Mg2Si电子结构及光学性质的研究

采用基于第一性原理的赝势平面波方法系统地计算了Mg2Si基态的电子结构、态密度和光学性质。计算结果表明Mg2Si属于间接带隙半导体，禁带宽度为0．2994eV；其价带主要由Si的3p以及Mg的3s、3p态电子构成，导带主要由Mg的3s、3p以及Si的3p态电子构成；静态介电常数ε1（0）=18．89；折射率n0=4．3460；吸收系数最大峰值为356474．5cm^-1；并利用计算的能带结构和态密度分析了Mg2Si的介电函数、折射率、反射率、吸收系数、光电导率和能量损失函数的计算结果，为Mg2Si的设计与应用提供了理论依据。     

硅基外延Mn_4Si_7薄膜电子结构与光学性质研究

基于第一性原理的密度泛函理论赝势平面波方法,对外延关系Mn4Si7(001)//Si(001),取向关系Mn4Si7[001]//Si[001]的Mn4Si7平衡体系下的电子结构和光学性质进行了理论计算,计算结果表明:当Mn4Si7晶格常数选取为a=b=0.5431nm、c=1.747nm时,Mn4Si7为带隙宽度为0.834eV的直接带隙半导体。Mn4Si7费米面附近的价带主要由Mn的3d5态电子构成,导带主要由Mn的3d5态电子及Si的3p态电子构成。静态介电常数ε1(0)=14.48,折射率n0=3.8056。     

K掺杂立方相Ca2Si电子结构及光学性能的研究

基于第一性原理的密度泛函理论赝势平面波方法,采用广义梯度近似（GGA）对掺K的立方相Ca2Si的电子结构和光学性能,包括能带结构、态密度、介电函数、折射率、反射率、吸收系数、光电导率及能量损失函数进行理论计算,结果表明,掺K后立方相Ca2Si的能带向高能方向发生了偏移,形成直接带隙的P型半导体,禁带宽度为0.6230eV,光学带隙变宽,价带主要是Si的3p、Ca的4s、3d以及K的3p、4s态的贡献;静态介电函数ε1（0）=14.4;折射率n0=3.8;吸收系数最大峰值为3.47×105cm-1。通过掺杂调制材料电子结构和光电性能,为Ca2Si材料光电性能的开发与应用提供了理论依据。     

Ca2Si电子结构和光学性质的研究

采用第一性原理赝势平面波方法系统的计算了Ca2Si电子结构和光学性质，其中包括能带、态密度、介电函数、复折射率、吸收系数、光电导率和能量损失函数。计算结果显示Ca2Si是典型的半导体，正交相结构有一个直接的带隙，并且光学性质显示出各向异性。Ca2Si立方相的计算结果也显示是直接带隙半导体，并且有很高的振子强度。从能带和态密度的计算结果判断出它们的光学性质主要由Si的3p态电子向Ca的3d态的带间跃迁所决定。     

CrSi2能带结构和光学性质的第一性原理研究

采用基于第一性原理的密度泛函理论（DFT）赝势平面波方法，对CrSi2的能带结构、态密度和光学性质进行了理论计算，能带结构计算表明CrSi2属于一种间接带隙半导体，禁带宽度为0．353eV,其能态密度主要由Cr的3d层电子和Si的3p层电子的能态密度决定；计算了CrSi2的介电函数、反射率、折射率及吸收系数等。经比较，计算结果与已有的实验数据符合较好。     

Pb1-xSrxSe薄膜材料的微结构和光学特性

采用分子束外延的方法在BaF2衬底（111）上制备出了高质量的Pb1-xSrxSe（0≤X≤0．050）薄膜．X射线衍射结果表明，Pb1-xSrxSe薄膜为立方相NaCl型晶体结构，没有观察到SrSe相分离现象，薄膜的取向为平行于衬底（111）晶面．薄膜晶格常数随Sr含量的增加逐渐增大，Sr含量由Vegard公式得到．再用理论模拟Pb1-xSrxSe薄膜透射光谱的方法得到了相应的带隙．最后通过介电函数模型拟合得到了PbSe和Pb1-xSrxSe薄膜在光子能量位于基本带隙附近的折射率n和吸收系数a．     

第一性原理研究InP的能带结构与光学性能

采用基于局域密度近似的第一性原理方法计算了InP的能带结构和电子态密度,并对InP晶体的电荷分布进行了Mulliken布局分析.计算表明InP是直接带隙半导体材料,其价带主要由In的5s以及P的3s、3p态电子构成,导带主要由P的3p以及In的5s、5p态电子构成;P原子与In原子的电子重叠布局数达2.30,表明In-P键的共价性较强而离子性较弱.利用Kramers-Kronig色散关系对InP的介电函数、能量损失谱、折射率以及吸收系数等进行了计算,计算结果与实验值基本一致.此外,根据计算的能带结构与态密度分析了InP电子结构与光学性质的内在联系,解释了InP材料光学性能的微观机制.     

