SnAg0.5CuZn0.1Ni/Cu钎焊接头的界面组织与力学性能研究

通过金相显微镜、X射线衍射仪、透射电子显微镜、扫描电子显微镜和拉力试验机,研究了不同钎焊工艺参数对SnAg0.5CuZn0.1Ni/Cu无铅微焊点界面组织、金属间化合物层厚和力学性能的影响。结果表明,添加0.1%Ni能显著细化SnAg0.5CuZn钎料合金的初生β-Sn相和共晶组织;当钎焊温度为270℃、钎焊时间为240s时,钎焊接头的剪切强度达到最大,为45.6 MPa;钎焊接头界面区粗糙度、金属间化合物层厚度和钎焊接头的剪切强度均随着钎焊工艺参数的变化而变化。     

镀锡银钎料钎焊316LN不锈钢的接头组织及力学性能

通过在BAg34CuZnSn钎料(3.5%Sn,质量分数)基材表面刷镀微米锡层,采用感应钎焊方法对316LN不锈钢进行连接。利用扫描电镜(SEM)和X射线衍射仪(XRD)分析基材表面锡镀层的结晶取向和界面形貌,以及316LN不锈钢钎焊接头的显微组织、物相组成、断口形貌,并借助万能拉力试验机测试了钎焊接头的力学性能。结果表明,基材表面锡镀层结晶晶粒呈现明显的(200),(112)择优取向。BAg34CuZnSn基材钎料和5.0%Sn含量镀锡银钎料连接的316LN不锈钢钎焊接头组织主要由Ag相、富Cu相、CuZn相、Cu_5Zn_8相组成;当镀锡银钎料中Sn含量为6.4%时,316LN不锈钢钎焊接头组织主要由Ag相、富Cu相、CuZn相、Cu_5Zn_8相、Cu_(41)Sn_(11)相和Ag_3Sn相组成。镀锡后316LN不锈钢钎焊接头的抗拉强度高于基材钎料连接的接头强度,且随着镀锡银钎料中Sn含量逐渐升高,316LN不锈钢钎焊接头的抗拉强度呈现先升高后降低的趋势。在镀锡银钎料中Sn含量为5.5%时,钎焊接头的抗拉强度最高,为415 MPa。镀锡不改变316LN不锈钢钎焊接头的断口特征,镀锡前后316LN不锈钢钎焊接头的拉伸断口均呈现以韧性断裂为主脆性断裂为辅的混合断裂特征。     

微量Si元素对Sn-0.7Cu钎料组织及钎焊性能的影响

研究了Si元素对Sn-0.7Cu钎料合金钎焊性能的影响。采用感应熔炼工艺制备出Sn-0.7Cu-x Si (x=0,0.1,0.3,0.5,0.75,1.0;%,质量分数)钎料合金,通过扫描电镜(SEM)、能谱仪(EDS)、显微硬度计及万能拉伸实验验机等分析测试方法研究了Sn-0.7Cu-x Si钎料微观组织、界面形貌、熔化特性及力学性能。研究结果表明：加入0.1%的Si元素后,晶粒明显细化,共晶相增多,界面层厚度降低,此时硬度及抗拉强度达到最大值(HV_0.025 11.38,37 MPa);随着Si含量的继续增加,Sn-0.7Cu-x Si钎料合金晶粒逐渐粗化,共晶组织减少,同时过量黑色的Si颗粒聚集,界面处化合物层厚度不断增加;钎料的熔点随着Si含量的增加无明显变化,过冷度逐渐降低,当Si元素添加量超过0.5%后趋于稳定,相比于Sn-0.7Cu钎料合金降低了46.5%;Sn-0.7Cu-x Si钎料合金的润湿性随着Si含量的增加先升高后降低,在Si元素含量为0.5%处润湿面积最大(93.71 mm²),显微硬度及剪切强度逐渐降低。     

含锑软钎料钎焊黄铜组织与性能的研究

为判断含锑钎料钎焊黄铜是否可行 ,研究了锡铅锑钎料钎焊H6 2黄铜时锑与锌的作用 ,并对其接头的组织与性能进行了深入分析。研究结果表明锡铅锑钎料钎焊黄铜的接头组织中未发现锌锑化合物相 ,含锑量0 2 2 %～ 0 .8% (质量分数 )的锡铅锑钎料钎焊黄铜未引起接头性能下降 ,认为可以钎焊黄铜。     

