Synthesis of thermostable nomex copoly(amide–imide) and their properties

Thermostable Nomex copoly(amide–imide)s with inherent viscosity of 0.72–1.31 dL/g were synthesized by reacting diacid-terminated Nomex prepolymer with various diisocyanate-terminated polyimide prepolymers. The polyimide prepolymer was prepared by using 4,4′-diphenylmethane diisocyanate to react with 3,3′,4,4′-benzophenonetetracarboxylic dianhydride, pyromellitic dianhydride, or 3,3′,4,4′-sulfonyl diphthalic anhydride using a direct one pot method in order to improve their solubility. The copolymers, except B-1, P-1, P-2, D-1, and D-2, could be dissolved in N, N-dimethylacetamide +5% lithium chloride at room temperature or dimethyl sulfoxide at high temperature but were not soluble in N,N-dimethylformamide or pyridine. The solubility is considered to be related to their crystallinity. Those copolymers with crystalline structure displayed poor solubility. All the Nomex copoly(amide–imide)s had glass transition temperatures in the range of 223–352°C and showed a 10% weight loss temperature of 438–574°C in air and 441–585°C in nitrogen atmosphere. The tensile strength, elongation at break, and initial modulus of polymer films ranged 63–118 MPa, 4–9% and 1.67–2.53 GPa, respectively. From the X-ray diffraction studies, copolymers of B-1, P-1, P-2, D-1, and D-2 with high content of PmIA showed a crystalline structure, but the others only displayed an amorphous morphology. © 1996 John Wiley amp; Sons, Inc.     

Synthesis of aromatic poly(amide-imide) copolymers containing para–meta benzoic structure

Thermostable poly(amide-imide)s containing para–meta benzoic structure were synthesized by reacting a para–meta benzoic polyamide prepolymer with various diisocyanate-terminated polyimide prepolymers. The polyamide prepolymers were prepared by first reacting m-phenylene diamine and isophthaloyl dichloride to form a poly(m-phenylphthalamide) prepolymer, then the terephthaloyl dichloride was subsequently added to form a para–meta benzoic polyamide prepolymer. The polyimide prepolymers were also prepared by using 4,4′-diphenylmethane disocyanate to react with pyromellitic dianhydride, 3,3′,4,4′-benzophenonetetracarboxylic dianhydride, or 3,3′,4,4′-sulfonyldiphthalic anhydride using the direct one-pot method to improve their solubility, but without sacrificing thermal and physical properties. From the experimental results, the inherent viscosity of the copolymers was 0.72–1.15 dL/g and they were readily soluble in a wide range of organic hot solvents such as N-methyl-2-pyrrolidone, dimethylimidazole, N,N-dimethylacetamide, dimethyl sulfoxide, and N,N-dimethylformamide; however, some of the copolymers were not soluble in pyridine. The solubility was related to their chemical structure. Those copolymers with sulfonyl and high amide content displayed good solubility. All the poly(amide-imide)s had a glass transition temperature of 260–324°C, but the melting point did not vary much. The 10% weight loss temperatures were in a range of 463–580°C in nitrogen and 450–555°C in an air atmosphere. The tensile strength, elongation at break, and initial modulus of the copolymer films ranged from 59 to 102 MPa, 3.1 to 5.1%, and 1.52 to 3.59 GPa, respectively. These copolymers, except those of high imide content (e.g., P-6, B-4, B-6 and D-6), which showed an amorphous structure, mostly display a crystalline morphology. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 2671–2679, 1999     

Synthesis of aromatic poly(urea‐imide) with heterocyclic side‐chain structure

The poly(urea‐imide) copolymers with inherent viscosity of 0.81–1.08 dL/g were synthesized by reacting aryl ether diamine or its polyurea prepolymer with various diisocyanate‐terminated polyimide prepolymers. The aryl ether diamine was obtained by first nucleophilic substitution of phenolphthalein with p‐chloronitrobenzene in the presence of anhydrous potassium carbonate to form a dinitro aryl ether, and then further hydrogenated to diamine. The polyimide prepolymers were prepared by using 4,4′‐diphenylmethane diisocyanate to react with pyromellitic dianhydride, 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride, or 3,3′,4,4′‐sulfonyldiphthalic anhydride by using the direct one‐pot method to improve their solubility, but without sacrificing thermal property. These copolymers are amorphous and readily soluble in a wide range of organic solvents such as N‐methyl‐2‐pyrrolidone, dimethylimidazole, N,N‐dimethylacetamide, dimethyl sulfoxide, N,N‐dimethylformamide, m‐cresol, and sulfolane. All the poly(urea‐imides) have glass transition temperatures in the range of 205–240°C and show a 10 wt % loss at 326–352°C in nitrogen and 324–350°C in air. The tensile strength, elongation at break, and initial modulus of these copolymer films range from 42 to 79 MPa, 5 to 16%, and 1.23 to 2.02 GPa, respectively. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 74: 1719–1730, 1999     

