Point Defects in CdZnTe Crystals Grown by Different Techniques

We studied, by current deep-level transient spectroscopy (I-DLTS), point defects in CdZnTe detectors grown by different techniques. We identified 12 different traps with energy levels from 7 meV to 1.1 eV. Although the levels of most of the identified defects were independent of the crystal growth techniques, nevertheless there were some associated differences in the traps’ energies and densities.     

CdZnTe晶体缺陷的交流阻抗谱研究

宽禁带II-VI族半导体化合物碲锌镉(CdZnTe)晶体是制备室温X和γ射线探测器的理想半导体材料,但其晶体缺陷特性对探测器性能有重要的影响,一直是人们研究的热点与难点。文中采用垂直布里奇曼法生长了CdZnTe晶锭,XRD测试表明晶片呈现(111)取向。通过测试样品不同温度下的交流阻抗谱,研究了晶体缺陷的阻抗特性。结果表明,制备的CdZnTe单晶具有负温度系数效应,化学法制备的Au电极与晶片之间形成了欧姆接触,没有出现电极界面和晶界对阻抗谱曲线影响,晶粒导电机制占主导。利用Arrhenius方程拟合曲线获得晶体缺陷的激活能为0.48 eV,表明晶体缺陷以Cd空位为主。     

Synchrotron X-ray Based Characterization of CdZnTe Crystals

Synthetic CdZnTe (CZT) crystals can be used for the room temperature-based detection of gamma radiation. Structural/morphological heterogeneities within CZT, such as secondary phases (namely, precipitates and inclusions), can negatively affect detector performance. We used a synchrotron-based x-ray technique, specifically extended x-ray absorption fine-structure (EXAFS) spectroscopy, to determine whether there are differences on a local structural level between intact CZT of high and low radiation detector performance. These studies were complemented by data on radiation detector performance and transmission infrared (IR) imaging. The EXAFS studies revealed no detectable local structural differences between the two types of CZT materials.     

CZ-Si单晶中流动图形缺陷的本性探究

CZ-Si单晶中的流动图形缺陷(FPDs)是否属于空洞型缺陷,目前尚有争议.通过光学显微镜和原子力显微镜对其结构进行了细致地研究.实验发现,FPDs外形如抛物线,在硅片中呈内高外低分布,并且在其顶端附近还存在一单型或双型的八面体空洞,其尺寸、结构及类型与COPs、LSTDs缺陷都非常相似.所有这些都表明,FPDs为空洞型缺陷.本次实验结果将有助于对空洞型缺陷本性及其消除机制的进一步研究.     

碲锌镉衬底缺陷对液相外延碲镉汞薄膜结构的影响

采用红外显微镜、X射线双晶回摆衍射法、X射线貌相术对CdZnTe衬底中的沉淀相、亚结构、组分偏析等缺陷进行了研究,并对用此衬底液相外延的HgCdTe薄膜作了测试。结果显示：CdZnTe衬底中亚晶界处聚集的位错在外延生长中呈发散状向薄膜中延伸,造成了薄膜形成亚晶界和更大面积的由位错引起的晶格畸变应力区域,影响了薄膜结构的完整性。     

碲锌镉表面腐蚀坑所对应缺陷的特性研究

文中通过使用Nakagawa、Everson、EAg1和EAg2四种常用腐蚀剂对碲锌镉材料的腐蚀 坑空间分布特性进行研究,结果显示, 20μm厚的(111)晶片A、B面上的腐蚀坑在空间位置上不存在对应关系,这表明腐蚀坑所对应的缺陷不是具有穿越特性的位错。腐蚀坑的空间局限性特征和热处理后腐蚀坑密度(EPD)减少等实验结果表明,腐蚀坑更有可能对应某种微沉淀物缺陷,将目前常用腐蚀剂的EPD作为碲锌镉材料的位错密度是缺乏实验依据的。     

