A 1.57-GHz RF front-end for triple conversion GPS receiver

A low-power, 1.57 GHz RF front-end for a Global Positioning System (GPS) receiver has been designed in a 1.0 μm BiCMOS technology. It consists of a low noise amplifier with 15 dB of gain, a single balanced mixer with 6.3 mS of conversion g_m, a Colpitts LC local oscillator, and an emitter coupled logic (ECL) divide-by-eight prescaler. This front-end has a single sideband (SSB) noise figure of 8.1 dB and is part of a triple conversion superheterodyne receiver whose IF frequencies are 179, 4.7, and 1.05 MHz. Low power consumption has been achieved, with 10.5 mA at 3 V supply voltage for the front-end, while the complete receiver is expected to draw about 12 mA     

A 2.4-GHz sub-mW CMOS receiver front-end for wireless sensors network

A 2.4-GHz fully integrated CMOS receiver front-end using current-reused folded-cascode circuit scheme is presented. A configuration utilizing vertically stacked low-noise amplifier (LNA) and a folded-cascode mixer is proposed to improve both conversion gain and noise figure suitable for sub-mW receiver circuits. The proposed front-end achieves a conversion gain of 31.5dB and a noise figure of 11.8dB at 10MHz with 500-/spl mu/A bias current from a 1.0-V power supply. The conversion gain and noise figure improvements of the proposed front-end over a conventional merged LNA and single-balanced mixer are 11dB and 7.2dB at 10MHz, respectively, with the same power consumption of 500/spl mu/W.     

Design of a High Performance 2-GHz Direct-Conversion Front-End With a Single-Ended RF Input in 0.13 $mu$m CMOS

A 2.1 GHz CMOS front-end with a single-ended low-noise amplifier (LNA) and a double balanced, current-driven passive mixer is presented. The LNA drives an on-chip transformer load that performs single-ended to differential conversion. A detailed comparison in gain, noise, and second and third order linearity performance is presented to motivate the choice of a current-driven passive mixer over an active mixer. The front-end prototype was implemented on a 0.13 $mu$m CMOS process and occupies an active chip area of 1.1 mm $^{2}$. It achieves 30 dB conversion gain, a low noise figure of 3.1 dB (integrated from 40 KHz to 1.92 MHz), an in-band IIP3 of ${-}$12 dBm, and IIP2 better than 39 dBm, while consuming only 12 mW from a 1.5 V power supply.      

An RF front-end with an automatic gain control technique for a U/V band CMMB receiver

This paper presents a fully integrated RF front-end with an automatic gain control(AGC) scheme and a digitally controlled radio frequency varied gain amplifier(RFVGA) for a U/V band China Mobile Multimedia Broadcasting(CMMB) direct conversion receiver.The RFVGA provides a gain range of 50 dB with a 1.6 dB step. The adopted AGC strategy could improve immunity to adjacent channel signal,which is of importance for CMMB application.The front-end,composed of a low noise amplifier(LNA),an RFVGA,a mixer and AGC,achieves an input referred 3rd order intercept point(IIP3) of 4.9 dBm with the LNA in low gain mode and the RFVGA in medium gain mode,and a less than 4 dB double side band noise figure with both the LNA and the RFVGA in high gain mode.The proposed RF front-end is fabricated in a 0.35μm SiGe BiCMOS technology and consumes 25.6 mA from a 3.0 V power supply.     

A 2.7-V 900-MHz CMOS LNA and mixer

A CMOS low-noise amplifier (LNA) and a mixer for RF front-end applications are described. A current reuse technique is described that increases amplifier transconductance for the LNA and mixer without increasing power dissipation, compared to standard topologies. At 900 MHz, the LNA minimum noise figure (NF) is 1.9 dB, input third-order intercept point (IIP3) is -3.2 dBm and forward gain is 15.6 dB. With a 1-GHz local oscillator (LO) and a 900-MHz RF input, the mixer minimum double sideband noise figure (DSB NF) is 5.8 dB, IIP3 is -4.1 dBm, and power conversion gain is 8.8 dB. The LNA and mixer, respectively, consume 20 mW and 7 mW from a 2.7 V power supply. The active areas of the LNA and mixer are 0.7 mm×0.4 mm and 0.7 mm×0.2 mm, respectively. The prototypes were fabricated in a 0.5-μm CMOS process     

