The culture(s) of the technical communicator

The role of the technical communication practitioner stems from the need for members from two distinct professions to connect; for example, engineers have created some new technology, and users who are (assumedly) unfamiliar with the technology want or need to understand that technology. The article presents an interface between the two professions which proposes a reconceptualization of the relationship between technicians/engineers and users. This reconceptualization can and should be provided by technical communicators who create a culture which encompasses both the technician and the user. In addition, this reconceptualization parallels the means originally proposed by C. P. Snow (1959) to mend the rift between the sciences and the humanities     

Light-emitting diodes (l.e.d.s) as receivers with avalanche gain

We have observed avalanche gain in back-biased Burrus-type double-heterostructure light-emitting diodes operating as photodetectors. This effect may be very beneficial in a duplex transmission system using a single l.e.d. as both source and detector.     

Low-noise GaAs m.e.s.f.e.t.s

GaAs m.e.s.f.e.t.s with optimum noise figures of 1.6 dB at 6 GHz have been fabricated by projection photolithography. An equation has been developed for the calculation of optimum noise figure which gives good agreement between calculated and measured values.     

Quasienhancement-mode operation of transferred-electron logic devices (t.e.l.d.s)

A new mode of operation is discussed for transferred-electron logic devices. In the new mode, the device dissipation can be cut down considerably. Also, the stability of the operating characteristics of the device is improved substantially against bias-supply variations.     

Performance of GaAs power m.e.s.f.e.t.s

Power performance results at 4 GHz are summarised for GaAs m.e.s.f.e.t.s ranging in size from 4 to 16 mm gate periphery. A double-chip 16 mm unit operated at 24 V source-drain bias produced 13.5 W with 3 dB gain and 10.7 W with 8.1 dB gain. Although lack of perfect power and gain scaling is observed, the degradation in output power of the 16 mm devices was only 1 dB compared to the smaller devices.     

Micrometre-gate m.e.s.f.e.t.s on laser-annealed polysilicon

Schottky-barrier field-effect transistors (m.e.s.f.e.t.s) have been fabricated on uniformly doped laser-annealed polycrystalline silicon deposited on a silicon nitride insulator. The devices, which had aluminium Schottky-barrier gates and diffused n+ sources and drains but nonoptimised channel profiles, had about 65% the gm values of similar but optimised devices made on s.o.s. layers. Performance of these devices is considered adequate for certain innovative integrated-circuit technologies.     

Substrate conduction in GaAs m.e.s.f.e.t.s

Substrate currents in a gateless GaAs m.e.s.f.e.t. have been measured at d.c, 0.9 MHz and 2 GHz. The results are consistent with the assumption of substrate conduction at high frequencies and active-layer conduction alone at low frequencies.     

Avalanche noise in GaAs m.e.s.f.e.t.s

Instabilities in the d.c. characteristics of GaAs m.e.s.f.e.t.s for drain to source voltages greater than 4 V. believed to be due to reloading of traps in the interface between active layer and bulk material, or gunn-domain formation, seem to have their origin in avalanche breakdown of the back diode under the drain contact. Microplasma switching, vertical to the active layer, strongly modulates the drain current producing large broadband noise power.     

Modelling of Gunn-domain effects in GaAs m.e.s.f.e.t.s

GaAs m.e.s.f.e.t. [S22] values larger than unity have been measured from 1 to 10 GHz in the region where the ID/VD curves display a negative slope. An explanation of this phenomenon is proposed in terms of Gunn-domain formation. An equivalent-circuit model which includes this effect is presented and discussed.     

The equivalent separation(s) for the self-impedance of thin strips

The concept and computation of the equivalent separation and separations, which are useful in the evaluation of the self-impedance of an electrically thin strip of current, are described. The self-impedance involves the evaluation of an integral with a singular integrand. Using the concepts of equivalent filament separation and separations, it is shown that the self-impedance of the thin strip is equivalent to the mutual impedance between two or three parallel filaments, respectively. This avoids numerical integration near a singularity.     