DCMP铝合金真空钎焊机箱加工方法

正中国专利CN105563018A本发明涉及DCMP铝合金真空钎焊机箱加工方法,具体包括以下步骤:(1)下料,选用毛坯料,并保证有足够的加工余量;(2)热处理;(3)粗加工,左、右侧板与后侧板及前框钎焊配合面处需各留0.5 mm的精加工余量,还有左、右侧板与散热翅片钎焊配合面留有0.5 mm的精加工余量;(4)后侧板和前框在长度方向单边各留0.5 mm的精加工余量,     

Sn1.0Ag0.5Cu和Sn3.0Ag0.5Cu钎料组织与性能对比研究

Sn3.0Ag0.5Cu无铅钎料已广泛应用于电子封装中,但是与传统的Sn Pb钎料相比,其抗冲击能力相对较差,且成本远远高于锡铅钎料。因此,为了改善抗冲击性能,降低钎料的成本,低银型无铅钎料成为研究热点。本文对比分析了Sn1.0Ag0.5Cu和Sn3.0Ag0.5Cu两种无铅钎料的润湿性及力学性能,同时研究了焊后和高温时效300 h后两种钎料焊点的显微组织。结果表明:随着Ag含量的增加,钎料的铺展面积显著增加,不同钎焊温度条件下,钎料的铺展面积随着钎焊温度的升高而明显增大。Sn3.0Ag0.5Cu钎料焊点的拉伸力和剪切力也明显高于Sn1.0Ag0.5Cu钎料,但随着时效时间的增加,高银型钎料的力学性能下降速度略高于低银型钎料。焊后两种钎料对应界面层为Cu6Sn5,经150℃时效300 h,界面金属间化合物的厚度随着时效时间的增加而增加。同时,界面层随着Ag含量的增加而增厚。     

TiZrNiCu钎料钎焊TZM合金与ZrC_p-W复合材料界面组织与性能

采用TiZrNiCu非晶钎料实现了TZM合金与ZrC_p-W复合材料的真空钎焊连接,通过扫描电镜(SEM)、能谱仪(EDS)及X射线衍射(XRD)等方法分析了接头界面的微观组织结构、生成产物及钎焊温度对界面组织及接头性能的影响,确定了接头的断裂位置和断裂方式。研究结果表明:钎焊接头的典型界面结构为TZM/Mo(s,s)+Ti(s,s)+(Ti,Zr)_2(Ni,Cu)/Ti(s,s)+(Ti,Zr)_2(Ni,Cu)/(Ti,Zr)_2(Ni,Cu)/ZrC_pW。随钎焊温度升高,TZM一侧扩散层逐渐变宽,其内部的线状条纹变多、增宽,而钎缝逐渐变窄,靠近ZrC_p-W一侧反应层宽度变化不大,钎料向TZM一侧扩散增快、Mo及W颗粒向钎料中的溶解加快。接头的抗剪强度随钎焊温度升高先升高后降低,当钎焊温度为1020℃、保温10 min时,接头获得最大抗剪强度为121 MPa。断口分析表明,断裂位置位于TZM母材与钎缝之间的反应层,断裂方式为脆性断裂。     

DCMP铝合金真空钎焊机箱加工方法

正中国专利CN105563018A本发明涉及DCMP铝合金真空钎焊机箱加工方法,主要包括以下步骤:(1)下料,选用毛坯料,并保证有足够的加工余量;(2)热处理;(3)粗加工,左、右侧板与后侧板及前框钎焊配合面处需各留0.5mm的精加工余量,还有左、右侧板与散热翅片钎焊配合面留有0.5mm的精加工余量;后侧板和前框在长度方向单边各留0.5mm的精加工余量,需在精加工时     

钎焊真空度对铜与铪钎焊接头组织及性能的影响

采用72Ag-28Cu钎料对铜与铪进行真空钎焊试验.钎焊温度为840℃,保温时间为15 min,真空度试验范围为5.0×10-2~8.0Pa.研究了钎焊真空度对铜与铪钎焊接头组织及性能的影响,采用场发射扫描电子显微镜(FESEM)观察钎焊接头的组织形貌,采用ZWICKZ050电子万能材料试验机测试接头剪切强度.结果表明:随着钎焊真空度的升高,接头剪切强度呈先升高后降低的趋势;在钎焊温度为840℃、保温时间为15 min时,较佳的钎焊真空度为2.0×10-1Pa.     

