轰击能量对离子束增强沉积Cr—N薄膜微观结构和硬度的影响

采用离子束增强沉积（ＩＢＥＤ）技术，在不同能量氮离子的轴助轰击下制备了Ｃｒ－Ｎ薄膜，通过ＳＥＭ观察、ＸＲＤ分析和显微硬度测定，发现离子轰击能量对Ｃｒ－Ｎ薄膜的表面形貌、相组成和硬度有显著的影响；随着能量的升高，膜表明形貌由岛形颗粒状转变成蜂窝状；一定能量轰击下获得的Ｃｒ２Ｎ和ＣｒＮ混相结合有最高的薄膜硬度；高达１６ｋｅＶ的氮离子轰击可诱发非晶化的出现，并对膜有一定的强化作用。在此基础上探讨了离子轰     

镍基合金上离子束辅助沉积双轴取向的YSZ膜—YBCO超导膜缓冲层

用双离子束辅助沉积（ＩｏｎＢｅａｍＡｓｉｓｔｅｄＤｅｐｏｓｉｔｉｏｎ，ＩＢＡＤ）方法在Ｎｉ－Ｃｒ合金上合成了具有（００ｌ）择优取向，平面双轴排列的ＹＳＺ膜（Ｙ２Ｏ３－ＺｒＯ２）作为ＹＢＣＯ超导膜缓冲层。辅助轰击离子束方向与衬底法线的夹角５４０左右时可获得最佳的（００ｌ）择优效果。８０００Ｃ高温退火后其结构有较大的改善。在其上用ＭＯＣＶＤ方法生长的ＹＢＣＯ膜的Ｔｃ＝８８Ｋ，Ｊｃ＝１０×１０４Ａ／ｃｍ２（０Ｔ，７７Ｋ），并且从Φ扫描的结果说明了ＹＳＺ缓冲层上ＹＢＣＯ膜的生长机制。     

离子束增强沉积制备TiB2薄膜及其性能研究

用离子束增强沉积法（ＩＢＥＤ）在硅及铜基体上沉积了ＴｉＢ２薄膜，研究了轰击离子束能量和束流对薄膜的微结构及力学性能的影响。用俄歇电子谱（ＡＥＳ）分析了膜的成分及其界面状况，用Ｘ射线衍（ＸＲＤ）研究了膜的微结构，并测定了膜的硬度及进行膜的高温氧化试验。结果指出：（１）离子束轰击使薄膜晶化，从而影响到膜的硬度及抗高温氧化性能；（２）离子呸增强的二硼化钛薄膜是一种耐高温氧化的高硬膜。     

IBAD薄膜与基体界面的显微结构

采用中能离子束辅助沉积（ＩＢＡＤ）技术，在单晶Ａｌ２Ｏ３（０００１）基片上沉积Ｍｏ膜，在ＧＡＡｓ（００１）基片上合成Ｆｅ１６Ｎ２薄膜，用ＨＲＥＭ等研究了Ｍｏｅａｊｄ－Ａｌ２Ｏ３（０００１），Ｆｅ１６ｎ２膜－ＧａＡｓ（００１）界面的显微结构，结果表明：Ｍｏ膜的晶粒呈细小柱状或纤维状，晶粒平均尺寸约８ｎｍ，Ｆｅ１６Ｎ２薄膜为等轴晶，晶粒平均尺寸约为１０ｎｍ，在Ｍｏ膜－Ａｌ２Ｏ３（０００１）界面及Ｆｅ１     

轰击能量对离子束增强沉积Cr-N薄膜微观结构和硬度的影响

采用离子束增强沉积（IBED）技术，在不同能量氮离子的辅助轰击下制备了Cr－N薄膜；通过SEM观察、XRD分析和显微硬度测定，发现离子轰击能量对Cr－N薄膜的表面形貌、相组成和硬度有显著的影响：随着能量的升高，膜表面形貌由岛形颗粒状转变成蜂窝状；一定能量轰击下获得的Cr2N和CrN混相结构有最高的薄膜硬度；高达16keV的氮离子轰击可诱发非晶化的出现，并对膜有一定的强化作用。在此基础上探讨了离子轰击能量对合成Cr－N薄膜结构与性能的影响效应。     