Optimised doping profiles for speed-up of GaAs m.e.s.f.e.t.s

Simulation of m.e.s.f.e.t. logic cell shows that discharging of the gate depletion is significantly slower than the charging process. The transient response with the charging/discharging is analytically connected to arbitrary doping profiles. Specific profiles with a doping peak near the substrate boundary can reduce this discharging delay remarkably.     

High-yield self-alignment method for submicrometre GaAs m.e.s.f.e.t.s

A high-yield self-alignment technique for submicrometer GaAs m.e.s.f.e.t.s is described. This method allows the production of submicrometre gate lengths and source-drain spacings by means of standard contact photolithography without requiring a particularly fine geometry on the masks. A 0.5 ?m long gate and a source-drain spacing of 2 ?m were obtained.     

GaAs gigabit logic circuits using normally-off m.e.s.f.e.t.s

Normally-off GaAs m.e.s.f.e.t. logic circuits fabricated by electron beam lithography have exhibited excellent high speed switching characteristics. The highest switching speed evaluated from a 15-stage ring oscillator is 30 ps per gate with a power dissipation of 1.9 mW. Binary frequency dividers have been fabricated with D-type flip-flops operating up to 3 GHz. A divide-by-eight counter has also operated at 2.5 GHz.     

Femtojoule logic circuit using normally-off GaAs m.e.s.f.e.t.s

Experimental results are reported on the speed/power performance of normally-off-type GaAs-m.e.s.f.e.t. logic circuits, using an integrated 15-stage ring oscillator as a test circuit. A power consumption as low as 1-5 ?W, corresponding to a power-delay product of 1.6 fJ, was obtained. Conversely, a propagation delay time of 650 ps was measured for a power consumption of 20 ?W per gate.     

Modelling the m.e.s.f.e.t. output nonlinearity

Conditions governing the modelling of transductance and drain-conductance nonlinearities from measured data are investigated. A simple representation for regions close to pinch-off, corresponding to mixer operation, is obtained. Results of the modelling are compared to measurements on a typical 1 ?m gate length m.e.s.f.e.t.     

Bit synchronisation in Gbit/s range using dual gate GaAs m.e.s.f.e.t.s

Bit synchronisation at 1 and 2 Gbit/s including pulse width reduction is achieved using dual gate GaAs m.e.s.f.e.t.s. Circuits and time behaviour of input-, clock- and output signals are shown.     

P(o)schl-Teller势阱中二次谐波产生系数的计算

二阶非线性光学效应是非线性光学中人们发现最早,研究最多,应用最广的一个课题．在非对称性势阱中,二次谐波产生系数与势阱的形状及其非对称性程度有很大的关系。本文用量子力学中密度矩阵算符理论导出了Poschl-Teller势阱中二次谐波产生系数和解析表达式．考虑到在Poschl-Teller势阱中有两个可调参数κ和λ,并且势阱的形状与对称性随κ和λ取值的不同而明显不同,因此我们可以通过调节κ和λ的取值而获得Poschl-Teller势阱中的二次谐波产生系数的变化规律,并找到其最大值,从而为实验提供必要的研究方向与理论依据．     

Multi/demultiplexing in Gbit/s range using dual gate GaAs m.e.s.f.e.t.s

Multiplexing from 1 to 2 Gbit/s and corresponding demultiplexing from 2 to 1 Gbit/s including clock regeneration and pulse width reduction has been performed using dual gate GaAs m.e.s.f.e.t.s. Circuits and time behaviour of input, clock and output signals are shown.     

Effect of neutron and gamma irradiation on the low-frequency noise in GaAs m.e.s.f.e.t.s

Low-frequency noise in GaAs m.e.s.f.e.t.s has been measured from 2 kHz to 1.5 MHz as a function of fast neutron fluence and gamma dose. From 5 × 1013 to 8 × 1014 n/cm2, the noise increases appreciably, with the noise enhancement from 2 to 10 kHz attributed to generation-recombination noise in the gate depletion layer and from 500 kHz to 1.5 MHz to channel trapping effects. There was comparably little change with gamma irradiation up to doses above 107 rad (Si).