Fabrication of planar optical waveguides in LiB3O5 by 2 MeV He+ ion implantation

The fabrication of planar optical waveguides in LiB₃O ₅ is discussed. Using 2-MeV ⁴He⁺ implantation with a dose of 1.5×10¹⁶ ions/cm² at 300 K, the refractive indexes of a 0.2-μm-thick layer 5.1 μm below the crystal surface are reduced to form optical barrier guides. For this ion dose the maximum change from the bulk values of refractive index at a wavelength of 0.488 μm are 1.5%, 5.25%, and 4% for n_x, n_y, and n_z, respectively. The refractive indexes of the guiding region change by less than 0.02% from the bulk values. The dose dependence of the optical barrier height has been measured. A threshold ion dose of about 0.75×10¹⁶ ions/cm² is required to form a refractive index barrier and ion doses higher than about 2.5×10¹⁶ ions/cm². saturate the refractive index decrease. Waveguide propagation losses for annealed single energy implants of dose 1.5×10¹⁶ ions/cm² are dominated by tunneling and are estimated to be ~8.9 dB/cm for the z-cut waveguides used. Multiple energy implants broaden the optical barrier, and losses of <4 dB/cm have been observed     

Bulk and surface properties of amorphous hydrogenated fluorinatedsilicon grown from SiF4 and H2

A detailed study of the growth of amorphous hydrogenated fluorinated silicon (a-Si:H, F) from a DC glow discharge in SiF₄ and H₂ is discussed. The electrical properties of the films can be varied over a very wide range. The bulk properties of the best films that were measured included an Urbach energy E_u =43 meV, a deep-level defect density N_s=1.5×10¹⁵ cm^-3, and a hole drift mobility of 8×10^-3 cm² V^-1 s^-1, which reflects a characteristic valence band energy of 36 meV. It was found that E_u, N _s, and the density of surface states N_ss are related to each other. Under the deposition condition of the films with the best bulk properties, N_ss reaches its highest value of 1×10¹⁴ cm^-2. It is suggested that in growth from SiF₄/H₂, the density of dangling bonds at the growing surface is very sensitive to the deposition conditions     

Electrooptic coefficient measurements in LiTaO3 andLiNbO3 waveguides

The magnitudes of linear electrooptic coefficients r₁₃ and r₃₃ in Zn:LiTaO₃ repoled channel waveguides are reported. The measurements were made at 0.633-μm wavelength using a Fabry-Perot interferometer. The waveguides were produced by diffusion from the vapor phase at a temperature above the Curie temperature. For full recovery of the Pockels effect, an electric field of 200 V/cm is needed during repoling. The measured values of r₁₃ and r₃₃ at 32-MHz modulation frequency are 7.2 and 30.3 pm/V, respectively. The difference between unclamped and clamped coefficients is comparable to that from bulk crystals. Measurements were also made on Ti:LiNbO₃ waveguides that did not require repoling, and good agreement with bulk crystal values was obtained     

Diffusion and noise in GaAs material and devices

The variation of the diffusion coefficient D(E) versus the electric field strength E is determined at 300 K in n-type GaAs (N_D=3×10^-17 cm^-3 ), using pulsed high-frequency noise measurements. D(E) is found to increase slightly at low field, then to decrease down to one tenth of its ohmic value near the threshold field. Long (⩾4 μm) real n⁺-n-n⁺ Gunn diodes, with an arbitrary doping profile, can be modeled. Comparisons are made, and excellent agreement is found, between experimental and theoretical characteristics of two real diodes, with notch and with gradual doping profiles. The doping profile N_D(x ) is shown to have a considerable influence on the diode behavior, in regard to the electric field profile as well as the noise characteristics. Using the impedance field method, the noise current is modeled and found to by very sensitive in the D(E) variation law, in particular in the range of 2.5-4 kV/cm. The agreement between the experimental noise and the computed noise of real diodes is quite satisfactory when using the D(E) determined     

Fiber-compatible K+-Na+ ion-exchanged channelwaveguides: fabrication and characterization

A systematic study of waveguides fabricated by K⁺-Na ⁺ exchange in soda-lime silicate and BK7 glasses is presented. The measured K⁺ concentration profile, the refractive index profile, and the diffusion profile obtained by solving the one-dimensional diffusion equation are correlated to explain the differences in the index profiles in the two glasses. The mobility of the potassium ions was measured by fabricating waveguides using electromigration. Surface waveguides formed by diffusion from a molten KNO₃ salt bath were buried by applying an electric field. Single-mode channel waveguides for operation at a wavelength of 1.3 μm that exhibit excellent mode matching with conventional optical fibers, achieving a fiber-waveguide insertion loss of less than 1 dB for a 20-mm-long waveguide, have been obtained     