离子束辅助沉积制备的铁锆多层膜中的相演化

研究了用氩离子束辅助沉积（ＩＢＡＤ）技术制备的铁／锆多层膜中的微结构演化规律。实验中所使用的氩离子能量范围为４ｋｅＶ到１２ｋｅＶ,束流密度为１２μＡ／ｃｍ＾２。实验结果表明,用ＩＢＡＤ技术右在富锆端制备出完全非晶化的薄膜。对于Ｆｅ（０．５４ｎｍ）／Ｚｒ（４．５ｎｍ）多层膜,随Ａｒ离子能量的增加,在薄膜中还观察到晶态－非晶－亚稳ｆｃｃ相－非晶－晶态的结构转变。对于富铁合金膜,ＩＢＡＤ技术仅能制备部分非晶化的薄膜。     

离子束辅助沉积制备多晶Al2O3薄膜

利用电子枪蒸镀Ａｌ２Ｏ３，同时辅以Ａｒ离子轰击的离子束辅助沉积方法（ＩＢＡＤ）制备Ａｌ２Ｏ３薄膜，并与单纯电子枪蒸镀方法（ＰＶＤ）制备的薄膜进行了结构和表面形貌的比较，ＩＢＡＤ法可以得到结构均匀致密的γ－Ａｌ２Ｏ３晶态薄膜，而ＰＶＤ９方法仅能得到非晶态疏松的结构，分析结果表明，薄膜沉积过程中，提高离子轰击能量和增加基片加热温度在一定程度上具有相同的效果。     

镀膜参数对离子束增强沉积氮化硼薄膜中立方相含量的影响

本文介绍用离子束增强沉积（ＩＢＥＤ）法在硅片上制备氮化硼（ＢＮ）薄膜及镀膜参数对膜中立方氮化硼（ｃ－ＢＮ）含量的影响的试验研究，主要研究轰击离子束密、镀膜速率、轰击束中氩气的含量及衬底温度的影响。用红外（ＩＲ）谱对膜进行了分析，结果指出：（１）在给定的轰击束能量与束密下氮化硼薄膜中立方相的含量是随镀膜速率而变化的，且存在一个最佳镀膜速率值；（２）提高离子轰击束密，则此最佳镀膜速率值也相应增大；（３）镀膜速率又是随轰击束密及轰击束中氩气含量的增大而减小的；（４）衬底温度在４００℃以下时，膜中ｃ－ＢＮ相的含量随温度提高而增加。     

高分子p—n异质结太阳电池的研究

用合成的十二烷基苯磺酸（ＤＢＳＡ）掺杂的聚苯胺（ＰＡｎ）导电材料和Ｂｅｉ染料组合，采用涂覆技术，研制成ＳｎＯ２／ＰＡｎ膜／Ｂｅｉ染料薄层／Ａｌ栅电极结构和Ａｌ／ＰＡｎ导电基片／Ｂｅｉ染料薄层／Ａｌ栅电极结构的ｐ－ｎ异质结太阳电池，测定了该电池的光电效应和伏安特性，在４．７２ｍＷ／ｃｍ＾２的氙灯照射下，开路电压Ｖｏｃ达４００ｍＶ短路电流Ｉｓｃ为１０μＡ，填充因子可达５７．４％，光电转换效率为０．０９     

溅射共沉积GaAs—SiO2复合薄膜的XPS研究

采用Ｘ射线光电子能谱（ＸＰＳ）研究了由ＧａＡｓ和ＳｉＯ２组成的复合靶共溅射沉积的ＧａＡｓ－ＳｉＯ２复合薄膜的Ｇａ、Ａｓ和Ｓｉ的化学结合状态及其沉积时的基片温度对其影响。结果表明：Ｇａ、Ａｓ和Ｓｉ分别主要是以ＧａＡｓ和ＳｉＯ２的化学组态存在于复合薄膜之中，但当沉积时基片温度上升到一定值后（我们实验中为４００℃），有部分的Ｇａ和Ａｓ被氧化，其氧化量随着基片温度的进一步升高而上升。沉积的ＳｉＯ２中存在着少量的缺氧缺位。     