Ce的添加及等温时效对Sn-Ag-Cu钎料及钎焊界面生长行为的影响

研究微量稀土元素Ce在钎焊和等温时效后对Sn-Ag-Cu无铅钎料与铜基板的钎焊界面金属间化合物(IMC)及钎料组织的形成与生长行为的影响。结果表明,微量Ce的添加对钎料微观组织有一定的细化作用,并且对其形貌也有一定的影响。钎焊后钎焊界面区形成连续的笋状Cu_6Sn_5金属间化合物(IMC),在160℃等温时效条件下,随着时效时间的延长,粗糙的Cu_6Sn_5由笋状转变成尺寸较大的扇贝状,再转变成较为平缓的层状。在此过程中,Cu_6Sn_5和铜基板之间逐渐会有Cu3Sn金属间化合物析出,且界面金属间化合物总厚度也是随着时效时间延长而增加。在相同时效条件下,添加0.5%Ce的钎焊界面区IMC层比未添加Ce的IMC层更为平缓和细薄,在钎焊接头Cu_6Sn_5层处可能会有CeSn_3相生成且添加稀土元素Ce对钎焊界面Cu、Sn原子之间的反应扩散均有一定的影响。     

微量Ga元素对低银系无铅钎料抗氧化性能的影响

电子封装波峰焊从有铅到无铅的转换过程中,由于无铅钎料中锡含量比传统Sn37Pb钎料高,导致波峰焊过程中氧化渣的产生量很大。其不仅造成生产中的浪费,还会影响焊接质量。控制钎料氧化渣的产生量是当前无铅波峰焊技术必须要解决的一个重要问题。研究了目前常用的Sn-0.3Ag-0.7Cu无铅钎料在模拟波峰炉中的抗氧化情况。主要研究了微量Ga元素的加入对该钎料抗氧化性的影响。通过钎料的润湿实验和氧化锡渣的产出量的比较可以发现微量Ga元素的加入可以提高钎料的抗氧化性能,Ga元素的最佳含量是0.02%(质量分数),Sn-0.3Ag-0.7Cu-0.020Ga的抗氧化有效温度范围是320℃以下,有效时间控制在120 min以下。利用俄歇能谱AES分析表明,微量元素Ga在焊料表面富集,O原子浓度的降低。热力学分析表明:Ga元素会在合金中优先氧化,阻碍钎料的进一步氧化;动力学分析表明:在保护膜内高价Ga离子使表面层离子排列空位增加并使电导率降低,是产生抗氧化性的原因。     

Ultrasonic-Assisted Soldering of 5056 Aluminum Alloy Using Quasi-Melting Zn-Sn Alloy

To obtain sound butt-joints of 5056 aluminum alloy rods, ultrasonic-assisted soldering was conducted using Zn-18Sn and Zn-60Sn alloys. Each solder foil was inserted between rods of 5056 aluminum alloy. Ultrasonic vibration was propagated to faying surfaces at soldering temperatures below the liquidus temperature of the solder alloys, and then the samples were air cooled to room temperature. The optimum vibration time at the soldering temperature must be more than 2 seconds to have complete wetting and less than 4 seconds to avoid excessive dissolution of the 5056 alloy. The 5056 alloy joints soldered using quasi-melting. Zn-Sn alloys showed greater strength than the joints soldered at the temperatures over its respective liquidus temperature. As the soldering temperature was increased, the increased formation of the intermetallic compound Mg₂Sn or phases containing Mg generated by dissolution of 5056 into the solder layer decreased the joint strength. Ultrasonic-assisted soldering at an optimum temperature between solidus and liquidus of the Zn-Sn alloys is an important consideration for producing sound joints with sufficient strength.     

Density and Dynamic Viscosity of Sn,Sn–Ag,and Sn–Ag–Cu Liquid Lead-Free Solder Alloys

Powder Metallurgy and Metal Ceramics - Traditionally, the soldering process was carried out, applying mainly lead-based solder materials. However, the prohibition against using lead (Pb) in...     