Theoretical modeling and characterization of annealedproton-exchanged planar waveguides in z-cut LiNbO3

Planar optical waveguides in z-cut LiNbO₃ fabricated by the annealed proton-exchange technique using pure pyrophosphoric acid as the initial proton source have been investigated. A generalized Gaussian function was used to accurately model the refractive-index profile, resulting in considerable improvements over previous work. The nonlinear dependence of the index on the proton concentration was verified by directly calculating the change in the area under the index versus depth curves. Annealing was found to allow for flexibility in the tailoring of the waveguide parameters. An empirical correlation of the changes in these parameters with the fabrication conditions was achieved through the use of a general power law     

Characterization of annealed proton exchanged LiNbO3waveguides for nonlinear frequency conversion

A thorough and detailed characterization of annealed proton-exchanged (APE) waveguides in Z-cut LiNbO₃ is described. The mode index measurements in planar waveguides as a function of wavelength and annealing time are reported, including useful analytical relations for the refractive index change, its dispersion, and the depth profile as a function of annealing parameters. Analytical expressions for the mode propagation characteristics are presented and experimentally verified with reasonable accuracy. It is shown that the planar waveguide characterization results can be used to model the channel waveguide characteristics accurately. The model provides closed-form expressions for the mode index and the mode field profile, and the theoretical results are in excellent agreement with the measured data. The technique is used to accurately predict the phase mismatch between the fundamental and second harmonic modes in frequency-doubling experiments using APE channel waveguides. An optimum waveguide geometry for which the phase mismatch is relatively insensitive to the waveguide nonuniformity was predicted and verified experimentally     

Electrical properties of Si p+-n junctions for sub-0.25μm CMOS fabricated by Ga FIB implantation

p⁺-n junction diodes for sub-0.25-μm CMOS circuits were fabricated using focused ion beam (FIB) Ga implantation into n-Si (100) substrates with background doping of N_b=(5-10)×10 ¹⁵ and N_b⁺=(1-10)×10¹⁷ cm^-3. Implant energy was varied from 2 to 50 keV at doses ranging from 1×10¹³ to 1×10¹⁵ cm^-2 with different scan speeds. Rapid thermal annealing (RTA) was performed at either 600 °C or 700°C for 30 s. Diodes fabricated on N_b⁺ with 10-keV Ga⁺ exhibited a leakage current (^I_R) 100× smaller than those fabricated with 50-keV Ga⁺. Tunneling was determined to be the major current transport mechanism for the diodes fabricated on N_b⁺ substrates. An optimal condition for I_R on N_b⁺ substrates was obtained at 15 keV/1×10¹⁵ cm^-2. Diodes annealed at 600°C were found to have an I_R 1000× smaller than those annealed at 700°C. I-V characteristics of diodes fabricated on N_b substrates with low-energy Ga⁺ showed no implant energy dependence. I-V characteristics were also measured as a function of temperature from 25 to 200°C. For diodes implanted with 15-keV Ga ⁺, the cross-over temperatures between I_diff and I_g-r occurred at 106°C for N_b ⁺ and at 91°C for N_b substrates     

High/fmax collector-up AlGaAs/GaAsheterojunction bipolar transistors with a heavily carbon-doped basefabricated using oxygen-ion implantation

AlGaAs/GaAs collector-up heterojunction bipolar transistors (HBTs) with a heavily carbon-doped base layer were fabricated using oxygen-ion implantation and zinc diffusion. The high resistivity of the oxygen-ion-implanted AlGaAs layer in the external emitter region effectively suppressed electron injection from the emitter, allowing collector current densities to reach values above 10⁵ A/cm ². For a transistor with a 2-μm×10-μm collector, f_T was 70 GHz and f_max was as high as 128 GHz. It was demonstrated by on-wafer measurements that the first power performance of collector-up HBTs resulted in a maximum power-added efficiency of as high as 63.4% at 3 GHz     