纳米Al2O3电泳沉积成膜的影响因素研究

为研究电泳沉积薄膜沉积量分布特征及影响因素,对纳米Al_2O_3材料进行电泳沉积薄膜试验和仿真研究。试验过程中,对纳米Al_2O_3薄膜沉积的微观形貌、成分及沉积量与电压、沉积时间关系进行了研究;在仿真研究过程中,利用电场、流场、沉积场多场耦合技术研究分析了电场分布、流场特性、沉积时间等对电泳沉积纳米Al_2O_3薄膜的影响。结果表明:电场在阴极正、反两侧强弱分布使得正面沉积量明显大于反面,同时流场的涡流分布特征加速了粒子在阴极边缘沉积。仿真结果与试验结果吻合度较好,验证了仿真模型的有效性,为进一步研究电泳沉积流体流动特性和沉积过程提供了一种新的研究方法和手段。     

Kinetic Study of SiO2/S Coating Deposition by APCVD

To alleviate catalytic coking on the inner surface of radiant tube for ethylene production in petrochemical plants,SiO2/S coatings were deposited on HP40 alloy specimens using dimethyldisulfide （DMDS） and tetraethoxysilane （TEOS） by atmospheric pressure chemical vapor deposition （APCVD）. A two-dimension mathematical model was made to predict the growth rate of SiO2/S coating and to study the effects of deposition parameters on the deposition rate. The results show that the predicted deposition rate is in good agreement with the experimental one. The deposition rate mainly depends on the concentrations of precursors in the total gas flow, concentrations of intermediates on the deposition surface, total gas flow rate and deposition temperature. The weight of SiO2/S coating linearly increases with the deposition time. When the gas flow rate is below 0.3 m/s, the rate-limiting step of SiO2/S coating deposition is the diffusions of intermediates.However, the surface reactions of intermediates will be the rate-limiting step after the gas flow rate is above 0.3 m/s. When the deposition temperature is below 780℃, the rate-limiting step of SiO2/S coating deposition mainly depends on the surface reactions of intermediates. When the deposition temperature is above 780℃,the rate-limiting step depends on the diffusions of intermediates. The deposition rate increases with increasing the concentrations of the intermediates. However, when the partial pressures of the intermediates reach 8 Pa,the deposition rate keeps constant.     

Stress reduction for hard amorphous hydrogenated carbon thin films deposited by the self-bias method

Hard amorphous hydrogenated carbon (a-C:H) thin films were deposited by the r.f. (13.56 MHz) self-bias method using 2-methyl-propane as the source gas. To achieve stress reduction, we used the periodic plasma deposition technique: repeated cycles of alternating 5 s of deposition (plasma on) with 180 s of cooling (plasma off). Substrate temperature changes during the plasma deposition were monitored by a fluorescent/ optical thermosensor. We investigated the film deposition rate, density, and internal stress as functions of the deposition temperature.

We found a linear relationship between the internal stress of a-C:H films and the deposition temperature over the range of 0 to 150 °C. The increase in internal film stress from 0.48 to 1.5 GPa, respectively, over this deposition temperature range is the result of the increase in deposition temperature. Within the range of deposition temperature and r.f. power parameters studied, the deposition temperature appeared to play a more significant role in determining the intrinsic film stress than the r.f. power.     

Analysis of Discontinuous Bead Formation by PTAW Process

This research investigates the effects of input parameters on discontinuities in bead formation during material deposition by the plasma transferred arc welding (PTAW) process. Experiments based on L27 orthogonal array have been carried out by deposition of stainless steel powder (SS304 L) on stainless steel plate (SS316). Three types of depositions have been observed, namely continuous, partially continuous and discontinuous deposition. A process map has been developed, based upon powder and energy deposition per length, where the above-mentioned three types of depositions are distributed. The discontinuities in the deposition can be overcome by increasing the energy deposition per length or by reducing the powder deposition per length.     

Ultrafast thermal plasma physical vapor deposition of thick SiC films

Thick silicon carbide films have been successfully deposited at a deposition rate of 125 nm/s on stationary graphite substrates by the thermal plasma physical vapor deposition technique, with ultrafine SiC powder fed into a hybrid plasma jet and completely evaporated. The relationship between the processing parameters and the morphology, deposition rate, composition and crystal structure has been investigated under the typical conditions of substrate temperature in the range of 1400–1700 °C and chamber pressure of 250 Torr, and compared with the results of rotating substrate deposition at the substrate temperature of around 750 °C. It was found that the deposition rate and composition showed different processing parameter dependences for rotating substrate deposition and stationary substrate deposition. The films showed dense cross-sections or cauliflower-like structures depending on the deposition conditions.

©2003 Elsevier Science Ltd. All rights reserved.     