A 200-MHz sub-mA RF front end for wireless hearing aid applications

A hearing-aid system with RF connection between both ear-pieces is described and its transceiver is introduced. A suitable 200-MHz RF front end has been implemented in a 0.8-μm BiCMOS technology. Low power consumption and area constraint were key requirements. The chip comprises a low noise amplifier (LNA), a single balanced mixer, a varactor tuned LC local oscillator with buffer and a 16/17 dual-modulus prescaler. The LNA has a measured gain of 17.5 dB at 200 MHz. The conversion g_m of the mixer is 1.88 mS. The overall voltage gain and noise figure are 26 dB and 5.2 dB, respectively. The voltage-controlled oscillator's (VCO's) phase noise is -104.7 dBc/Hz at an offset of 24 kHz     

A 1 GHz CMOS RF front-end IC for a direct-conversion wirelessreceiver

An integrated low-noise amplifier and downconversion mixer operating at 1 GHz has been fabricated for the first time in 1 μm CMOS. The overall conversion gain is almost 20 dB, the double-sideband noise figure is 3.2 dB, the IIP3 is +8 dBm, and the circuit takes 9 mA from a 3 V supply. Circuit design methods which exploit the features of CMOS well suited to these functions are in large part responsible for this performance. The front-end is also characterized in several other ways relevant to direct-conversion receivers     

2.4 GHz ISM-Band Receiver Design in a 0.18 μm Mixed Signal CMOS Process

This letter presents the design and measurement results of a fully integrated CMOS receiver front-end and voltage controlled oscillator (VCO) for 2.4 GHz industrial, scientific and medical (ISM)-band application. For low cost design, this receiver has been fabricated with a 0.18 mum thin metal CMOS process with a top metal thickness of only 0.84 mum. The receiver integrates radio frequency (RF) front-end (a single-ended low-noise amplifier (LNA) with on-chip spiral inductors and a double balanced down conversion mixer), VCO and local oscillation buffers on a single chip together with an internal output buffer. To obtain the high-quality factor inductor in LNA, VCO and down conversion mixer design, patterned-ground shields (PGS) are placed under the inductor to reduce the effect from image current of resistive Si substrate. Moreover, in VCO and mixer design, due to the incapability of using thick top metal layer of which the thickness is over 2 mum, as used in many RF CMOS process, the structure of dual-metal layer in which we make electrically short circuit between the top metal and the next metal below it by a great number of via arrays along the metal traces is adopted to compensate the Q -factor degradation. In this letter, the receiver achieves a conversion gain of 23 dB, noise figure of 8.1 dB and P1 dB of -20 dBm at 39 MHz with 21 mW power dissipation from a 1.8 V power supply. It occupies a whole circuit area of 2 mm².     

A 1-GHz BiCMOS RF front-end IC

An RF front-end IC containing a low-noise amplifier and mixer is described. On-chip temperature and supply-voltage compensation is used to stabilize circuit performance. Realized in a BiCMOS process, the circuit consumes 13.0-mA total current from a 5-V supply. The amplifier gain at 900 MHz is 16 dB, the noise figure is 2.2 dB, and the input third-order intermodulation intercept is -10 dBm. The mixer input third-order intermodulation intercept is +6 dBm with 15.8 dB noise figure     

Ka-band monolithic GaAs balanced mixers

Monolithic integrated circuits have been developed on semi-insulating GaAs substrates for millimeter-wave balanced mixers. The GaAs chip is used as a suspended stripline in a cross-bar mixer circuit. A double sideband noise figure of 4.5 dB has been achieved with a monolithic GaAs balanced mixer filter chip over a 30- to 32-GHz frequency range. A monolithic GaAs balanced mixer chip has also been optimized and combined with a hybrid MIC IF preamplifier in a planar package with significant improvement in RF bandwidth and reduction in chip size. A double sideband noise figure of less than 6 dB has been achieved over a 31- to 39-GHz frequency range with a GaAs chip size of only 0.5 × 0.43 in. This includes the contribution of a 1.5-dB noise figure due to IF preamplifier (5-500 MHz).     