Guided wave modulators in Ti ion implanted LiNbO3waveguides

Electrooptic modulators in Ti-ion-implanted LiNbO₃ waveguides are discussed. Low loss (<1-dB/cm) planar and channel waveguides were fabricated and compared to indiffused waveguides. Higher Δn values are obtained, allowing smaller waveguide geometries and tighter mode confinement. Wavelengths of 0.85 and 1.3 μm are used. The small mode profiles resulting from the Ti doses up to 4×10¹⁷ Ti/cm² resulted in V-L products of 8.8 V-mm at 0.85 μm and 20 V-mm at 1.3 μm. These values are lower than any previously reported for a Mach-Zehnder modulator using a buffer layer. Comparison of diffused and implanted waveguide modulators indicated that modular efficiency can be optimized by electrode gap spacing and enhanced with smaller mode profiles achievable in implanted guides     

Si/a-Si:H heterojunction microwave bipolar transistors with cut-offfrequencies ft above 5 GHz

The fabrication of a silicon heterojunction microwave bipolar transistor with an n⁺ a-Si:H emitter is discussed, and experimental results are given. The device provides a base sheet resistance of 2 kΩ/□ a base width 0.1 μm, a maximum current gain of 21 (V_CE=6 V, I_c=15 mA), and an emitter Gummel number G _E of about 1.4×10¹⁴ Scm^-4. From the measured S parameters, a cutoff frequency f_t of 5.5 GHz and maximum oscillating frequency f_max of 7.5 GHz at V_CE=10 V, I_c=10 mA are obtained     

1/f noise in MODFETs at low drain bias

The 1/f noise in normally-on MODFETs biased at low drain voltages is investigated. The experimentally observed relative noise in the drain current S_I/I² versus the effective gate voltage V_G=V_GS-V_off shows three regions which are explained. The observed dependencies are S_I/I²∝V_G ^m with the exponents m=-1, -3, 0 with increasing values of V_G. The model explains m =-1 as the region where the resistance and the 1/f noise stem from the 2-D electron gas under the gate electrode; the region with m=0 at large V_G or V_GS≅0 is due to the dominant contribution of the series resistance. In the region at intermediate V_G , m=-3, the 1/f noise stems from the channel under the gate electrode, and the drain-source resistance is already dominated by the series resistance     

Rapid isothermal processing of strained GeSi layers

A cold-wall rapid thermal processor was used to study the oxidation and annealing properties of Ge_xSi_1-x strained layers. The dry oxidation rate of Ge_xSi_1-x was found to be the same as that of Si, while the wet oxidation rate was found to be higher than that of Si, and the oxidation rate increases with the Ge concentration (up to 20% in this study). A high fixed oxide charge density (>5×10¹¹ /cm²) and interface trap level density (>10¹² /cm²-eV) at the oxide interface have been determined from capacitance-voltage measurements. Using techniques such as X-ray rocking curve analysis and I-V and C-V measurements of the p-n heterojunction it was found that the degradation of electronic properties of metastable Ge_xSi_1-x strained layers during rapid thermal annealing are related to the formation of structural defects at the heterointerfaces     

Correlation between 1/f noise and hFElong-term instability in silicon bipolar devices

Accelerated life tests with high-temperature storage and electric aging for n⁺-p-n silicon planar transistors were carried out. Current gain h_FE increases monotonously with time during the tests, and the h_FE drift is correlated with initial measured 1/f noise in the transistors, i.e. the drift amount significantly increases with the increase of noise level. The correlation coefficient of relative drift Δh_FE /h_FE and 1/f noise spectral density S_iB(f) is far larger than that of Δ h_FE/h_FE and initial DC parameters of the transistors. A quantitative theory model for the h _FE drift has been developed and explains the h _FE drift behavior in the tests, which suggests that the h _FE drift and 1/f noise can be attributed to the same physical origin, and both are caused by the modulation of the oxide traps near the Si-SiO₂ interface to Si surface recombination. 1/f noise measurement, therefore, may be used as a fast and nondestructive means to predict the long-term instability in bipolar transistors     

Reduction of oxide charge and interface-trap density in MOScapacitors with ITO gates

The electrical properties of MOS capacitors with an indium tin oxide (ITO) gate are studied in terms of the number density of the fixed oxide charge and of the interface traps N_f and N _it, respectively. Both depend on the deposition conditions of ITO and the subsequent annealing procedures. The fixed oxide charge and the interface-trap density are minimized by depositing at a substrate temperature of 240°C at low power conditions and in an oxygen-rich ambient. Under these conditions, as-deposited ITO films are electrically conductive. The most effective annealing procedure consists of a two-step anneal: a 45-s rapid thermal anneal at 950°C in N₂, followed by a 30 min anneal in N₂/20% H₂ at 450°C. Typical values obtained for N_it and N_f are 4.2×10¹⁰ cm^-2 and 2.8×10¹⁰ cm^-2, respectively. These values are further reduced to 1.9×10¹⁰ cm^-2 and ≲5×10⁹ cm^-2, respectively, by depositing approximately 25 nm polycrystalline silicon on the gate insulation prior to the deposition of ITO     

