H-SiC. The maximum reverse voltage of fabricated 4H-SiC Schottky diodes is found to be limited by avalanche breakdown of the planar p-n junction; the value of the breakdown voltage (910 V) is close to theoretical estimate in the case of the impurity concentration N = 2.5 × 10¹⁵ cm^?3 in the n-type layer, thickness of the n-type layer d = 12.5 μm, and depth of the p-n junction r _j = 1.7 μm. The on-state diode resistance (3.7 mΩ cm²) is controlled by the resistance of the epitaxial n-type layer. The recovery charge of about 1.3 nC is equal to the charge of majority charge carriers that are swept out of an epitaxial n-type layer under the effect of a reverse voltage.     

Electrical properties of Si:H/<Emphasis Type="Italic">p</Emphasis>-Si structures fabricated by hydrogen implantation

Hydrogenated silicon (Si:H) layers and Si:H/p-Si heterostructures were produced by multiple-energy (3–24 keV) high-dose (5×10¹⁶–3×10¹⁷ cm^?2) hydrogen implantation into p-Si wafers. After implantation, current transport across the structures is controlled by the Poole-Frenkel mechanism, with the energy of the dominating emission center equal to E _c ?0.89 eV. The maximum photosensitivity is observed for structures implanted with 3.2×10¹⁷ cm^?2 of hydrogen and annealed in the temperature range of 250–300°C. The band gap of the Si:H layer E _g ≈2.4 eV, and the dielectric constant ?≈3.2. The density of states near the Fermi level is (1–2)×10¹⁷ cm^?3 eV^?1.     

Increase in the rate and discretization of the kinetics of isothermal surface generation of minority charge carriers in metal-insulator-semiconductor structures with a planar-inhomogeneous insulator

Surface generation of minority charge carriers in silicon metal-oxide-semiconductor (MOS) structures is efficient only at the initial recombinationless stage. Quasi-equilibrium between surface generation centers and the minority-carrier band is established in a time t ～ 10^?5 s. In the absence of other carrier generation channels, an equilibrium inversion state at 300 K would need t = t_∞ > 10³ years to become established. In fact, the time t ∞ is much shorter, due to excess-carrier generation via centers located at the SiO₂/Si interface over the gate periphery. This edge-related generation can easily be simulated in an MOS structure with a single gate insulated from Si by oxide layers of various thicknesses. At gate depleting voltages V _g , the role of the periphery is played by a shallow potential well under a thicker oxide, and the current-generation kinetics becomes unconventional: two discrete steps are observed in the dependences I(t), and the duration and height of these steps depend on V _g . An analysis of the I(t) curves allows determination of the electric characteristics of the Si surface in the states of initial depletion (t = 0) and equilibrium inversion (t = t_∞), as well as the parameters of surface lag centers, including their energy and spatial distributions. The functionally specialized planar inhomogeneity of a gate insulator is a promising basis for dynamic sensors with integrating and threshold properties.