Ultrafast thermal plasma physical vapor deposition of thick SiC films

Thick silicon carbide films have been successfully deposited at a deposition rate of 125 nm/s on stationary graphite substrates by the thermal plasma physical vapor deposition technique, with ultrafine SiC powder fed into a hybrid plasma jet and completely evaporated. The relationship between the processing parameters and the morphology, deposition rate, composition and crystal structure has been investigated under the typical conditions of substrate temperature in the range of 1400–1700 °C and chamber pressure of 250 Torr, and compared with the results of rotating substrate deposition at the substrate temperature of around 750 °C. It was found that the deposition rate and composition showed different processing parameter dependences for rotating substrate deposition and stationary substrate deposition. The films showed dense cross-sections or cauliflower-like structures depending on the deposition conditions.     

Evolutions of residual stress and microstructure in ZrO2 thin films deposited at different temperatures and rates

The residual stress in ZrO₂ thin films prepared by electron beam evaporation was measured by viewing the substrate deformation using an optical interferometer. The influences of deposition temperature and deposition rate on the residual stress have been studied. The results show that residual stress in ZrO₂ thin films varies from tensile to compressive depending on deposition temperature and deposition rate, respectively. The value of compressive stress increases with the increasing of deposition temperature and deposition rate. At the same time, X-ray diffraction measurement was carried out in order to examine the crystallization behavior of the ZrO₂ thin films as a function of deposition temperature and deposition rate. The relationship between the residual stress and the microstructure has also been discussed.     

沉积电压对水热电泳沉积硅酸钇涂层显微结构的影响

采用水热电泳沉积法在SiC-C/C复合材料SiC内涂层表面制备了硅酸钇抗氧化外涂层,并借助X射线衍射(XRD)、扫描电子显微镜(SEM)对涂层的相组成及显微结构进行了表征.讨论了沉积电压对硅酸钇涂层沉积量及显微结构的影响,并研究了不同沉积电压下涂层沉积量与时间的关系,同时测试了涂层试样的抗氧化性能.研究结果表明,随着沉积电压的升高,涂层的沉积量有所增加,涂层的致密性和均匀性也逐渐得到改善.当电压为210V时达到最佳,继续升高沉积电压,涂层的均匀性变差,当沉积电压为240V时,涂层出现明显开裂;不同沉积电压下涂层沉积量随时间呈抛物线变化;涂层在1500℃静态空气中经过10h氧化后,失重仍然小于2%.     

Sputtering power and deposition pressure effects on the electrical and structural properties of copper thin films

We investigated the effects of sputtering power and deposition pressure on the electrical and structural properties of dc magnetron sputter-deposited copper films on p-type silicon grown at room temperature. Results from our experiments showed that the deposition rate of the copper films increased proportionally with the sputtering power. Sputtering power also affected the structural properties of the copper films through the surface diffusion mechanism of the adatom. From the scanning electron microscopy surface analysis, the high sputtering power favored the formation of continuous film. The poor microstructure with voided boundaries as a result of low sputtering power deposition was manifested with the high resistivity obtained. The deposition rate was found also depending on the deposition pressure. The deposition pressure had the contrary effect on structural properties of copper films in which high deposition pressure favored the formation of voided boundaries film structure due to the shadowing effect, which varied with different deposition pressure.     

MASS SELECTED ION BEAM DEPOSITION: A TOOL FOR PARAMETRIC GROWTH STUDIES, PROCESS DEVELOPMENT AND FABRICATION OF DIAMONDLIKE FILMS

Diamondlike films have unique properties that can be tailored between those of diamond and those of graphite to meet industrial applications. The purpose of this review is to emphasize the ability to prepare films with specific properties through control of the deposition parameters. The three basic approaches, plasma deposition, chemical vapor deposition, and ion beam deposition, are presented. Since the first two methods consist of complex chemical-physical systems which limit the possibilities for controlled parametric studies, the focus herein is on the latter technique. This work presents the unique capabilities of mass-selected carbon ion beam deposition in controlling deposition parameters over a wide range, particularly when combined with in-situ analysis of film evolution. The role of different deposition parameters on diamond film growth is discussed. The Houston deposition system that manifests the above features is described. A summary of results of some ongoing experiments is given to demonstrate the system capabilities for both parametric studies of diamondlike film growth and actual production of diamondlike films.