Synthesis of thermostable polyamideimides and their properties

Thermostable polyamideimides with inherent viscosity of 1.02–1.50 dL/g were synthesized from reacting of diamine-terminated aromatic amide prepolymer with various diisocyanate terminated imide prepolymers. The imide prepolymer was prepared by using 4,4′-diphen-ylmethane diisocyanate to react with 3,3′,4,4′ benzophenonetetracarboxylic dianhydride, 3,3′,4,4′ sulfonyl diphthalic anhydride, or 4,4′-oxydiphthalic anhydride using the direct one-pot method to improve their solubility. Almost all of the polyamideimides were generally soluble in a wide range of organic solvents such as N,N-dimethylformamide, N,N-dimeth-ylacetamide, N-methyl-2-pyrrolidone, dimethyl sulfoxide, and pyridine at room temperature. Polymers with high imide content required high temperatures to dissolve. All polyamide-imides had a glass transition temperature of 223–352°C and showed a 10% weight loss temperature of 415–575°C in air and 424–583°C in nitrogen atmosphere. The tensile strength, elongation at break, and initial modulus of polymer films ranged from 61 to 108 MPa, 5 to 10% and 1.54 to 2.50 GPa, respectively. These copolymers were partly crystalline in structure as shown by X-ray pattern. © 1996 John Wiley & Sons, Inc.     

Preparation and properties of organo‐soluble polyimides based on 4,4′‐diamino‐3,3‐dimethyldiphenylmethane and conventional dianhydrides

4,4′‐Diamino‐3,3′‐dimethyldiphenylmethane was used to prepare polyimides in an attempt to achieve good organo‐solubility and light color. Polyimides based on this diamine and three conventional aromatic dianhydrides were prepared by solution polycondensation followed by chemical imidization. They possess good solubility in aprotonic polar organic solvents such as N‐methyl 2‐pyrrolidone, N,N‐dimethyl acetamide, and m‐cresol. Polyimide from 4,4′‐diamino‐3,3′‐dimethyldiphenylmethane and diphenylether‐3,3′,4,4′‐tetracarboxylic acid dianhydride is even soluble in common solvents such as tetrahydrofuran and chloroform. Polyimides exhibit high transmittance at wavelengths above 400 nm. The glass transition temperature of polyimide from 4,4′‐diamino‐3,3′‐dimethyldiphenylmethane and pyromellitic dianhydride is 370°C, while that from 4,4′‐diamino‐3,3′‐dimethyldiphenylmethane and diphenylether‐3,3′,4,4′‐tetracarboxylic acid dianhydride is about 260°C. The initial thermal decomposition temperatures of these polyimides are 520–540°C. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 72: 1299–1304, 1999     

Thermal and thermo‐oxidative degradation properties of poly(benzimidazole amide imide) copolymers

In this study, 3,3′‐dinitrobenzidine was first reacted with excess isophthaloyl chloride to form a monomer with dicarboxylic acid end groups. Two types of aromatic dianhydride, [viz., pyromellitic dianhydride (PMDA) and 3,3′,4,4′‐sulfonyldiphthalic anhydride (DSDA)] also were reacted with excess 4,4′‐diphenyl‐ methane diisocyanate (MDI) to form polyimide prepolymers terminated with isocyanate groups. The prepolymers were reacted further with the diacid monomer to form a nitro group–containing aromatic poly(amide imide) copolymers. The nitro groups in these copolymers were hydrogenated to form amine groups and cyclized at 180°C to form the poly(benzimidazole amide imide) copolymers in polyphosphoric acid (PPA), which acts as a cyclization agent. From the viscosity measurements, copolymer appeared to be a reasonably high molecular weight. From the differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA) measurements it was shown that the glass transition temperature of copolymers was in the range of ～270–322°C. The 10% weight loss temperatures were in the range of 460 ～ 541°C in nitrogen and ～441–529°C in air, respectively. The activated energy and the integration parameter of degradation temperature of the copolymers were evaluated with the Doyle‐Ozawa method. It indicated that these copolymers have good thermal and thermo‐oxidative stability with the increase in imide content. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 93: 2072–2081, 2004     

