Enhanced thermal conductivity and mechanical properties of hybrid MoS2/h‐BN polyurethane nanocomposites

Nanocomposites based on molybdenum disulfide (MoS₂), hexagonal boron nitride (h‐BN) and hybrid MoS₂/h‐BN nanofillers with different wt % in elastomeric polyurethane (PU) were studied with respect to their microstructure, thermal and mechanical properties. Tensile tests showed increases up to 80% in Young`s modulus for both h‐BN and hybrid MoS₂/h‐BN composites. These results agree with dynamic mechanical analysis tests, which confirm an increase of up to 106% in storage modulus for hybrid MoS₂/h‐BN with 0.5 wt % content. When the hybrid MoS₂/h‐BN nanofillers were incorporated into the polymeric matrix, increases up to 102% in crosslink density were observed, indicating that strong interactions between the hybrid nanofillers and PU were established. However, the most important synergistic effect between the mixture of MoS₂ and h‐BN nanoadditives was the increase of up to 752% in thermal conductivity with respect to neat polymer. Therefore, hybrid composites based in two‐dimensional MoS₂/h‐BN nanofillers with multifunctional attributes can be applied in advanced polymeric materials that require high mechanical and thermal performance. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 46560.     

The effect of boron nitride nanosheets on the mechanical and thermal properties of aluminum nitride ceramics

The boron nitride nanosheets (BNNSs)/aluminum nitride (AlN) composites were prepared by hot press sintering at 1600°C. The microstructure, mechanical properties, and thermal conductivity of the samples were measured, and the effect of adding BNNSs to AlN ceramics on the properties was studied. It is found that the addition of BNNSs can effectively improve the mechanical properties of AlN. When the additional amount is 1 wt%, the bending strength of the sample reaches the maximum value of 456.6 MPa, which is 23.1% higher than that of the AlN sample without BNNSs. The fracture toughness of the sample is 4.47 MPa m^1/2, a 68.7% improvement over the sample without BNNSs. The composites obtained in the experiment have brilliant mechanical properties.     

氮化硼纳米片改性复合材料导热性能的研究进展

氮化硼纳米片（BNNSs）是一种二维片状纳米材料，具有较高的导热性和热稳定性。将其作为填料加入聚合物中，可显著提高复合材料的导热性能。本文基于近年来对BNNSs改性复合材料的导热性能的研究进展，总结了BNNSs制备和改性的方法以及建立导热路径的方法，介绍了该体系复合材料的导热机理，分析了影响复合材料导热性能的因素，最后对提高复合材料的导热性能进行了展望。     

Noncovalent functionalization of boron nitride and its effect on the thermal conductivity of polycarbonate composites

Polycarbonate (PC) is an engineering thermoplastic with excellent insulation and mechanical properties. However, the low thermal conductivity restricted its application in electronic devices. Hexagonal boron nitride (h ‐BN) microparticle, a promising material with high thermal conductivity, was functionalized with cationic polyacrylamide (CPAM) and introduced into PC matrix to improve the thermal conductivity. SEM and XRD analysis showed that the modified BN (CBN) particles oriented and formed thermal conductive pathways within PC matrix. The formation of large‐area oriented CBN significantly improved the thermal conductivity and thermal stability of composites. At 20 wt % CBN loading, the thermal conductivity of 0.7341 Wm^?1 K^?1 and the temperature for 5% weight loss (T ₅) of 498.6 °C were obtained, which was 3.1 times and 77 °C higher than that of pure PC, respectively. Furthermore, outstanding electrical insulation property of matrix was retained in the composites. These results revealed that PC/CBN composite was a promising material for thermal management and electrical enclosure. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134 , 44978.     