γ-B28光学性质的第一性原理研究

利用基于密度泛函第一性原理的GGA方法,计算研究了硼的高压相γ-B28的能带结构、态密度、分态密度和光学性质.计算结果表明,γ-B28具有半导体能带结构的特征,其带隙达1.619eV,且整个带结构由杂化的硼2p态和2s态组成,且2p态占主导地位.γ-B28的静态介电常数为11.0733,静态的折射率为3.328,介电函数虚部的吸收边位于1.7eV左右,同时,在2.693eV和5.232eV处有2个明显的特征峰.γ-B28的反射系数在0～16eV范围内随着能量的升高而逐渐增大,但在19.4eV时反射系数急剧下降,而吸收系数的数量级达105cm-1,其电子能量损失谱(EELS)的共振峰在19.4eV处,与反射系数的陡降相对应.     

（001）应变对正交相Ca2P0.25Si0.75能带结构及光学性质的影响

为了研究(001)应变对正交相Ca2P0.25Si0.75能带结构及光学性质的影响,采用第一性原理贋势平面波方法对(001)应变下正交相Ca2P0.25Si0.75的能带结构及光学性质进行了模拟计算.计算结果表明:晶格(001)面发生100%~116%张应变时,带隙随着应变增加而减小;在晶格发生88%~100%压应变时,带隙随着张应变的增加而增加;84%~88%压应变时,带隙随着压应变的增加而减小.当施加应变后光学性质发生显著的变化:随着压应变的增加,静态介电常数、折射率逐渐减小,张应变则增大.施加压应变反射向高能方向偏移,施加张应变反射向低能方向偏移,但施加应变对反射区域的影响不显著.施压应变吸收谱、光电导率的变化与介电函数和折射率相反.综上所述,(001)应变改变了Ca2P0.25Si0.75的电子结构和光学常数,是调节Ca2P0.25Si0.75光电传输性能的有效手段.     

过渡金属掺杂单层MoS_2的第一性原理计算

利用基于密度泛函理论的第一性原理平面波赝势方法分别计算了本征及过渡金属掺杂单层MoS_2的晶格参数、电子结构和光学性质。计算结果显示,过渡金属掺杂所引起的晶格畸变与杂质原子的共价半径有联系,但并不完全取决于共价半径的大小。分析能带结构可以看到,Co、Ni、Cu、Tc、Re和W掺杂使能带从直接带隙变成了间接带隙。除了Cr和W以外,其它掺杂体系的禁带区域都出现了数目不等的新能级,这些杂质能级主要由杂质的d、S的3p和Mo的4d轨道组成。掺杂对MoS_2的光学性质也产生了相应的影响,使MoS_2的静态介电常数、介电函数虚部峰值、折射率和光电导率峰值呈现不同程度的增加。     

钠钙玻璃上Mg2Si薄膜的制备及其电学性质

采用磁控溅射技术和退火工艺在钠钙玻璃衬底上制备了Mg_2Si半导体薄膜,研究了Mg膜厚度对Mg_2Si薄膜结构及其电学性质的影响。在钠钙玻璃上分别溅射两组相同厚度(175nm)的P-Si和N-Si膜,然后在其上溅射不同厚度Mg膜(240nm、256nm、272nm、288nm、304nm),低真空退火4h制备一系列Mg_2Si半导体薄膜。通过X射线衍射仪(XRD)、扫描电子显微镜(SEM)、霍尔效应测试仪对Mg_2Si薄膜的晶体结构、表面形貌、电学性质进行表征与分析。结果表明:采用磁控溅射技术在钠钙玻璃衬底上成功制备出以Mg_2Si(220)为主的Mg_2Si薄膜。随着沉积Mg膜厚度的增加,Mg_2Si衍射峰逐渐增强,薄膜表面更连续,电阻率逐渐减小,霍尔迁移率逐渐降低,载流子浓度逐渐增加。此外,Si膜导电类型和Mg膜厚度共同影响Mg_2Si薄膜的导电类型。溅射N-Si膜时,Mg_2Si薄膜的导电类型随着Mg膜厚度的增加由P型转化为N型;溅射P-Si膜时,Mg_2Si薄膜的导电类型为P型。可以控制制备的Mg_2Si半导体薄膜的导电类型,这对Mg_2Si薄膜的器件开发有着重要的指导意义。     