Synthesis and characterization of phosphorus containing aromatic poly(amide-imide)s copolymers for high temperature applications

A series of novel thermally stable poly(amide-imide)s (PAIs) based on non-coplaner diimide-diacid (DIDA) monomer is synthesized. These polymers are characterized by elemental analysis, FT-IR, ¹H-NMR, ¹³C-NMR and ³¹P-NMR spectroscopic techniques and their physical and thermal properties are also studied. Four different dianhydrides pyromellitic anhydride (PMDA)/3,3′,4,4′-benzophenone tetracarboxylic dianhydride (BTDA)/1,4,5,8-naphthalene tetracarboxylic dianhydride (NTDA)/4,4′-oxydiphthalic anhydride (ODPA) and amino acid l-tryptophan are used to synthesize DIDA. The polymerization of DIDA with phosphorus containing triamines having phenyl moieties gives poly(amide-imide)s. The synthesized polymers are obtained in high yield and possessed inherent viscosity in the range 0.66–0.98 dL/g. These polymers display higher solubility in polar aprotic solvents, such as DMSO, NMP and DMF. In addition, the absorption edge values (λ _o) obtained from their UV curves are determined, and all the resulting poly(amide-imide)s films exhibited high optical transparency. The glass transition temperature (T _g) of these polymers is recorded in the range 211–265 °C, initial decomposition temperature in excess of 435 °C and char yield at 800 °C in nitrogen ranged from 52 to 70 %. Wide angle X-ray diffraction showed that all the polymers are almost amorphous.     

Synthesis of thermally stable aromatic poly(imide amide benzimidazole) copolymers

3,3′‐Dinitrobenzidine was first reacted with excess m‐chlorophenyl acid to form a monomer with dicarboxylic acid end groups. Two types of aromatic dianhydrides (Pyromellitic diconhydride (PMDA) and 3,3′,4,4′‐sulfonyl diphthalic anhydride) were also reacted with excess 4,4′‐diphenylmethane diisocyanate to form polyimide prepolymers terminated with isocyanate groups. The prepolymers were further extended with the diacid monomer to form nitro groups containing aromatic poly(imide amide). The nitro groups in these copolymers were hydrogenated to form amine groups and then were cyclized at 180°C to form poly(imide amide benzimidazole) in poly(phosphoric acid), which acted as a cyclization agent. The resultant copolymers were soluble in sulfuric acid and poly(phosphoric acid), in sulfolane under heating to 100°C, and in the polar solvent N‐methyl‐2‐pyrrolidone under heating to 100°C with 5% lithium chloride. According to wide‐angle X‐ray diffraction, all the copolymers were amorphous. According to thermal analysis, the glass‐transition temperatures of the copolymers were 270–322°C. The 10% weight‐loss temperatures were 460–541°C in nitrogen and 441–529°C in air. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 90: 1435–1444, 2003     

Synthesis,characterization, and gas permeability of aromatic polyimides containing pendant phenoxy group

A diamine containing a pendant phenoxy group, 1-phenoxy-2,4-diaminobenzene, was synthesized and condensed with different aromatic dianhydrides [4,4′-oxydiphthalic dianhydride, 4,4′-(hexafluoroisopropylidene)diphthalic anhydride, 3,3′,4,4′-benzophenone tetracarboxylic dianhydride, 3,3′,4,4′-biphenyltetracorboxylic dianhydride, and pyromellitic dianhydride] by one-step synthesis at a high temperature in m-cresol to obtain polyimides in high yields. Most of the polyimides exhibited good solvent solubility and could be readily dissolved in chloroform, sym-tetrachloroethane, N,N-dimethylformamide, N,N-dimethylacetamide, and nitrobenzene. Their inherent viscosities were in the range of 0.33–1.16 dL/g. Wide-angle X-ray spectra revealed that these polymers were amorphous in nature. All these polyimides were thermally stable, having initial decomposition temperatures above 500°C and glass-transition temperatures in the range of 248–281°C. The gas permeability of 4,4′-oxydiphthalic dianhydride and 4,4′-(hexafluoroisopropylidene)diphthalic anhydride based polyimides was investigated with pure gases: He, H₂, O₂, Ar, N₂, CH₄, and CO₂. A polyimide containing a  C(CF₃)₂ linkage showed a good combination of permeability and selectivity. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci 2008     