Microwave‐assisted in situ polymerization of polycaprolactone/boron nitride composites with enhanced thermal conductivity and mechanical properties

Polycaprolactone/boron nitride (PCL/BN) composites were prepared by microwave‐assisted ring‐opening polymerization of ε‐caprolactone (ε‐CL). In order to improve the dispersibility and interfacial interaction between BN fillers and PCL matrix, hydroxyl functional BN (mBN) was first prepared to be used as a macroinitiator for ε‐CL. Then BN grafted PCL (BN‐g‐PCL) copolymers were obtained via the in situ method, which acted as in situ compatibilizers in the PCL/BN composites. Various techniques were applied to characterize the mBN and PCL/BN composites. The Fourier transform infrared spectroscopy results confirm the structure of the BN‐g‐PCL copolymer. Field emission SEM graphs exhibit that, for the PCL/mBN composites, the mBN presents a homogeneous dispersion in the matrix and interfacial adhesion between the PCL and mBN is improved. These are beneficial for enhancing the thermal conductivity of the PCL/mBN composites. Notably, the PCL/mBN composite with 5 wt% mBN loading achieves the highest thermal conductivity of 0.55 W m^?1 K^?1, which is 2.75 times higher than that of pure PCL, 0.20 W m^?1 K^?1. This indicates that the excellent dispersion and interfacial adhesion could lead to the construction of continuous thermal conductive paths at a low BN loading and reduce the heat loss caused by phonon scattering in the interface. Furthermore, mBN could help to improve the mechanical properties of the composite. On adding 5 wt% mBN, the tensile strength and tensile modulus of the composite are 1.58 and 2.05 times higher, respectively, than those of PCL. © 2020 Society of Chemical Industry     

氮化硼表面修饰及其对氮化硼/硅橡胶复合材料热性能的影响

研究氮化硼表面改性及其对氮化硼/硅橡胶复合材料热性能的影响。结果表明:活化可以提高氮化硼表面接枝率,偶联剂CA1对氮化硼的改性效果优于偶联剂KH570;随着氮化硼用量的增大,氮化硼/硅橡胶复合材料的热导率增大;加入氮化硼的复合材料热稳定性提高,但改性氮化硼/硅橡胶复合材料的热稳定性下降。     

Effect of the carbon black content on the thermal,rheological and mechanical properties of thermoplastic polyurethanes

Different mixtures of thermoplastic polyurethane (PU) with different amounts of nanometric carbon black (CB) were prepared by mechanical stirring in organic solvent, and their thermal, rheological, viscoelastic and mechanical properties were investigated. The rheology of the PU–CB mixtures in methyl ethyl ketone was optimized, allowing good dispersion of the CB in the polyurethane matrix once the solvent was removed; an increase in the number and size of carbon black aggregates in the polyurethane matrix was obtained by increasing the carbon black loading. Addition of carbon black improved the rheological and viscoelastic properties of the polyurethane, and the larger was the carbon black content, the higher was the storage modulus and the lower was the tanδ value. Moreover, the addition of higher amounts of CB changed the viscoelastic behaviour of the polyurethane, which became mainly elastic over all temperature range. On the other hand, the addition of CB loadings up to 12 wt% increased the thermal stability of the polyurethanes and increased the elongation-at-break without noticeable reduction in the tensile strength.     

Influence of graphene-based compounds on the mechanical toughness and thermal stability of polypropylene

A study of the improvement of the mechanical and thermal properties of nanocomposites prepared with polypropylene (PP) and different graphene samples [graphene oxide (GO), reduced GO (RGO), and commercial graphene (G)] is presented. X-ray diffraction (XRD) and X-ray photoelectron spectroscopy characterization were applied to the graphene samples. The nanocomposites were characterized by thermogravimetric analysis, XRD, differential scanning calorimetry, transmission electron microscopy (TEM), tensile, and impact resistance tests. PP/RGO nanocomposites showed significant improvement in mechanical and thermal properties. Sample PP/RGO-0.75 resulted in an increment in Young's modulus (51%), tensile strength (24%), and elongation at break (15%). This is attributed to a good dispersion state, a higher crystallinity percentage, and a good interfacial adhesion between PP and RGO. Sample PP/RGO-0.50 exhibited an increase of 197 °C in the temperature at which a loss in weight of 5% occurred, compared to that for pure PP. The height of stacked layers calculated by XRD measurements was similar to the value observed by TEM. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2020 , 137, 48258.     

