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为提高化学镀铜的沉积速度和镀层质量,采用三烷醇胺兼作Cu~(2+)络合剂和沉铜加速剂,并利用铁离子化合物释放出的Fe~(2+)或Fe~(3+),可以有效地引发镀液的化学镀反应。 相似文献
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化学镀多功能铜镀层在电子工业中的应用 总被引:4,自引:0,他引:4
李音 《电子工业专用设备》1998,27(2):27-29,54
论述了多功能铜镀层化学镀液成份的作用及对镀层的影响,并叙述其组成、镀层的表面形态及其在电子工业中的应用。 相似文献
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论述了多功能铜镀层化学镀液成分的作用及对镀层的影响。多功能铜镀层的组成,镀层的表面形态以及多功能铜镀层在电子工业中的应用。 相似文献
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化学镀铜工艺中内层铜的可靠性 总被引:1,自引:0,他引:1
文章作者Crystal Li是罗门-哈斯电子材料亚洲有限公司(香港)电路板技术集团的研究技师。文章主要介绍化学镀铜过程中-目前做通孔或盲孔金属化最常用的制程,可能会影响PcB互联缺陷的一些因素。印制电路板的绝缘材料,其热膨胀系数高于铜材料。因此当焊接使温度升高时,介质的延展大大超过铜的延展。因此,导致增加的应力加到了内层互连的各个表面上。镀铜的通孔和内层铜之间必须要有非常强的结合力,才能使PCB成功地发挥其作用。如果化学镀铜和铜之间或内层化学镀铜和电解铜之间的结合力非常差,热应力就会导致互连缺陷(ICD)发生。 相似文献
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介绍了无电解镀镍的应用领域,研究了Ni-P镀层在各种应用环境下的耐蚀性能及在油田管路上的应用,并研究了Ni-P-PTFE镀层的性能开发及应用前景。 相似文献
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T.K. Tsai S.S. Wu W.L. Liu S.H. Hsieh W.J. Chen 《Journal of Electronic Materials》2007,36(11):1408-1414
In this work, an electroless CoWP film deposited on a silicon substrate as a diffusion barrier for electroless Cu and silicon
has been studied. Four different Cu 120 nm/CoWP/Si stacked samples with 30, 60, 75, and 100 nm electroless CoWP films were
prepared and annealed in a rapid thermal annealing (RTA) furnace at 300°C to 800°C for 5 min. The failure behavior of the
electroless CoWP film in the Cu/CoWP/Si sample and the effect of CoWP film thickness on the diffusion barrier properties have
been investigated by transmission electron microscopy (TEM), scanning electron microscopy (SEM), X-ray diffraction (XRD),
and sheet resistance measurements. The composition of the electroless CoWP films was 89.4 at.% Co, 2.4 at.% W, and 8.2 at.%
P, as determined by energy dispersive X-ray spectrometer (EDS). A 30 nm electroless CoWP film can prevent copper penetration
up to 500°C, and a 75 nm electroless CoWP film can survive at least up to 600°C. Therefore, increasing the thickness of electroless
CoWP films effectively increases the failure temperature of the Cu/CoWP/Si samples. The observations of SEM and TEM show
that interdiffusion of the copper and cobalt causes the failure of the electroless CoWP diffusion barriers in Cu/CoWP/Si during
thermal annealing. 相似文献
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化学镀镍合金在电子工业中的应用 总被引:5,自引:0,他引:5
对化学镀镍合金铁工艺和性能特性及其在电子工业中的应有委展现状作了评述。化学镀镍合金具有镀层均匀,适用基材广,结合力高,硬度高,优良的耐磨、耐蚀性,可焊性好和特殊的电磁性能等特性,在电子工业中获得了广泛的应用。文中着重介绍了化学镀镍合金在磁盘、电磁屏蔽、微电路、半导体、连接器及薄膜电阻上的应用情况。这些案例说明,合理应用化学镀镍合金技术,有利于提高电子元器件的质量,降低成本,促进技术进步。 相似文献
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Electroless plating of copper on AZ31 magnesium alloy substrates 总被引:1,自引:0,他引:1
Chemical surface preparation for copper film on magnesium alloy by both electroless plating and organic coatings was studied. Organic coating was made by immersing the samples into an organosilicon heat-resisting varnish. A subsequent metallization process verified the applicability of this method. In this method, the organic coating acted as an interlayer between the substrate and copper film. When the reaction started, copper deposited directly onto the interlayer surface. X-ray diffraction and SEM analysis were used to understand the composition and morphology of the interlayer and copper film. The copper film has a rather perfect crystalline structure. And the result of the cross-cut test indicates the adhesion between the substrate is good enough. The potentiodynamic polarization curves for corrosion studies of coated magnesium alloys were performed in a corrosive environment of 3.5 wt% NaCl at neutral pH 7. The result reveals that compared with the substrate, the corrosion resistance of the coated AZ31 magnesium alloys increases distinctly. Moreover, the copper film has perfectly antibacterial and decorative properties. The method proposed in this work is environmentally friendly: non-toxic chemicals are used. In addition, this provides a new concept for plating the metals, which are considered difficult to plate due to high reactivity. 相似文献
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超声波在陶瓷基片化学镀铜中的作用研究 总被引:3,自引:0,他引:3
采用了将超声辅助化学镀铜工艺与传统化学镀铜工艺对比的方法,研究了超声波辅助处理在陶瓷基片化学镀铜(包括前处理)中的作用,结果表明:超声波辅助处理影响化学镀铜的全过程,具体体现为:超声波辅助除油及粗化处理有利于形成致密、表面平整度高的铜层、超声波辅助敏化和活化处理使铜层表面的平整度下降,超声波辅助处理对化学镀中铜的均匀沉积不利。同时分析了超声波辅助处理对沉积速率及铜层显微硬度的影响。 相似文献
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In this paper, the electrochemical reaction mechanism is used to develop a mathematical model for an electroless nickel plating
process of plated-through-hole board. The model is calibrated against experimental data and the result, which is in good agreement
with measured data, applied for state estimation of the unobservable processes. The electrical, chemical, and board parameters
are estimated from measurements that are standard in the nickel plating industry. 相似文献
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化学镀镍铜磷在钕铁硼表面处理上的应用研究 总被引:5,自引:0,他引:5
为提高钕铁硼表面镀层的耐蚀性,使其具有更高的经济附加值,采用在化学镀镍磷合金液中添加适量的铜离子及其复合络合剂,制得镍铜磷三元合金。研究了镍离子、铜离子、次亚磷酸钠、复合络合剂添加量,沉积温度、pH值对合金镀层沉积速度的影响。利用中性盐雾试验比较了其与电镀镍、化学镀镍磷合金的耐蚀性能。结果表明:化学镀镍铜磷合金能明显提高钕铁硼表面处理后的耐蚀能力。 相似文献