Addition polyimide adhesives containing various end groups

Addition polyimide oligomers have been synthesized from 3,3′,4,4′-benzophenone tetracarboxylic acid dianhydride and 3,3′-methylenedianiline using a variety of latent crosslinking groups as end-caps. The nominal 1300 molecular weight imide prepolymers were isolated and characterized for solubility in amide, chlorinated and ether solvents, melt-flow and cure properties, glass transition temperature, and thermal stability on heating in an air atmosphere. Adhesive strengths of the polyimides were obtained both at ambient and elevated temperatures before and after aging at 232°C. Properties of the novel addition polyimides were compared to a known nadic end-capped adhesive, LARC-13.     

Synthesis of highly soluble and transparent polyimides

A novel aromatic diamine, 3,3′‐diisopropyl‐4,4′‐diaminophenyl‐4″‐methyltoluene with a 4‐methylphenyl pendant group and isopropyl side groups, was designed and synthesized in this study. Then it was polymerized with various aromatic dianhydrides including pyromellitic dianhydride, 3,3′,4,4′‐biphenyltetracarboxylic dianhydride, 4,4′‐oxydiphthalic anhydride, 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride and 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride via a one‐pot high temperature polycondensation procedure to produce a series of aromatic polyimides. These polyimides exhibited excellent solubility even in common organic solvents, such as chloroform and tetrahydrofuran. The flexible and tough films can be conveniently obtained by solution casting. The films were nearly colorless and exhibited high optical transparency, with the UV cutoff wavelength in the range 302–365 nm and the wavelength of 80% transparency in the range 385–461 nm. Moreover, they showed low dielectric constants (2.73–3.23 at 1 MHz) and low moisture absorption (0.13%–0.46%). Furthermore, they also possessed good thermal and thermo‐oxidative stability with 10% weight loss temperatures (T_10%) in the range 489–507 °C in a nitrogen atmosphere. The glass transition temperatures of all polyimides are in the range 262–308 °C. Copyright © 2012 Society of Chemical Industry     

Dynamic mechanical properties of quinazolone–imide block copolymer

Dynamic mechanical properties have been investigated over the temperature range of?150–360°C for the quinazolone–imide copolymers, prepared by condensation of the amine-terminated quinazolone prepolymer with a stoichiometric quantity of pyromellitic dianhydride or 3,3′,4,4′-benzophenone-tetracarboxilic dianhydride. Both copolymers have, respectively, the low-temperature β-relaxation and the β^*-relaxation, as well as the case of poly(4,4′-oxydiphenylene–pyromellite-imide) (Kapton) examined for comparison. These relaxations seem to contribute to toughness of the copolymers. The α-relaxations for both copolymers occurred at much the same temperature of 320°C, which can be assigned to a large scale segmental motion of the quinazolone chain sequence. The α-peak temperatures shifted into higher temperatures by heat aging. This can be explained in terms of crosslinking in the copolymers, supported by swelling test in hot m-cresol and IR spectroscopy.     

Reduction and cyclization to form poly(benzimidazole amide imide) copolymers

Poly(amide imide) copolymers were synthesized with different molar ratios of 4,4‐diphenylmethane diisocyanate, two types of aromatic dianhydrides (pyromellitic dianhydride (PMDA) and 3,3′,4,4′‐sulfonyl diphthalic anhydride (DSDA)), and a diacid, which was derived from 3,3′‐dinitrobenzidine and isophthaloyl chloride in a previous work. In this study, the copolymers were further reacted with a reducing agent, and the nitro groups in the copolymers were hydrogenated into amine groups. Then, the amine‐group‐containing poly(amide imide) copolymers were cyclized at 180°C to form the poly(benzimidazole imide amide) copolymers in poly(phosphoric acid), which acted as a cyclizing agent. The resultant copolymers were soluble in sulfuric acid and poly(phosphoric acid) at room temperature and in sulfolane or N‐methyl‐2‐pyrrolidone under heating to 100°C with 5% lithium chloride. According to wide‐angle X‐ray diffraction, all the copolymers were amorphous. According to thermal analysis, the glass‐transition temperature ranged from 270 to 322°C, and the 10% weight‐loss temperature ranged from 460 to 541°C in nitrogen and from 441 to 529°C in air. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 91: 378–386, 2004     