Effects of Gd2O3 and MgSiN2 sintering additives on the thermal conductivity and mechanical properties of Si3N4 ceramics

Si₃N₄ ceramics were prepared by gas pressure sintering at 1900°C for 12 h under a nitrogen pressure of 1 MPa using Gd₂O₃ and MgSiN₂ as sintering additives. The effects of the Gd₂O₃/MgSiN₂ ratio on the densification, microstructure, mechanical properties, and thermal conductivity of Si₃N₄ ceramics were systematically investigated. It was found that a low Gd₂O₃/MgSiN₂ ratio facilitated the thermal diffusivity of Si₃N₄ ceramics while a high Gd₂O₃/MgSiN₂ ratio benefited the densification and mechanical properties. When the Gd₂O₃/MgSiN₂ ratio was 1:1, Si₃N₄ ceramics obtained an obvious exaggerated bimodal microstructure and the optimal properties. The thermal conductivity, flexural strength, and fracture toughness were 124 W·m⁻¹·k⁻¹, 648 MPa, and 9.12 MPa·m^1/2, respectively. Comparing with the results in the literature, it was shown that Gd₂O₃-MgSiN₂ was an effective additives system for obtaining Si₃N₄ ceramics with high thermal conductivity and superior mechanical properties.     

Effect of a new nonoxide additive,Y3Si2C2, on the thermal conductivity and mechanical properties of Si3N4 ceramics

Enhancement of the thermal conductivity of silicon nitride is usually achieved by sacrificing its mechanical properties (bending strength). In this study, β-Si₃N₄ ceramics were prepared using self-synthesized Y₃Si₂C₂ and MgO as sintering additives. It was found that the thermal conductivity of the Si₃N₄ ceramics was remarkably improved without sacrificing their mechanical properties. The microstructure and properties of the Si₃N₄ ceramics were analyzed and compared with those of the Y₂O₃-MgO additives. The addition of Y₃Si₂C₂ eliminated the inherent SiO₂ and introduced nitrogen to increase the N/O ratio of the grain-boundary phase, inducing Si₃N₄ grain growth, increasing Si₃N₄ grain contiguity, and reducing lattice oxygen content in Si₃N₄. Therefore, by replacing Y₂O₃ with Y₃Si₂C₂, the thermal conductivity of the Si₃N₄ ceramics was significantly increased by 31.5% from 85 to 111.8Wm⁻¹K⁻¹, but the bending strength only slightly decreased from 704 ± 63MPa to 669 ± 33MPa.     

Cost effective preparation of Si3N4 ceramics with improved thermal conductivity and mechanical properties

High-purity silicon powder is used as the starting material for cost-effective preparation of silicon nitride ceramics with both high thermal conductivity and excellent mechanical properties using RE₂O₃ (RE=Y, La or Er) and MgO as sintering additives. Nitridation is a key procedure that would affect the properties of green bodies and the sintered samples. The β: (α+β) ratio can be increased as the samples nitrided at 1450ºC and a large amount of long rod-like β-Si₃N₄ grains were developed in the samples. It was found that the addition of Er₂O₃-MgO could help to improve the mechanical properties of the sintered Si₃N₄ ceramics, the thermal conductivity, flexural strength and fracture toughness of the sample were 90 W/(m∙K), 953±28.3 MPa and 10.64±0.61 MPa·m^1/2, respectively. The RE³⁺ species with larger ionic radius tended to increase the oxygen of nitrided samples and decrease N/O ratio (triangle grain boundary) of sintered samples.     

Crystallization and thermal conductivity of poly (vinylidene fluoride)/boron nitride nanosheets composites

ABSTRACT

In this work, boron nitride (BN) and exfoliated boron nitride nanosheets (BNNs) were employed as thermal conductive fillers to improve the thermal conductivity of poly(vinylidene fluoride) (PVDF) composites. Results suggested that the thermal conductivity of PVDF increases significantly with an increase in loading content of functional fillers. When the mass ratio of fillers was more than 30 wt%, the heat conduction network was formed. BNNs were capable of forming denser heat conduction network as per the SEM observations. In this scenario, PVDF/BNNs composites demonstrated excellent thermal conductivity. For example, the thermal conductivity of PVDF/BNNs (60/40) was 0.82 W/mK, which was 2.4 times and 17% higher than that of neat PVDF and PVDF/BN (60/40) counterpart, respectively. The non-isothermal crystallization of corresponding composite was studied by Mo method. Combining with XRD results, both BN and BNNs acted as the nucleation agents but had no effect on crystal forms.     

