Microstructure evolution and thermal physical properties of CuCr alloy after high pressure treatment

The thermal diffusion coefficient, thermal conductivity, and thermal expansion coefficient of CuCr alloy prepared by infiltration were measured by thermal constant tester and dilatometer before and after high pressure heat treatment, at the same time, the effect of high pressure treatment on the thermal physical properties of CuCr alloy was discussed by the analysis of its microstructure. The experimental results show that high pressure heat treatment can increase the thermal diffusion coefficient and thermal conductivity of CuCr alloy, but it changes slightly in the pressure range of 1–6 GPa. As for thermal expansion coefficient, when the temperature is higher than 130 °C, it is obviously higher than that of the alloy without high pressure treatment after 1 GPa pressure treatment, and the higher the temperature is, the larger their differences are.     

Reactions between Ti and Ti_3SiC_2 in temperature range of 1 273-1573K

1Introduction Recently,the layered ternary carbide Ti3SiC2has attracted attention due to its unique properties such as high toughness,high fatigue-crack growth threshold and elastic modulus,plasticity at high temperature,excellent electrical and thermal c…     

Thermal Shock Property of Al/Ni-ZrO_2 Gradient Thennal Barrier Coatings

THERMAL BARRIER COATINGS can holdbackintrusion of high temperature,high heat to increaseapplied temperature and life of substrate metal parts,and have been applied on heat position of rocket,satellite,aero engine and gas engine"31.But thermalstresses are produced during thermal shock due tomismatch of thermal properties between ceramiccoatings and substrate metal,therefore thermal shockproperties of coatings are very poor.Gradient thermalbarrier coatings make materials gradually chang…     

Microstructure and graphitization behavior of diamond/SiC composites fabricated by vacuum vapor reactive infiltration

To inhibit the graphitization of diamond under high temperature and low pressure, diamond/Si C composites were firstly fabricated by a rapid gaseous Si vacuum reactive infiltration process. The microstructure and graphitization behavior of diamond in the composites under various infiltration temperatures and holding time were investigated. The thermal conductivity of the resultant materials was discussed. The results show that the diamond-to-graphite transition is effectively inhibited at temperature of as high as 1600 °C under vacuum, and the substantial graphitization starts at 1700 °C. The microstructure of those ungraphitized samples is uniform and fully densified. The inhibition mechanisms of graphitization include the isolation of the catalysts from diamond by a series of protective layers, high pressure stress applied on diamond by the reaction-bonded Si C, and the moderate gas–solid reaction. For the graphitized samples, the boundary between diamond and Si C is coarse and loose.The graphitization mechanism is considered to be an initial detachment of the bilayers from the diamond surfaces, and subsequently flattening to form graphite. The ungraphitized samples present higher thermal conductivity of about 410 W·m~(-1)·K~(-1)due to the fine interfacial structure. For the graphitized samples, the thermal conductivity decreases significantly to 285 W·m~(-1)·K~(-1)as a result of high interfacial thermal resistance.     

STUDY ON THE SiC_p./Al-ALLOY COMPOSITE AUTOMOTIVE BRAKE ROTORS

1. IntroductionThe SiC particulate reinforced aluminum matrix composites (AMC) have sucll characteristics as high specific stiffness and strength, high wear resistance, high thermal condllctivity, and lightweight etc. Using such lightweight material, as aluminum matrix compositein brake systems is one of the ways to reduce unsprung weight of motor vehicles. Thetribological and wear behavior of the aluminum matrix composite have been reported bydifferent ...ea.chers[1--4], and AMC brake roto…     

Finite element analysis of stresses and interface crack in TBC systems

Thermal barrier coatings have been used on high temperature components. Due to high stresses leading to unpredictable failure, a transient thermal-structural finite element solution was employed to analyze the stress distribution and J-integral at the interface between the bond coating and thermally growing oxide(TGO) in the EB-PVD thermal barrier coatings subjected to thermal loadings. The effects of some environmental and material parameters were studied, such as thermal convection coefficient, ceramic elastic modulus and TGO thickness. The results show that the stresses and J-integral values are impacted by these parameters.     