Preparation and characterization of soluble copoly(aryl ether ketone)s containing hindering structures

New copoly(aryl ether ketone)s have been synthesized by polycondensation of 2,2′,3,3′,6,6′‐hexaphenyl‐4,4′‐diphenol, 2,2′‐p‐hydroxyphenyl‐iso‐propane, and 4,4′‐difluorobenzophenone. The technology of ¹³C‐NMR was used to determine contents of the two bisphenols in the copolymers. Chain structure was characterized by illustrating average block length (L_A, L_C) in terms of portion of the triads (AKA, CKC, AKC). The obtained copoly(aryl ether ketone)s have the properties of excellent solubility, high heat‐resistance, good tensile strength, and good selectivity for gas permeability. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 78: 20–24, 2000     

Preparation and properties of novel fluorinated polyimides based on 2,2′,6,6′-tetrafluorobenzidine

Fluorinated polyimides were prepared from 2,2′,6,6′-tetrafluorobenzidine and four conventional dianhydride monomers by a solution polycondensation reaction followed by a chemical imidization. Polyimide based on 2,2′,6,6′-tetrafluorobenzidine and hexafluoroisopropylidene bis(3,4-phthalic anhydride) (6FDA) is soluble in organic solvents such as NMP, DMA, DMF, THF, chloroform, and acetone while those based on 2,2′,6,6′-tetrafluorobenzidine and pyromellitic dianhydride (PMDA), benzophenone-3,3′,4,4′-tetracarboxylic acid dianhydride (BTDA), diphenylether-3,3′,4,4′-tetracarboxylic acid dianhydride (ETDA) are not. Polyimide from 2,2′,6,6′-tetrafluorobenzidine and 6FDA possesses high optical transparency at 350–700 nm and has a in-plane refractive index of 1.558 at 632.8 nm. All polyimides exhibit glass transition temperatures above 350°C. They also possess very high thermal stability. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 70: 1605–1609, 1998     

Structure and properties for conterminously linked polymer of copoly(amic acid) with triallyl isocyanurate and bismaleimide

The copoly(amic acid)s were prepared from two various diamines 2,2′‐bis (4‐aminophenoxy phenyl) hexafluoropropane or 2,2′‐bis (4‐aminophenoxy phenyl) propane and amine‐terminated oligosiloxane, respectively, with aromatic tetracarboxylic dianhydride (3,3′,4,4′‐benzophenone tetracarboxylic dianhydride). The resulted copoly(amic acid) with various mole ratio of triallyl isocyanurate (TAIC)/4,4′‐bismaleimidophenylmethane (BMI) were subsequently thermally imidized to the corresponding copolyimides. These polymers were characterized using viscometer, differential scanning calorimetry, thermogravimetric analyses, dynamic mechanical analysis (DMA), dielectric analyzer, and scanning electron microscope. The dielectric constant (D_K) and dissipation factor (D_f) of copolyimides with TAIC/BMI were much lower than that of copolyimides without TAIC/BMI. Furthermore, the formation of copolyimides also would enhance their thermal stability and solubility. DMA of copolymers showed only a glass transition temperature (T_g), indicating a random structure and an amorphous state. The morphology of copolyimides revealed no phase separation. This indicates that the homogeneous state has been achieved in this coreaction system. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Synthesis and characterization of novel borosiloxane‐containing aromatic copolyimides with excellent thermal stability and low coefficient of thermal expansion