Design and optimization of a 2.4 GHz RF front-end with an on-chip balun

A 2.4 GHz low-power,low-noise and highly linear receiver front-end with a low noise amplifier(LNA) and balun optimization is presented.Direct conversion architecture is employed for this front-end.The on-chip balun is designed for single-to-differential conversion between the LNA and the down-conversion mixer,and is optimized for the best noise performance of the front-end.The circuit is implemented with 0.35μm SiGe BiCMOS technology.The front-end has three gain steps for maximization of the input dynamic range.The overall maximum gain is about 36 dB.The double-sideband noise figure is 3.8 dB in high gain mode and the input referred third-order intercept point is 12.5 dBm in low gain mode.The down-conversion mixer has a tunable parallel R-C load at the output and an emitter follower is used as the output stage for testing purposes.The total front-end dissipation is 33 mW under a 2.85 V supply and occupies a 0.66 mm~2 die size.     

A 0.7-7 GHz wideband reconfigurable receiver RF front-end in CMOS

In this paper,a 0.7-7 GHz wideband RF receiver front-end SoC is designed using the CMOS process.The front-end is composed of two main blocks:a single-ended wideband low noise amplifier (LNA) and an inphase/quadrature (I/Q) voltage-driven passive mixer with IF amplifiers.Based on a self-biased resistive negative feedback topology,the LNA adopts shunt-peaking inductors and a gate inductor to boost the bandwidth.The passive down-conversion mixer includes two parts:passive switches and IF amplifiers.The measurement results show that the front-end works well at different LO frequencies,and this chip is reconfigurable among 0.7 to 7 GHz by tuning the LO frequency.The measured results under 2.5-GHz LO frequency show that the front-end SoC achieves a maximum conversion gain of 26 dB,a minimum noise figure (NF) of 3.2 dB,with an IF bandwidth of greater than 500 MHz.The chip area is 1.67 × 1.08 mm2.     

一种零中频通用射频前端的设计及实现

摘要：本文采用零中频结构针对800～2400MHz工作频段设计了一种通用射频前端,该射频前端在一款高性能解调器的基础上,加入宽带低噪声放大器、程控射频AGC电路、电调谐预选滤波器等电路,从而实现灵敏度优于-100dBm/5MHz,动态范围大于100dB的设计指标要求。     

Ka-Band Monolithic GaAs Balanced Mixers

Monolithic integrated circuits have been developed on semi-insulating GaAs substrates for millimeter-wave balanced mixers. The GaAs chip is used as a suspended stripline in a cross-bar mixer circuit. A double sideband noise figure of 4.5 dB has been achieved with a monolithic GaAs balanced mixer filter chip over a 30- to 32-GHz frequency range. A monolithic GaAs balanced mixer chip has also been optimized and combined with a hybrid MIC IF preamplifier in a planar package with significant improvement in RF bandwidth and reduction in chip size. A double sideband noise figure of less than 6 dB has been achieved over a 31- to 39-GHz frequency range with a GaAs chip size of only 0.5x0.43 in. This includes the contribution of a 1.5-dB noise figure due to if preamplifier (5-500 MHz).     

A plastic package GaAs MESFET 5.8-GHz receiver front-end withon-chip matching for ETC system

A plastic package GaAs MESFET receiver front-end monolithic microwave integrated circuit operating at 5.8 GHz is presented in this paper. It has a two-stage low-noise amplifier followed by a dual-gate mixer. Operating at 3 V and 8.3 mA, a conversion gain of 20.4 dB, noise figure of 4.1 dB, and high port-to-port isolations have been achieved. Total chip size of 1.0×0.9 mm² has been achieved through on-chip matching for both RF and local-oscillator ports and the use of simple two-element matching networks for all interstage matching. The 3-dB bandwidth of conversion gain is 1 GHz     

A low-power GaAs front-end IC with current-reuse configurationusing 0.15-μm-gate MODFETs

We have developed a novel current-reuse configuration of a front-end integrated circuit (IC), where the current can be reused in the whole circuit blocks that are a low-noise amplifier, local amplifier, and mixer. The power dissipation of the front-end IC is reduced by the factor of three as compared to conventional front-end ICs. Excellent RF performance such as conversion gain of 30 dB and noise figure of 1.6 dB at 1.5 GHz is attained under the conditions of the supply voltage and current of 3.6 V and 3 mA, respectively     