Synthesis of TiB2 nanocrystalline powder by mechanical alloying

1 Introduction TiB2 has been widely used in some industrial fields owing to its high melting temperature, hardness, elastic modulus, electro-conductibility and thermal diffusivity, and excellent refractory properties and chemical inertness. Usually, TiB2…     

Effect of powder mixing process on the microstructure and thermal conductivity of Al/diamond composites fabricated by spark plasma sintering

Two powder mixing processes, mechanical mixing (MM) and mechanical alloying (MA), were used to prepare mixed Al/diamond powders, which were subsequently consolidated using spark plasma sintering (SPS) to produce bulk Al/diamond composites. The effects of the powder mixing process on the morphologies of the mixed powders, the microstructure and the thermal conductivity of the composites were investigated. The results show that the powder mixing process can significantly affect the microstructure and the thermal conductivity of the composites. Agglomerations of the particles occurred in mixed powders using MM for 30 min, which led to high pore content and weak interfacial bonding in the composites and resulted in low relative density and low thermal conductivity for the composites. Mixed powders of homogeneous distribution of diamond particles could be obtained using MA for 10 min and MM for 2 h. The composite prepared through MA indicated a high relative density but low thermal conductivity due to its defects, such as damaged particles, Fe impurity, and local interfacial debonding, which were mainly introduced in the MA process. In contrast, the composite made by MM for 2 h demonstrated high relative density and an excellent thermal conductivity of 325 W·m-1·K-1, owing to its having few defects and strong interfacial bonding.     

Reliability of laser flash thermal diffusivity measurements of the thermal barrier coatings

The thermal diffusivity of free standing thermal barrier coatings (TBCs) was measured by the laser flash technique. The combination of low thermal conductivity (1 to 2 W/m K) and small TBC thickness (300 to 600 μm thick) can cause errors in the measurements. Back surface (opposite the laser) temperatures of free standing plasma-sprayed TBCs were measured as a function of time and laser power. The front surface temperatures were calculated using thermal transport equations. In the high power region, thermal diffusivity decreased significantly with increasing laser power. In the moderate power region, thermal diffusivity remained constant. In the low power region, measurement became unreliable because of noise. The detector nonlinearity was believed to be a possible cause of deviation in the high power region. Measurements at different laser power levels should be conducted in order to obtain reliable thermal diffusivity values for TBCs.     

Variation of hydrogen level in magnesium alloy melt

M agnesium alloy is one of the lightest metals used in industry. It offers numerous merits in physical, mechanical and casting properties: high specific strength and stiffness, good castability suitable for high pressure die casting, low density, high damping capacity, good thermal and electrical conductivity etc. [1] However, microporosity in the castings reduces mechanical properties [2-4] such as ultimate strength, yield strength, ductility and fatigue resistance. There are mainly two viewp…     

溶胶-凝胶法制备纳米MoCu复合粉体

以硝酸铜和二钼酸铵为原料，采用溶胶-凝胶法制备了纳米MoCu复合粉体，研究了热处理工艺，溶液pH值，添加剂等对纳米粒子形貌及粒径的影响。结果表明，在600℃热处理的钼铜氧化物通过氢气还原之后可以得到粒径小于60nm的纳米MoCu复合粉体；溶液中添加剂的用量影响微粒的粒径，当添加剂用量K为0．5时，能得到尺寸较小，粒度均匀的纳米粉体；不同酸度条件下所得粉体的粒径各不相同，当pH值在1～4之间变化时粒径随pH值的增大而增大，pH值取1较合适。     

WCu复合粉体的溶胶-凝胶制备及其还原行为研究

以偏钨酸铵和硝酸铜为原料,柠檬酸为络合剂的溶胶-凝胶法制备WCu复合粉体。利用XRD和TEM对还原前后粉末的物相组成﹑形貌﹑粒度进行分析。TEM显示还原后WCu粉末粒度在100 nm左右,Cu相均匀包覆在W颗粒表面。对氧化物粉体的还原性能和机理进行了系统的分析。程序升温还原(TPR)确定了氧化物粉体最佳的两步还原温度分别为500和700 ℃。红外光谱(FT-IR)分析表明,铜通过氧与钨键合,削弱W-O-W键,使得钨铜复合氧化物还原性增强。     

氢还原法制备Mo60Cu40纳米复合粉

以(NH4)6Mo7O24·2H2O和CuSO4·5H2O(Mo:Cu=60:40,质量比,下同)为原料,采用化学共沉淀制备Mo-Cu复合氧化物粉末,再经过氢还原得到Mo-Cu复合物纳米粉末。结果表明:化学共沉淀的条件是反应温度为(50±5)°C,pH值为(5.1±0.1),陈化时间为(8±1)h;Mo-Cu复合氧化物粉末粒度为20nm;氢还原温度为650°C,Mo-Cu复合物纳米粉末粒度小于100nm。     

SDS／Vc／H2O微乳液中纳米金的合成

在SDS／Vc／H2O微乳液中用0．001mol·L^-1HAuCl4溶液代替组分水，以Vc作还原剂制备纳米金。紫外一可见光谱和扫描电镜实验结果表明，所制备的金纳米粒子的粒径在5-20nm之间；在固定SDS／Vc的质量比为50／50条件下，粒子的粒径随微乳液中HAuCl4（aq）含量的增加而增加。初步探讨了在SDS／Vc／H2O微乳液中合成纳米金的机制。     

Preparation of Sn-doped In2O3 nanopowders by a solvothermal process

Sn-doped In2O3 (ITO) nanopowders in square shape were prepared in ethylene solvent by a solvothermal process,using In (4N) and SnCl4·5H2O as starting materials.The effects of solvothermal temperature and coprecipitation pH on the products were investigated using XRD,XPS,and TEM.Mixtures of InOOH crystals and In4Sn3O12 crystals were prepared at 210℃ or 230℃ and ITO nanopowders with cubic structure were obtained at 250℃ or above 250℃.When the coprecipitation pH was 6,the product was ITO with impurity Sn3O4- When the pH was 9,the product was single phase ITO.     