Enhanced thermal conductivity of boron nitride epoxy‐matrix composite through multi‐modal particle size mixing

Castable particulate‐filled epoxy resins exhibiting excellent thermal conductivity have been prepared using hexagonal boron nitride (hBN) and cubic boron nitride (cBN) as fillers. The thermal conductivity of boron nitride filled epoxy matrix composites was enhanced up to 217% through silane surface treatment of fillers and multi‐modal particle size mixing (two different hBN particle sizes and one cBN particle size) prior to fabricating the composite. The measurements and interpretation of the curing kinetics of anhydride cured epoxies as continuous matrix, loaded with BN having multi‐modal particle size distribution, as heat conductive fillers, are highlighted. This study evidences the importance of surface engineering and multi‐modal mixing distribution applied in inorganic fillered epoxy‐matrix composite. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007     

Effects of Y2O3/MgO ratio on mechanical properties and thermal conductivity of silicon nitride ceramics

In this work, the effects of Y₂O₃/MgO ratio on the densification behavior, phase transformation, microstructure evolution, mechanical properties, and thermal conductivity of Si₃N₄ ceramics were investigated. Densified samples with bimodal microstructure could be obtained by adjusting the ratio of Y₂O₃/MgO. It was found that a low Y₂O₃/MgO ratio facilitated the densification of Si₃N₄ ceramics while a high Y₂O₃/MgO ratio benefited the phase transformation of Si₃N₄ ceramics. Best mechanical properties (flexural strength of 875 MPa, and fracture toughness of 8.25 MPa·m^1/2, respectively) and optimal thermal conductivity of 98.04W/(m·K) were achieved in the sample fabricated with Y₂O₃/MgO ratio of 3:4 by sintering at 1900°C for 4 h.     

Effect of MgF2 addition on mechanical properties and thermal conductivity of silicon nitride ceramics

Dense silicon nitride (Si₃N₄) ceramics were prepared using Y₂O₃ and MgF₂ as sintering aids by spark plasma sintering (SPS) at 1650 °C for 5 min and post-sintering annealing at 1900 °C for 4 h. Effects of MgF₂ contents on densification, phase transformation, microstructure, mechanical properties, and thermal conductivity of the Si₃N₄ ceramics before and after heat treatment were investigated. Results indicated that the initial temperature of liquid phase was effectively decreased, whereas phase transformation was improved as increasing the content of MgF₂. For optimized mechanical properties and thermal conductivity of Si₃N₄, optimum value for MgF₂ content existed. Sample with 3 mol.% Y₂O₃ and 2 mol.% MgF₂ obtained optimum flexural strength, fracture toughness and thermal conductivity (857 MPa, 7.4 MPa m^1/2 and 76 W m⁻¹ K⁻¹, respectively). It was observed that excessive MgF₂ reduced the performance of the ceramic, which was caused by the presence of excessive volatiles.     

耐高温高导热环氧树脂／玻纤／BN复合材料的制备

以4,4-二氨基二苯砜（DDS）和内亚甲基四氢邻苯二甲酸酐（NA）为复配固化剂,采用高温模压成型法制备耐高温高导热环氧树脂／玻纤／氮化硼（BN）复合材料。探讨了BN用量和偶联剂处理对复合材料冲击强度、导热性能和电阻率的影响。结果表明：当nDDS：nNA=3：1时,复合材料的耐热性能最佳。当BN质量分数为8％时,复合材料的冲击强度最高;导热性能随BN用量的增加而增加,当BN用量为15％时,热导率为0．7560W／（mk）,此时复合材料仍保持较高的体积、表面电阻率;当BN填充量为一定值时,偶联剂处理使冲击强度和导热性能得到进一步提高。     

