光亮硫酸盐电镀Zn-Fe合金工艺研究

采用霍尔槽试验对硫酸盐镀锌铁合金光亮剂、辅助光亮剂、载体光亮剂进行了筛选,研究成功了一种酸性硫酸盐体系电镀低铁含量的光亮zn-Fe合金镀层工艺,探讨了主盐、络合剂、导电盐、稳定剂、工艺条件的影响,检测了镀液、镀层性能.结果表明:该镀液成分方便,镀液稳定,操作简单,所得镀层结晶细致、光亮平整,其耐蚀性与光亮度明显优于镀锌层,黑色钝化后黝黑发亮.     

酸性镀锌工艺

为了改善和增加酸性无氰镀锌液的锌镀层的光亮性、光泽及分散能力,某种芳香族羰基化合物被广泛用作光亮剂.这些光亮剂提供相当令人满意的锌镀层,但是镀层在低电流密度区趋于暗淡无光,同时光亮剂在中等酸性镀锌电解液中溶解度有限.     

865无机光亮剂低氰镀锌新工艺的研究

本文论述以865无机光亮剂的低氰光亮镀锌新工艺。在低氰镀锌液中加入微量的865无机光亮剂(0.1～0.35克/升),可提高镀锌层的抗蚀性,防止锌层生白锈,减小镀层的脆性,使镀层结晶细致光亮,具有美丽的外观。其镀液具有较高的电流效率、均镀能力、深镀能力和极化性能。它克服了长期使用无机光亮剂硫化钠沉淀多、脆性较大和有机光亮剂易分解、脆性大、不易分析的缺点。而且含有865无机光亮剂镀锌液分析简单,易于控制。是今后碱性镀锌无机光亮剂又一个发展的方向。     

氯化钾镀锌光亮剂的制备

以平平加O-25为起始原料合成了氯化钾镀锌光亮剂的载体,以苄叉丙酮为主光亮剂配制了镀锌光亮剂,此光亮剂用量在每升电镀液36 ml和阴极电流密度在1 A/dm2～2 A/dm2时得到满意的光亮镀层.测得的电镀液的浊点为82℃.     

ZF100新型氯化钾镀锌添加剂的应用

1 引言 摩托车、自行车辐条的氯化钾光亮滚镀锌,对外观质量要求高,对镀层厚度、耐蚀性也有严格要求。我们曾先后使用过数种有代表性的国产镀锌光亮剂以及台湾莱德918镀锌添加剂,前者价格便宜,但镀层质量、镀液性能不够理想,光亮剂消耗量过大;后者性能优异,添加剂消耗量少,但价格昂贵,供货时有困难。为此,从1993年2月开始,我们对成都华瑞技术开发公司最新研制的ZF100镀锌添加剂进行反复测试,经过近一年的工艺试验和生产考验,产品质量、镀液性能令人满意,经济效益十分显著,现     

硫酸盐酸性光亮镀锡铋合金工艺

采用赫尔槽试验研究了硫酸盐酸性电镀锡铋合金工艺。以改善镀层的光亮性以及镀液的稳定性为目的,讨论了镀液组分及工艺条件对镀液和合金镀层性能的影响,检测了镀液和镀层的相关性能。结果表明:镀液中加入光亮剂和稳定剂后,可获得一种铋含量达2.5%,且耐蚀性、可焊性优良的光亮Sn-Bi合金镀层。镀液的覆盖能力和分散能力良好,镀液稳定性也得到较大提高。     

新型光亮剂EN65D在化学镀Ni-P合金上的应用

在化学镀镍磷合金工艺中,使用了一种新型的镀镍光亮剂EN65D,获得了全光亮的镀层。同时对镀层的光泽度、硬度、厚度、耐磨性及耐腐蚀性等进行了研究,结果表明：使用该光亮剂所获得的镀层平整光亮、孔隙率低、厚度均匀,具有较好的硬度和耐磨性,特别是施镀过程中出光速度非常快,只需10－15min镀层便开始光亮,该光亮剂的使用大大改善了镀层的表面外观,明显提高了镀层表面的光泽度,而且光亮剂用量少,镀液稳定可靠。     

上海永生助剂厂 无锡钱桥助剂厂

正电镀十佳民族品牌、上海市清洁生产示范企业、上海市重合同守信用单位说明:永生厂还未完成改制,因此仍与上海永华化学助剂有限公司共同营运。创新产品:LCZ环保型氯化钾镀锌光亮剂—低泡,可空气搅拌,COD能降低一半左右,镀层几无脆性。无铬锌铝涂料—代替含铬的达克罗,综合性能超达克罗涂层,获上海市和国家科技创新基金。染料型硫酸镀铜光亮剂—可与进口同类光亮剂混用、媲美,获上海市科技创新基金。以锌代镍铬—外观宛如光亮镍铬镀层,室内防锈性优于镍铬镀层,成本低,已获发明专利。无铬钝化剂—耐盐雾性能超过铬酸盐钝化,有黄色和蓝白两种色泽,外观比三价铬钝化好。碱性镀锌钴合金工艺—抗蚀性与锌镍合金镀层相仿,钝化膜外观比锌镍镀层好。     

超声波搅拌镀锌

不管镀液中有无光亮剂,超声波搅拌可增加锌酸盐镀锌的电流效率、沉积速度和最大电流密度.普通镀液采用超声波可得到表面光滑、结构整齐、轮廓分明的镀层.光亮镀液应用超声波可增加镀层的显微硬度.     