Preparation of colloidal Sb_2O_5 and its stability

1　INTRODUCTIONColloidalantimony pentoxideisanewinorganicflameretardant .Itcanbeusedinrubber,plastics,fiber ,textile ,carpet,paint ,paperandprintedcircuitboardbe causeofitsflameretardingabilityandotherexcellentpropertiessuchashighdispersion ,lowcoloringintensityandhighheat stability[15] .Althoughmoreandmoreap plicationsofcolloidalantimonypentoxidearefoundintheindustry,therearelackofdetailedstudiesonprepara tionandstabilityofcolloidalantimonypentoxideex ceptsomepatentsabouttechnologicalproc…     

Cr-Al2O3纳米复合电沉积的研究

采用单因素实验方法探讨了电流密度、温度、pH值、搅拌速度对电沉积Cr-Al2O3纳米复合镀的影响;并用L9(34)正交实验方法,确定了主络合剂、辅助络合剂、分散剂、AlCl3.6H2O对纳米复合镀层外观、厚度以及纳米氧化铝含量的影响,确定了最佳镀液配方,并利用扫描电镜、能谱仪和硬度测试仪测试了所得镀层的形貌和性能。结果表明:在最佳工艺条件下,以主络合剂18.9g/L,辅助络合剂3.85g/L,分散剂质量分数2%,结晶氯化铝12g/L所得的镀层厚度可达到13.93μm,纳米氧化铝的质量分数平均可达到10.90%,镀层的显微硬度可达到867.9HV。     

Corrosion resistance of electrodeposited RE-Ni-W-P-SiC composite coating

1　ＩＮＴＲＯＤＵＣＴＩＯＮＭａｋｉｎｇｕｓｅｏｆｃｏｍｐｏｓｉｔｅｍａｔｅｒｉａｌｓｉｓｔｈｅｄｅｖｅｌ ｏｐｉｎｇｔｒｅｎｄｉｎｔｈｅｃｕｒｒｅｎｔｍａｔｅｒｉａｌｓｓｃｉｅｎｃｅ .Ｉｔｍｅａｎｓｏｂｔａｉｎｉｎｇａｎｅｗｃｏｍｐｏｓｉｔｅｍａｔｅｒｉａｌｂｙｃｏｍｂｉｎｉｎｇｔｈｅｂｅｓｔｐｒｏｐｅｒｔｉｅｓｏｆｓｅｖｅｒａｌｄｉｆｆｅｒｅｎｔｍａｔｅｒｉａｌｓｓｏａｓｔｏｍｅｅｔｐｅｏｐｌｅ’ｓｄｅｍａｎｄｓ .Ｃｏｍｐｏｓｉｔｅｅｌｅｃｔｒｏｐｌａｔｉｎｇｉｓｏｎｅｏｆｔｈｅｍｏｓｔｕｓｅ…     

Behavior of porosity and copper oxidation in W/Cu composite produced by plasma spray

A spherical tungsten (W)/copper (Cu) composite powder was plasma-sprayed onto a boron-nitride-coated graphite substrate to produce heat sink material for the electronic packaging by atmospheric plasma spray using different input powers. At the surface of the deposited layer, Cu became oxidized to cuprite (Cu₂O). The degree of oxidation at the surface layer did not vary significantly with input power. Very little Cu₂O was detected at the inner layers after grinding off the 70 μm from the surface. The input powers had a strong effect on the porosity in the deposit layers. The porosity in the deposit layers at 25 kW was very small, about 3 vol%. The microstructures of W/Cu composite were discussed.     

单分散近球形和片状金粉的制备及表征

以HAuCl4·4H2O为前驱体,抗坏血酸(VC)为还原剂,线性聚乙烯亚胺(L-PEI)为表面活性剂在水相中制备了单分散的近球形和片状金粉.采用SEM、XRD和激光粒度分析仪对金粉的形貌、粒径、结晶和分散性进行了测试和表征.研究了还原剂和金前驱体的摩尔比、L-PEI浓度、温度及反应溶液的pH对近球形和片状金粉的形貌和粒径大小的影响.给出了制备微米级近球形和片状金粉的反应条件,同时也提出了近球形和片状金粉的成核和晶核生长的可能解释.