Growth and characterisation of wide-bandgap,I-VII optoelectronic materials on silicon

γ-CuCl is a wide-bandgap (E_g = 3.395 eV), direct bandgap, semiconductor material with a cubic zincblende lattice structure. Its lattice constant, a_CuCl = 0.541 nm, means that the lattice mismatch to Si (a_Si = 0.543 nm) is < 0.5%. γ-CuCl on Si—the growth of a wide-bandgap, direct bandgap, optoelectronics material on silicon substrates is a novel material system, with compatibility to current Si based electronic/optoelectronics technologies.The authors report on early investigations consisting of the growth of polycrystalline, CuCl thin films with layer thicknesses of 100 nm to 1 μm on Si (100), Si (111), and quartz substrates by physical vapour deposition. X-ray diffraction (XRD) studies indicate that CuCl grows preferentially in the (111) direction but an epitaxial alignment with the substrate is also detected to a lesser extent in the case of Si (100). Photoluminescence (PL) and Cathodoluminescence (CL) reveal a strong room temperature Z₃ excitonic emission at ≈387 nm. X-ray microanalysis and XRD are used to investigate the effect of heat treatments on the CuCl thin films after deposition in the temperature range of 50 to 430∘C, (melting point of CuCl ≈ 430∘C). It is a found that a reaction occurs with Si on heating above 250∘C forming SiCl₄ and Cu.     

Epitaxial multi-component rare-earth oxide: A high-k material with ultralow mismatch to Si

New gate dielectric substitute for high-k application requires well matched lattice parameters and an atomically defined interface with Si for optimal performance. Using molecular beam epitaxy technique, we have grown on Si(111) crystalline rare-earth oxide ultrathin films, (Gd_xNd_1 − x)₂O₃ (GNO), a multi-component material that is superior to either of its binary host oxides. By carefully characterizing its crystal structure, we have found that the epitaxial GNO film exhibits a single bixbyite cubic structure with ultralow lattice mismatch to Si, which is indistinguishable even by the powerful synchrotron radiation. This structural perfection could make the GNO a promising high-k material in future devices.     

Electronic structure and photoluminescence properties of Eu-activated Ca4Si2O7F2

The blue-emitting phosphors Ca_(4−x)Eu_xSi₂O₇F₂ (0 < x ? 0.05) have been prepared by solid-state reaction and the photoluminescence properties have been studied systematically. The electronic structure of calcium fluoride silicate Ca₄Si₂O₇F₂ was calculated using the CASTEP code. The calculation results of electronic structure show that Ca₄Si₂O₇F₂ has an indirect band gap with 5 eV. The top of the valence band is dominated by O 2p and Si 3p states, while the bottom of the conduction band is mainly composed of Ca 3d states. Under the 350 nm excitation, the obtained sample shows a broad emission band in the wavelength range of 400-500 nm with peaks of 413 nm and 460 nm from two different luminescence centers, respectively. The relative intensity of the two peaks changes with the alteration of the Eu²⁺ concentration. The strong excitation bands of the powder in the wavelength range of 200-420 nm are favorable properties for the application as lighting-emitting-diode conversion phosphor.     

Solid-phase crystallization of β-FeSi2 thin film in Fe/Si structure

Dependence of solid-phase growth of β-FeSi₂ thin films on the crystal orientation of Si substrates has been investigated by using a-Fe (thickness: 20 nm)/c-Si(100), (110) and (111) stacked structures. X-ray diffraction (XRD) measurements suggested that the substrate orientation dependence of the formation rate of β-FeSi₂ was as follows: (100)>(111)>(110). This dependence can be explained on the basis of the lattice mismatch between β-FeSi₂ and Si substrates, i.e., the lattice mismatch between β-FeSi₂(100) and Si(100), β-FeSi₂(110) or (101) and Si(111), and β-FeSi₂(010) or (001) and Si(110) of 1.4-2.0%, 5.3-5.5% and 9.2%, respectively. The substrate orientation dependence of solid-phase growth becomes relatively remarkable for very thin films.     