Oxidized resin acids in aerosol derived from rosin core solder

Exposure to rosin during a variety of uses has been associated with dermal and pulmonary sensitization. Oxidized resin acids are present in many rosin products, and have been regarded as the main sensitizing rosin compounds in cases of dermal sensitization. This research describes oxidized resin acids identified in aerosol produced during soldering with rosin core solder. Oxidized resin acids found were 7-oxodehydroabietic acid, 15-hydroxydehydroabietic acid, and 7-hydroxydehydroabietic acid. The presence of oxidized compounds known to be dermal sensitizers in aerosol from rosin flux soldering supports the hypothesis that resin acid compounds are pulmonary sensitizers as previously proposed. Changes in the composition of resin acid aerosol derived from heated rosin core solder (compared with the parent material) are described.     

Heat flux transients at the solder/substrate interface in dip soldering

In the present work an experimental set-up was designed to simulate the dip soldering conditions. The set-up was used to estimate heat flux transients at the solder/substrate interface during solidification of Sn 3.5Ag solder against copper substrate. The inverse heat conduction problem (IHCP) was solved in the substrate region for estimation of heat flux transients. A reasonably good agreement between measurements and model predictions was achieved validating the inverse model. The computer code developed in the present study could be used to assess the effect of process variables on contact heat flux at the solder/substrate interface.     

高炉钻头的工艺及改进措施

根据高炉开铁口钻的工作条件,选择钻头结构材料,包括钢材、硬质合金、钎料、焊剂。采用感应钎焊工艺,钻头性能满足钢铁厂开口作业要求,通过产品跟踪分析钻头报废形式,通过改进措施完善钻头设计、钎焊工艺。     

News in the soldering of different materials

The thermal and mechanical properties of a diffusion-hardening solder intended for flux-free soldering of different materials with the additions that decrease the thermal expansion coefficient are considered.     

Study of the interaction of silver-containing solders with a composite material based on dense forms of boron nitride

A solder of the composition Ag-Cu-Sn-Ti is developed based on dense forms of boron nitride; it is adhesion-active with respect to polycrystals. Strength tests, X-ray phase analysis of polycrystals, and complex metallographic and X-ray microspectral investigations into the fracture region using a scanning electron microscope are carried out. As a result, it is revealed that a solder containing 10% Ti is the optimum. The optimum soldering temperature is 950°C.     

Solidification Condition Effects on Microstructures and Creep Resistance of Sn-3.8Ag-0.7Cu Lead-Free Solder

Metallurgical, mechanical, and environmental factors all affect service reliability of lead-free solder joints and are under extensive study for preparation of the transition from Sn-Pb eutectic soldering to lead-free soldering in the electronic industry. However, there is a general lack of understanding about the effects of solidification conditions on the microstructures and mechanical behavior of lead-free solder alloys, particularly on the long-term reliability. This study attempts to examine the creep resistance of the Sn-Ag-Cu eutectic alloy (Sn-3.8Ag-0.7Cu, SAC387) with a variety of solidification conditions with cooling rates ranging from 0.3 °C/s to 17 °C/s. Results indicate that solidification conditions have a major influence on the creep resistance of SAC387 alloy; up to two orders of magnitude change in the steady-state creep rates were observed at low stress levels. An understanding of the mechanical property change with microstructures, which are determined by the solidification conditions, should shed some light on the fundamental deformation and fracture mechanisms of lead-free solder alloys and can provide valuable information for long-term reliability assessment of lead-free solder interconnections. This article is based on a presentation made in the symposium entitled “Solidification Modeling and Microstructure Formation: in Honor of Prof. John Hunt,” which occurred March 13–15, 2006 during the TMS Spring Meeting in San Antonio, Texas, under the auspices of the TMS Materials Processing and Manufacturing Division, Solidification Committee.     

Microstructural analysis of lead-free solder alloys

Among the many issues related to the performance of lead-free solder alloys, the dependence of their mechanical properties on the microstructure and the stability of the microstructure stability are some of the most important issues. A comprehensive understanding of the process-microstructure-property relationships is essential. Toward that goal, a microtextural analysis is performed using orientation imaging microscopy (OIM) for alloy Sn-3.8Ag-0.7Cu (wt pct) processed at four different temperatures. Sn-3.8Ag-0.7Cu is one of the most promising lead-free solder alloys that has shown superior mechanical properties to other candidate lead-free solder alloys. However, a comprehensive understanding of their microstructure and the dependence of microstructure on processing conditions are still lacking. In the present work, a detailed microstructure characterization with respect to phase compositions, grain size and size distributions, texture, and orientation relationships between various phases are performed. The measured microstructural features are correlated with the soldering temperatures.