全光亮碱性锌酸盐镀锌工艺研究

在碱性锌酸盐镀锌基础液中加入自制光亮剂XY-03A,研究成功了一种全光亮碱性锌酸盐镀锌工艺,确定了电镀工艺规范,采用霍尔槽试验探讨了主要成分对镀层质量的影响,检测了镀液和镀层性能,结果表明：所形成的锌镀层光亮度高,镀层结晶细致,与基体结合力好;镀液的分散能力、复盖能力、电流效率和镀层耐蚀性优于DE型镀锌工艺,具有较高的应用价值.     

A novel electrolyte for the high speed electrodeposition of bright pure tin at elevated temperatures

A new tin electroplating process capable of producing fully bright, pure tin deposits from an electrolyte operated at temperatures of up to 50°C has been developed. Unlike conventional bright tin deposits, the tin deposit from the new process has an increased grain size and low carbon content. In addition, the deposit demonstrates excellent ductility, solderability, and low tendency for whisker growth. Production trials conducted by various industries have proven that the new pure tin deposit is suitable for connector applications, as well as for corrosion protection and decorative uses. In this article, the characteristics of the tin electrolyte and the bright tin deposit are described.Electrodeposition of bright tin, characterized by its silvery-white decorative appearance, excellent solderabilty, conductivity, good corrosion and tarnish resistance, and non-toxic nature, has been widely used in the electronic industry and protective-decorative applications. The industrial importance of tin electrodeposition has been markedly extended with the introduction of lead-free solder in the electronic marketplace. However, certain drawbacks of commonly used bright tin plating processes have limited the acceptance of electrodeposited bright tin. The operation and control of bright tin plating solutions is more difficult compared to that of matte tin processes, since the additive system of conventional bright tin electrolytes usually contains many volatile organic components that act as brightening agents. Because of the volatile nature of the organic brightening agents, a cooling system is usually required in conventional bright tin plating baths, in order to maintain the bath temperature between 20 to 25°C where most brightening agents are effective. For high-speed plating, the use of a cooling system becomes essential since the bath temperature naturally rises rapidly during plating. A key concern with the use of bright tin in certain applications is the relatively low ductility often associated with bright deposits and the reportedly higher tendency towards tin whisker growth compared to matte deposits. For demanding automotive applications, where the use of bright tin-lead has been permitted for a limited period of time, continuing efforts are being made by both the electronics industry and suppliers of plating chemistry to replace bright tin-lead with bright pure tin. Tin whisker performance has become one of the most critical characteristics in qualification of any bright pure tin plating process for use in the electronics industry.The newly developed plating bath, SOLDERON? BHT-350 bright tin, has been designed to be operated at temperatures between room temperature and 50°C, while producing ductile, bright deposits with low whisker growth tendency. Production trials conducted by different industries have demonstrated that the new process is able to produce bright tin deposits under high speed reel-to-reel plating conditions, and the simple additive system facilitates automatic or manual dosing during operation. The resulting bright tin deposits are suitable for connectors, contacts, wire and other items requiring a bright tin finish. In this article, the characteristics of the electrolyte and the properties of the bright tin deposit, including microstructure, carbon content, ductility, texture, solderability and whisker performance are described in detail.     

A Study of the Theory Involved in the Deposition of Chromium

Reaction products of aldehydes and amines have been shown to be capable of acting as brightening agents in the electrodeposition of tin from acid solutions. A reproducible method of preparing a stable brightening agent from o-toluidine and acetaldchyde has been devised and the use of this agent in a stannous sulphate electrolyte containing cresolsulphonic acid and sodium n-octyl sulphate has been developed. The plating bath, after working in, gives fully bright, ductile deposits at current densities of 10 A/ft² upwards with slow cathode movement.     

65Mn高弹性垫片的机械镀锌研究

目的克服65Mn高弹性垫片电镀锌产生的氢脆问题。方法采用机械镀锌方法在65Mn高弹性垫片表面制备了镀锌层,采用目测法观察镀层的外观及镀层完整情况,采用硫酸铜试验分析镀层厚度的均匀性,采用划格试验法测试镀层的结合强度,采用铁试剂方法检测镀层的孔隙率,通过预紧固检测分析了镀液p H值对镀后垫片氢脆的影响,采用中性盐雾实验法检测了钝化对镀层耐蚀性能的影响。结果制备的机械镀锌层表面平滑,覆盖完整,无起皮、漏镀等缺陷。镀层呈灰亮色,厚度均匀,具有足够的致密度。当镀液环境的p H值较低时(1~2和2~3),施镀过程造成一定程度的氢脆隐患;镀液环境的p H值为3~4时,机械镀锌垫片不会发生裂纹或断裂。结论施镀时,镀液环境的p H值调整为3~4,或垫片在镀锌后装配前自然放置1~2周,采用机械镀锌的方法可消除65Mn高弹性垫片镀锌过程中的氢脆现象。钝化处理可推迟或防止65Mn高弹性垫片机械镀锌层白锈的产生。     