Design of a Noise-Canceling CMOS Wideband Receiver Front-End with Inherent Active Balun

This paper presents the design of an ESD-protected noise-canceling CMOS wideband receiver front-end for cognitive and ultra-wideband (UWB) radio-based wireless communications. Designed in a 0.13-μm CMOS technology, the RF front-end integrates a broadband low-noise amplifier (LNA) and a quadrature down-conversion mixer. While having ESD and package parasitics absorbed into a wideband input matching network, the LNA exploits a combination of a common-gate (CG) stage and a common-source (CS) stage to cancel the noise of the CG-stage and to provide a well balanced differential output for driving the double-balance mixer, which has a merged quadrature topology. A variable-gain method is developed for the LNA to achieve a large factor of gain switch without degrading the input impedance match and the balun function. Drawing 24 mA from 1.5 V, simulations show that the proposed front-end has a 3-dB bandwidth of around 10 GHz spanning from 1.8 GHz up to 11.8 GHz with a maximum voltage conversion gain of 30 dB and a noise figure of 4.3–6.7 dB over the entire band.     

A 1.5-V multi-mode quad-band RF receiver for GSM/EDGE/CDMA2K in 90-nm digital CMOS process

A single chip quad-band multi-mode (GSM900/ DCS1800/PCS1900/CDMA2K) direct-conversion RF receiver with integrated baseband ADCs is presented. The fully integrated RF receiver is implemented in a 90-nm single poly, six level metal, standard digital CMOS process with no additional analog and RF components. The highly digital multi-mode receiver uses minimum analog filtering and AGC stages, digitizing useful signal, dynamic DC offsets and blockers at the mixer output. The direct-conversion GSM front-end utilizes resistive loaded LNAs with only two coupled inductors per LNA. The GSM front-end achieves a 31.5 dB gain and a 2.1 dB integrated noise figure with a 5 dB noise figure under blocking conditions. The CDMA2K front-end utilizes a self-biased common-gate input amplifier followed by passive mixers, achieving wideband input matching from 900 MHz up to 2.1 GHz with an IIP3 of +8 dBm. The GSM receiver consumes 38 mA from a power supply of 1.5 V and CDMA2K receiver consumes 16 mA in the low band and 21 mA in the high band. The multi-mode receiver, including LO buffers and frequency dividers, ADCs, and reference buffers, occupies 2.5 mm/sup 2/.     

2.4GHz带片上非平衡变压器射频前端的设计与优化

本文介绍了一种工作在2.4GHz频段的低功耗、低噪声、高线性射频接收机前端电路,该接收前端电路使用新型的带三种增益模式的LNA,并提出一种新的片上非平衡变压器优化技术。前端电路采用了直接变频结构,使用片上非平衡变压器实现低噪声放大器与下变频混频器之间的单端-差分转换,优化设计以提高前端电路的噪声性能。本文使用锗硅0.35um BiCMOS工艺,所采用的技术同样适用于CMOS工艺。前端电路总的最大转换增益为36dB;在高增益模式下的双边带噪声系数为3.8dB;低增益模式下,输入三阶交调点位12.5dBm。为了获得最大的输入动态范围,低噪声放大器采用三种可调增益模式,低增益模式使用by-pass结构,大大提高了大信号输入下接收前端的线性度。下变频混频器在输出端使用可调R-C tank,滤除带外高频杂波。混频器输出使用射极跟随器作为输出极驱动片外50ohm负载。该接收前端在2.85-V电源供电下,功耗为33mW,芯片面积为0.66mm2。     

Design and performance of low-current GaAs MMICs forL-band front-end applications

GaAs monolithic microwave integrated circuits (MMICs) with very low current and of very small size have been developed for L-band front-end applications. The MMICs fully employ lumped LC elements with uniplanar configurations. There are two kinds of MMICs: a low-noise amplifier and a mixer. The low-noise amplifier has a noise figure of 2.5 dB and a gain of 11.5 dB. The mixer has a conversion gain of 12.5 dB small local oscillator (LO) power of -3 dBm. Total current dissipation of the two MMICs is less than 8 mA with 3-V drain bias voltages