含湿率对多孔介质热导率测量准确性的影响

本文利用HotDisk热常数分析仪对不同含湿率时含湿沙的热导率进行测量研究,并对孔隙尺度水分形态、分布及演化过程进行了观察实验研究。研究发现,低含湿率（＜25%）情况下,介质的有效热导率难以准确测得。低含湿时孔隙内水分主要以孤立液桥形式存在,测试过程中,贴近探头附近的水分由于受探头加热发生蒸发扩散而逐渐减少,导致探头周围试样构成持续发生变化,因而测量得到的热导率准确性较差。含湿率较高时,孔隙内水分相互联通,测试时水分蒸发扩散速度相对较慢,且存在毛细回流现象,探头周围试样构成维持恒定,因此可以准确获得热导率。     

LDPE/PEG插层剥离改性氮化硼导热复合材料的制备及其性能

以聚乙二醇(PEG)为插层剂,通过机械球磨法制备了PEG插层剥离改性氮化硼.以低密度聚乙烯(LDPE)为基体,PEG插层剥离改性氮化硼为导热填料,采用双辊开炼、压片成型制备LDPE/PEG插层剥离改性氮化硼导热复合材料,研究了改性氮化硼用量及粒径对复合材料导热性能、力学性能和电绝缘性能的影响.结果表明:随着PEG插层剥...     

Study of the synergistic effect of boron nitride and carbon nanotubes in the improvement of thermal conductivity of epoxy composites

The enhancement of the thermal conductivity, keeping the electrical insulation, of epoxy thermosets through the addition of pristine and oxidized carbon nanotubes (CNTs) and microplatelets of boron nitride (BN) was studied. Two different epoxy resins were selected: a cycloaliphatic (ECC) epoxy resin and a glycidylic (DGEBA) epoxy resin. The characteristics of the composites prepared were evaluated and compared in terms of thermal, thermomechanical, rheological and electrical properties. Two different dispersion methods were used in the addition of pristine and oxidized CNTs depending on the type of epoxy resin used. Slight changes in the kinetics of the curing reaction were observed in the presence of the fillers. The addition of pristine CNTs led to a greater enhancement of the mechanical properties of the ECC composite whereas the oxidized CNTs presented a greater effect in the DGEBA matrix. The addition of CNTs alone led to a marked decrease of the electrical resistivity of the composites. Nevertheless, in the presence of BN, which is an electrically insulating material, it was possible to increase the proportion of pristine CNTs to 0.25 wt% in the formulation without deterioration of the electrical resistivity. A small but significant synergic effect was determined when both fillers were added together. Improvements of about 750% and 400% in thermal conductivity were obtained in comparison to the neat epoxy matrix for the ECC and DGEBA composites, respectively. © 2019 Society of Chemical Industry     

Electrical,thermal, and mechanical properties of porous silicon carbide ceramics with a boron carbide additive

The effects of the boron carbide (B₄C) content and sintering atmosphere on the electrical, thermal, and mechanical properties of porous silicon carbide (SiC) ceramics were investigated in the porosity range of 58.3%–70.3%. The electrical resistivities of the nitrogen-sintered porous SiC ceramics (∼10^–1 Ω·cm) were two orders of magnitude lower than those of argon-sintered porous SiC ceramics (∼10¹ Ω·cm). Both the thermal conductivities (3.3–19.8 W·m^–1·K^–1) and flexural strengths (8.1–32.9 MPa) of the argon- and nitrogen-sintered porous SiC ceramics increased as the B₄C content increased, owing to the decreased porosity and increased necking area between SiC grains. The electrical resistivity of the porous SiC ceramics was primarily controlled by the sintering atmosphere owing to the N-doping from the nitrogen atmosphere, and secondarily by the B₄C content, owing to the B-doping from the B₄C. In contrast, the thermal conductivity and flexural strength were dependent on both the porosity and necking area, as influenced by both the sintering atmosphere and B₄C content. These results suggest that it is possible to decouple the electrical resistivity from the thermal conductivity by judicious selection of the B₄C content and sintering atmosphere.