Formation of thin β-FeSi2 template layer for the epitaxial growth of thick film on Si (111) substrate

For the epitaxial growth of thick β-FeSi₂ films, we fabricated ultrathin β-FeSi₂ template layers (thinner than 20 nm) on Si (111) substrates with different methods. Surface morphology and crystallinity of the template layers were found to be dependent on the surface conditions of the substrate and the fabrication method. It was revealed that to form a smooth and continuous template, a hydrogen-terminated surface was better than that covered with a several-nanometer oxide layer. Using this surface, continuous (110)/(101)-oriented epitaxial template was obtained by depositing 6-nm iron at 400 °C and subsequent in situ annealing at 600 °C in MBE chamber, namely, a reaction deposition epitaxy (RDE) method. Co-deposition of iron and silicon with atomic ratio of Fe/Si=1/2 allowed the forming of template layers at further low temperature. Co-deposited template layers exhibited better crystallinity and morphology than those prepared by RDE. By using the optimized template layer, we succeeded in growing high-quality thick β-FeSi₂ films on Si (111) substrates with sharp β-FeSi₂/Si interface.     

Epitaxial growth of Fe3Si/CaF2/Fe3Si magnetic tunnel junction structures on CaF2/Si(111) by molecular beam epitaxy

The Fe₃Si(24 nm)/CaF₂(2 nm)/Fe₃Si(12 nm) magnetic tunnel junction (MTJ) structures were grown epitaxially on CaF₂/Si(111) by molecular beam epitaxy (MBE). The 12-nm-thick Fe₃Si underlayer was grown epitaxially on CaF_2/Si(111) at approximately 400 °C; however, the surface of the Fe₃Si film was very rough, and thus a lot of pinholes are considered to exist in the 2-nm-thick CaF₂ barrier layer. The average roughness (Ra) of the CaF₂ barrier layer was 7.8 nm. This problem was overcome by low-temperature deposition of Fe and Si at 80 °C on CaF₂/Si(111), followed by annealing at 250 °C for 30 min to form the Fe₃Si layer. The Ra roughness was significantly reduced down to approximately 0.26 nm. A hysteresis loop with coercive field H_c of approximately 25 Oe was obtained in the magnetic field dependence of Kerr rotation at room temperature (RT).     

Epitaxial growth and relaxation of γ-Al2O3 on silicon

0.5-10 nm-thick single crystal γ-Al₂O₃ films was epitaxially grown, at high temperature, on Si(001) and Si(111) substrates using electron-beam evaporation techniques. Reflection High Energy Electron Diffraction studies showed that the Al₂O₃ films grow pseudomorphically on Si (100) up to thickness of 2 nm. For higher thicknesses, a cubic to hexagonal surface phase transition occurs. Epitaxial growth and relaxation were also observed for Si(111). The film surfaces are smooth and the oxide-Si interfaces are atomically abrupt without interfacial layers.     

Fe3Si nanodots epitaxially grown on Si(111) substrates using ultrathin SiO2 film technique

Ultrahigh density (> 10¹² cm⁻²) Fe₃Si nanodots (NDs) are epitaxially grown on Si(111) substrates by codeposition of Fe and Si on the ultrathin SiO₂ films with ultrahigh density nanovoids. We used two kinds of methods for epitaxial growth: molecular beam epitaxy (MBE) and solid phase epitaxy. For MBE, low temperature (< 300 °C) growth of the Fe₃Si NDs is needed to suppress the interdiffusion between Fe atoms deposited on the surfaces and Si atoms in the substrate. These epitaxial NDs exhibited the ferromagnetism at low temperatures, which were expected in terms of the application to the magnetic memory device materials.     

Epitaxial growth of SrRuO<Subscript>3</Subscript> thin films by RF sputtering and study of surface morphology

We report on the epitaxial growth of SrRuO₃ (SRO) thin films on Pt (111)/γ-Al₂O₃ (111) nSi (111) substrates. The grown thin films are crystalline and epitaxial as suggested by RHEED and XRD experiments. With the use of γ-Al₂O₃ (001)/nSi (001) and γ-Al₂O₃ (111)/nSi (111) substrates, crystalline but not epitaxial films have grown successfully. This result implies that lattice mismatch between nSi and SRO prevents the epitaxial growth of SRO film directly on nSi. However, the buffer Pt (111) layer mitigates lattice mismatch that provides to grow epitaxial film on nSi of quality. Morphological study shows a good surface with moderate roughness. Film grown at 700°C is smoother than the film grown at 750°C, but the variation of temperature does not affect significantly on the epitaxial nature of the films.