The properties of borosiloxane‐containing copolyimides with borosiloxane in the main chain and in the side chain were studied. Two series of borosiloxane‐containing copolyimides were synthesized by the reaction of 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (s‐BPDA ) and 2,3′,3,4′‐biphenyltetracarboxylic dianhydride (a‐BPDA ) with p ‐phenylenediamine (PDA ), 4,4′‐oxydialinine (4,4′‐ODA ) and different borosiloxane diamine monomers (BSiAs ). The synthesized borosiloxane‐containing copolyimides exhibited better solubility than borosiloxane‐free copolyimides and showed high glass transition temperatures (320–360 °C), excellent thermal stability (570–620 °C for T ₁₀), great elongation at break (10% ? 14%) and a low coefficient of thermal expansion (14–24 ppm °C^?1). More specifically, the copolyimides containing BSiA‐2 formed nano‐scale protrusions and the copolyimides containing BSiA‐1 formed micro‐scale protrusions. The contact angles of the copolyimides increased from 72° for neat copolyimide to 96° for 5% of borosiloxane in the main chain of the copolymer up to 107° for 10% of borosiloxane in the side chain of the copolymer. © 2017 Society of Chemical Industry     

High-performance polymer films. III. Preparation and characterization

A series of polyimide and copolyimide films were prepared by film casting, drying, and thermal imidization from the respective precursor poly(amic acid) (PAA) and copoly(amic acid) solutions derived from two dianhydrides, pyromellitic dianhydride (PMDA) and 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA), and two diamines, 4,4′-oxydianiline (ODA) and a proprietary aromatic diamine (PD) as monomers. Depending on the solution's inherent viscosity value (molecular weight) and the nature of the polymer chains (derived from rigid or flexible monomers), precursor poly(amic acid) and copoly(amic acid) solution concentrations of 8–12% (w/w) were found to be suitable for the preparation of good quality polyimide/copolyimide films. The recovery of film toughness and creasability from the brittleness at the intermediate temperature of the cure cycle depended not only on the molecular weight of the precursor poly(amic acids)/copoly(amic acids) but also on their chain flexibility. The poly(amic acid) derived from both rigid dianhydride and diamine practically gave rise to a brittle film of polyimide even after curing to 360°C. The resulting polyimide and copolyimide films were compared with Du Pont's Kapton H film. The density of the films was in the range 1.39–1.42 g/cm³. The thickness of most of the films was in the range 20–30 μm. The HPF 3 film, based on PMDA–PD, appeared to be highly colored (reddish brown), and the HPF 2 film, based on BTDA–ODA, had the lightest yellow coloring among the films in this investigation, including Kapton H film. HPF 2, HPF 6, and HPF 8 films were more amorphous than the other films. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 82: 976–988, 2001     

Highly reflective polyimide films created by supercritical fluid infusion of a silver additive

Supercritical fluid infusion of a silver-containing additive [1,5-cyclooctadiene silver(I)-1,1,1,5,5,5-hexafluoroacetylacetonate] into a fully cured polyimide was achieved with moderately high-density carbon dioxide at 110°C for the first time. The polyimide was derived from 4,4′-oxydianiline and 3,3′,4,4′-benzophenone tetracarboxylic acid dianhydride. After infusion for approximately 60 min, the resulting film was then recured at 300°C in air. During this time, a silver mirror formed on both film surfaces. The nature of the silver and its distribution within the film and on the film surface were established via microscopy and surface analysis techniques. © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 64: 1309–1317, 1997     

Synthesis and thermal,mechanical and gas permeation properties of aromatic polyimides containing different linkage groups

Two series of aromatic polyimides containing various linkage groups based on 2,7‐bis(4‐aminophenoxy)naphthalene or 3,3′‐dimethyl‐4,4′‐diaminodiphenylmethane and different aromatic dianhydrides, namely 4,4′‐(4,4′‐isopropylidenediphenoxy)bis(phthalic anhydride), 4,4′‐(hexafluoroisopropylidene)bis(phthalic anhydride), 3,3′,4,4′ benzophenonetetracarboxylic dianhydride, 9,9‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]fluorene dianhydride and 4,4′‐(4,4′‐hexafluoroisopropylidenediphenoxy)bis(phthalic anhydride), were synthesized and compared with regard to their thermal, mechanical and gas permeation properties. All these polymers showed high thermal stability with initial decomposition temperature in the range 475–525 °C and glass transition temperature between 208 and 286 °C. Also, the polymer films presented good mechanical characteristics with tensile strength in the range 60–91 MPa and storage modulus in the range 1700–2375 MPa. The macromolecular chain packing induced by dianhydride and diamine segments was investigated by examining gas permeation through the polymer films. The relationships between chain mobility and interchain distance and the obtained values for gas permeability are discussed. © 2014 Society of Chemical Industry