Doubly strainedIn0.41Al0.59As/n+-In0.65Ga0.35As HFET with high breakdown voltage

An In_0.41Al_0.59As/n⁺-In_0.65 Ga_0.35As HFET on InP was designed and fabricated, using the following methodology to enhance device breakdown: a quantum-well channel to introduce electron quantization and increase the effective channel bandgap, a strained In_0.41Al_0.59As insulator, and the elimination of parasitic mesa-sidewall gate leakage. The In_0.65Ga_0.35As channel is optimally doped to N_D=6×10¹⁸ cm^-3. The resulting device (L_g=1.9 μm, W_g =200 μm) has f_t=14.9 GHz, f_max in the range of 85 to 101 GHz, MSG=17.6 dB at 12 GHz V_B=12.8 V, and I_D(max)=302 mA/mm. This structure offers the promise of high-voltage applications at high frequencies on InP     

The sublinear relationship between index change and carrier densityin 1.5 and 1.3 μm semiconductor lasers

The carrier-induced index change was measured using a novel injection-reflection technique in combination with differential carrier lifetime data. The observed relation between index change and injected carrier density at bandgap wavelength is nonlinear and is approximately given by δn_act=-6.1×10^-14 ( N)^0.66 for a 1.5-μm laser and δn _act=-1.3×10^-14 (N)^0.68 for a 1.3-μm laser. The carrier-induced index change for a 1.3-μm laser at 1.53-μm wavelength is smaller and is given by δn _act=-9.2×10^-16 (N)^0.72      

Potential methods for the fabrication ofhigh-Tc superconductors for wires and cables

Studies of practical properties, such as upper critical field (H_C2) and critical-current density, of high-T _c oxide superconductors of Y-Ba-Cu-O Bi-Sr-Ca-Cu-O, and Tl-Ba-Ca-Cu-O systems are reviewed. The H_c2 of these materials is much higher than that of conventional metallic superconductors, indicating a high potential for practical applications, even when they are used in liquid nitrogen. However, the H_C2 of these materials is also highly anisotropic, as can be expected from an examination of their crystal structure. In addition to this anisotropy, the presence of weak links and a weak pinning force in this material limit the transport current density J₃ to much lower levels than that required for practical applications. Recent fabrication processes that have good potential for producing wire or tape conductors or high-T_c oxide are reviewed. Some details are presented of the powder method and other fabrication processes using diffusion, solidification, and deposition techniques. For the Ag-sheathed oxide tapes, J_c values exceeding 10000 A/cm² at 77 K and 0 T have been reported for both Bi and Tl oxide materials     

Automatic VT extractors based on ann×n2 MOS transistor array and theirapplication

The development of incremental and decremental V_T extractors based on the square-law characteristic and an n ×n² transistor array is described. Different implementations have been discussed and the effect of nonidealities such as mobility reduction, channel-length modulation, mismatch, and body effect has been analyzed. Besides automatic V_T extraction, parameter K of an MOS transistor can also be extracted automatically using the V_T extractor, without any need of calculation and delay, and the extracted V_T and K are, respectively, in voltage and current. Experimental results are presented and indicate that the differences between extracted values using the V_T extractor and the most popular numerical method are as small as 0.15% and 0.064%. Additional applications, such as in level shifting, temperature compensation, and temperature measurement, where the V_T extractor can be used either as a PTAT sensor or as a centigrade sensor, are presented     

Minority-carrier transport parameters in heavily doped p-typesilicon at 296 and 77 K

Minority-carrier electron lifetime, mobility and diffusion length in heavily doped p-type Si were measured at 296 and 77 K. It was found that a 296 K μ_n (pSi)≈μ_n (nSi) for N _AA≲5×10¹⁸ cm^-3, while μ_n (pSi)/μ_n (nSi)≈1 to 2.7 for higher dopings. The results also show that for N_AA≲3×10¹⁹ cm^-3, D (pSi) at 77 K is smaller than that at 296 K, while for higher dopings D_n (pSi) is larger at 77 K than at 296 K. μ_n (pSi) at 77 K increases with the increasing doping above N_AA>3×10¹⁸ cm^-3, in contrast to the opposite dependence for μ_n (nSi) in n⁺ Si