共查询到19条相似文献,搜索用时 130 毫秒
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介绍了多胶模压和液压、中胶真空压力浸渍及少胶真空压力浸渍等电机云母绝缘技术和云母纸、补强材料、胶粘剂等少胶云母带的基础材料,概述了国内外少胶云母带的技术现状及其在高压电机上的应用与选择,并展望了云母纸、补强材料、胶粘剂、纳米技术的应用、高导热少胶云母带、云母带新技术、新工艺和新设备的未来发展方向。 相似文献
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通过异丙醇水溶液的冻融循环结合球磨工艺制备了h-BNNSs,采用微波等离子体对h-BNNSs表面进行功能化处理得到AF-BNNSs,并与甲基丙烯酸反应制备了Vi-BNNSs单体。利用此单体与纳米SiO_2杂化的乙烯基有机硅改性环氧树脂复配制备了纳米改性高导热绝缘漆;利用AF-BNNSs与有机化蒙脱土(OMMT)改性环氧树脂复合制备了一种纳米改性少胶带胶黏剂,并用该胶黏剂制备了一种纳米改性高导热少胶云母带。通过SEM、TEM、HRTEM、AFM等测试手段对h-BNNSs进行了表征,并对纳米改性高导热绝缘漆、纳米改性高导热少胶云母带及由此组合形成的绝缘结构进行了性能测试。结果表明:制备的h-BNNSs具有单层或少层的结构;由功能化h-BNNSs制备的导热绝缘材料及其组成的绝缘系统基本符合6 kV级高压电机的技术要求。 相似文献
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环氧树脂(epoxy resin, EP)以其粘附力强、绝缘性能好等优点,在电气领域中得到广泛应用。但环氧树脂的低热导率限制其在器件中的使用,尤其在高频条件下。文中通过多巴胺改性微米氮化硼和纳米氧化铝,将制备的微纳米二元填料填充环氧树脂,研究环氧树脂复合材料的导热性能和电气绝缘性能。结果表明,质量分数22.5%BN和7.5%Al2O3环氧树脂复合材料的导热系数可以达到1.35 W/(m·K),相比于纯EP增加了812.5%,而介电损耗维持在较低水平。高频击穿实验结果展示出复合材料击穿时间明显提高,比纯环氧树脂提高了387%。该种方法制备所得的环氧树脂复合材料,具有热导率高、介电损耗低、高频击穿强度大等优点,为开发适用于高频电力电子器件的导热绝缘材料提供参考。 相似文献
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An experimental investigation of the filler sort and dispersity influence on inner mechanical stress in UP5–162 epoxide compound during thermal aging was carried out. It was found that the size of filler particles has a dominant influence on a value of the inner mechanical stress, while filler thermophysical properties, such as thermal conductivity and heat capacity, are more important during thermal aging. The backgrounds for maintaining of high mechanical properties of a compound are the filler particle distribution homogeneity over a compound volume, as well as a narrow dispersion distribution. 相似文献
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通过在环氧树脂基体中添加氮化硼(BN)颗粒以提高环氧树脂的热导率,研究了BN颗粒质量分数对脉冲电压下表面击穿试验中热导率以及放电量等的影响,得出了随着BN颗粒质量分数的增加热导率随之增加而放电量随之减小的趋势.表明,BN颗粒提高了环氧树脂的热导率,进而提高了环氧树脂复合材料的耐表面击穿性能. 相似文献
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多胶云母带广泛应用于大型高压电机的主绝缘材料,其导热性直接影响到空冷电机的温升及绝缘的可靠性。采用保护热流计法导热仪、浸渍法密度计研究了目前应用比较成熟的多胶云母带粘合剂的热传导性能及其与密度的关系。结果表明:酚类固化体系的导热系数明显高于TOA体系和桐马体系;酚类固化体系中引入TOA增韧后降低了固化物的导热系数;导热系数与密度存在一定的关系,密度较大的固化物其导热系数一般也较大。 相似文献
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A systematic study to understand how alumina tri-hydrate (ATH) and silica fillers improve the erosion resistance of silicone rubber during dry band arcing showed that the thermal conductivity of the resulting composite material is the main criterion governing material erosion. The thermal conductivity of the composite material is dependent on the thermal conductivity, concentration, particle size, and bonding of the filler particles to the silicone matrix. In this context, either filler can be shown to perform better than the other, depending on the formulation, in the ASTM inclined plane tracking and erosion test. Therefore, the industry perception that ATH filler imports better erosion resistance than silica in silicone rubber can be misleading. The release of water of hydration from ATH appears to have a secondary effect that may be more relevant in silicone compositions having a low concentration of a filler. 相似文献
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Meyer L. Jayaram S. Cherney E.A. 《Dielectrics and Electrical Insulation, IEEE Transactions on》2004,11(4):620-630
Silicone rubber samples having various concentrations and mean particle sizes of either alumina tri-hydrate or silica filters, prepared by room temperature and heat cured under pressure (hot pressed), are tested for erosion resistance in the ASTM D2303 inclined plane tracking and erosion test. Their corresponding thermal conductivities are determined using a transient temperature technique in which an infrared laser is employed as the heat source and a thermal imaging camera as a temperature detection device. Scanning electron microscope observations show greater filler bonding to the silicone matrix in the hot pressed samples than in the room temperature vulcanized samples leading higher thermal conductivity and increased resistance to erosion, for both ATH and silica filled samples. The correlation study shows a strong relationship between the erosion resistance and the thermal conductivity of the tested samples, highlighting the importance of an outdoor insulating material to have high thermal conductivity in order to withstand dry band arcing. The results can be used to provide guidance on filler selection for silicone rubber compounding for outdoor insulation applications. 相似文献
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Makoto Katsumata Morinobu Endo Hidenori Yamanashi Hitoshi Ushijima 《Electrical Engineering in Japan》1994,114(5):17-23
To obtain a new electroconductive composite, the vapor-grown carbon fiber (VGCF) has been applied to the thermoplastic resin composite as a conductive filler. The stability of electrical conductivity of the composite is investigated. The resistivity of VGCF composite is 1.7 × 10?1 Ω·cm at room temperature which is one order smaller than that of commercial grade composites with carbon filler. The stability of electrical conductivity, under temperature change (?35 to +60°C) and for exposure tests (at room temperature and at 60°C), the VGCF composites have high degree of stability. The stability of electrical conductivity of the present composites are superior to those of conventional carbon fibers such as PAN-based, under tensile stresses and bending stresses. It is suggested that the fine conductive networks in the present composites give rise to these desirable performances. 相似文献