氯化物镀锌光亮剂的使用

详细阐述了氯化物镀锌工艺中光亮剂的使用、选择、添加量、使用注意事项及常见故障排除等。     

高磷高耐蚀性化学镀Ni-P合金复合络合剂的研究

选取了对镀层和溶液性能有较大影响的络合剂和促进剂共五因素,采用正交试验法进行了研究,并优化验证了络合剂和促进剂工艺配方,筛选出一种高磷高耐蚀性的化学镀Ni-P合金复合络合剂。     

Nickel Electroplating

NICKEL ELECTROPLATING has been practicallyused for decades.There is an unknown part in theplating,although this is easy to plate.Applications ofthe plating are described from the practical viewpoint.Purpose of Nickel Electroplating(1)Decorative,and corrosion resistanceNickel electroplating is deposited on iron,cupper,zinc and aluminum substrate etc.,and chromiumplating is usually deposited on nickel plating.Hexavalent chromium plating has an important effecton the corrosion resisitan…     

[Bmim]OTf-ZnCl2-PC体系超声电镀锌工艺及镀层耐蚀性能研究

目的研究超声功率对镀层表面形貌和镀层耐蚀性的影响。方法采用[Bmim]OTf-Zn Cl2-PC离子液体,利用超声电沉积方法,在铜电极表面沉积金属锌。利用电化学工作站考察阴极极化曲线以及镀层的耐蚀性能,测定镀层的电沉积速度。利用扫描电镜分析镀层的表面形貌,显微维氏硬度计测定镀层的硬度,考查超声波功率对镀层性能的影响。结果加入超声波后,金属的还原电位发生正移,镀层的沉积速度从无超声波作用时的4.652 g/(m~2·min)下降到2.146 g/(m~2·min),镀层表面均匀、致密,结合力强,表面硬度从无超声波作用时的185HV增加至251HV。根据Tafel直线外推法得出镀层的腐蚀电位从-1.14 V增加到-0.62 V,腐蚀电流密度从8.8μA/cm~2降低到2.3μA/cm~2,镀层的耐蚀性能变好。结论增加超声波功率明显提高镀层的表面质量,粗糙度逐渐变好,镀层耐蚀性有明显增加的趋势。综合考虑超声电沉积锌镀层的最佳超声功率为120 k W·h。     

光亮氯化物电镀锌铁合金工艺研究

采用霍尔槽试验成功了一种光亮氯化物电镀低铁含量的锌铁合金工艺,探讨了光亮剂、主盐、导电盐、稳定剂、工艺条件的影响,检测了镀液、镀层性能。结果表明：本工艺所得镀层光亮如镜,白钝酷似镍层,主要性能指标优于纯锌镀层,适用于钢铁零部件的高耐蚀性电镀。     

2011型除雪车滚刷焊接齿轮热处理及其表面镀锌

目的 提高2011型除雪车滚刷焊接齿轮的综合力学性能和镀锌层质量.方法 热处理前齿面预留0.4 mm的磨削量,硬度调质到230~270 HBW.焊接完成后,立即在井式炉中消除焊接产生的热应力,900℃高温入炉快速加热,860℃保温淬火,并及时回火.该焊接齿轮的电镀工艺分为预处理、活化、电镀、钝化和烘干五个步骤,采用亚苄基丙酮作为主光亮剂的新型镀锌溶液进行电镀.结果 焊接齿轮进行整体调质热处理后,焊缝区组织主要是细小均匀的回火索氏体,力学性能优良稳定,避免了HAZ区的软化、脆化、硬化,预堆低碳钢后综合力学性能最好,按此工艺生产的齿轮经检测全部合格.焊接齿轮电镀层主要成分为Zn,少部分为Fe,Zn的质量分数沿着基体金属向镀层方向递增,而Fe递减.电镀层的厚度约为6~8μm,镀锌层与基体附着紧密,镀层无粗糙、起泡、裂纹、孔隙或局部无镀层的情况.结论 焊接齿轮齿面预留磨削量,采用最小变形热处理工艺,确保了尺寸精度,降低了加工难度,利于批量多规格工件的生产.采用堆焊过渡层焊后调质工艺,可显著提高焊接齿轮的焊缝区域的综合力学性能.对焊接齿轮镀锌层进行国标检验的结果 表明,本文采用的镀锌溶液配方和电镀工艺效果良好,电镀层厚度均匀,分布合理,致密度、附着力良好,耐腐蚀性优良,具有较大的推广应用价值.