On the Role of Boron in CdTe and CdZnTe Crystals

It is well known that group III elements act as donors if they play a substitutional role at the metallic site in II-tellurides; nevertheless, several studies report both on the creation of complexes with vacancies, named A-centers, and on the involvement in self-compensation mechanisms, especially for indium. The boron concentration in II-tellurides is negligible, and its contribution to transport mechanisms has not been studied yet. For the last few years the authors have been developing a new technique to grow CdZnTe by the vertical Bridgman technique, taking advantage of encapsulation by means of boron oxide. In this way, crystals characterized by large single grains, low etch pit density, and high resistivity have been obtained. Recently, x-ray detectors with state-of-the-art performance have been produced from such crystals. Boron contamination, as a consequence of this growth method, is quite low but at least one order of magnitude above values obtained with other growth techniques. Besides being a low-cost technique which is also suitable for large-scale mass production, the encapsulated vertical Bridgman technique is quite useful to prevent dislocations, grain boundaries, and stacking faults; for these reasons, careful characterization was performed to understand the effect of boron both on the electrical properties and on the spectroscopic performance of the final crystals. Our characterization is mainly based on low-temperature photoluminescence in addition to electrical current–voltage measurements, photostimulated current, and x-ray spectroscopy. The results indicate that boron behaves like other group III elements; in fact, boron forms a complex that does not affect the good performance of our x-ray detectors, even if it shows some properties which are typical of A-centers.     

Influence of Cd-rich Annealing on Defects in Te-rich CdZnTe Materials

The influence of Cd-rich annealing at temperatures of 440–900 °C on the defect properties of Te-rich CdZnTe materials was studied. Cd-rich annealing at temperatures above the melting point of Te was confirmed to effectively reduce the size of Te-rich inclusions in the materials. However, dislocation multiplication occurred in the regions near Te-rich inclusions. Etch pit clusters were observed on the surfaces of annealed materials etched with Everson etchant. The etch pit clusters were much larger than the as-grown Te-rich inclusions. The dependence of the cluster size on that of the Te-rich inclusions and the annealing conditions was investigated. The density of etch pits in the normal region increased when the annealing temperature exceeded 750 °C. The mechanisms of the evolution of the Te-rich inclusions and the formation of new defects during the Cd-rich annealing are discussed.     

Study of Morphological Defects on Dual-Band HgCdTe on CdZnTe

HgCdTe dual-band epitaxial layers on lattice-matched CdZnTe substrates often have morphological defects. These defects, unlike normal void and microvoid defects, do not contain a polycrystalline core and, therefore, do not offer a good contrast for observation using optical and electron microscopes. This paper reports a way of identifying these defects by using a Nomarski optical microscopy image overlay on focused ion beam microscopy images for preparation of thin cross-sectional foils of these defects. Transmission electron microscopy was used to study the defect cross-sections to identify the origin and evolution of the morphological defects and their effect on the epitaxial layer. This paper reports cross-sectional analysis of four morphological defects of different shape and size.     

Slow-Polishing Iodine-Based Etchant for CdTe and CdZnTe Single Crystals

We report on new etching solutions for treatment of CdTe and CdZnTe surfaces based on the iodine-emerging etchant composition KIO₃–KI–citric acid (C₆H₈O₇). CdTe samples with (111), (110), and (100) orientations, and also Cd_1?x Zn _x Te (x?=?0.04, 0.1) samples with (111), (110), (100), and (211) orientations were investigated. The dissolution rate was determined as a function of solution composition, etchant storage time, disc rotation speed, and temperature. It was established that this chemical dissolution is diffusion controlled. Study of the chemical composition and structure of (211)B Cd_1?x Zn _x Te surfaces etched under different conditions was carried out. x-Ray photoelectron spectroscopy measurements showed that a stoichiometric surface was achieved after briefly heating the etched surface in a vacuum. Reflection high-energy electron diffraction measurements revealed a high-quality single-crystalline surface layer in samples etched with KIO₃–KI–citric acid solutions as compared with those etched with a bromine–methanol treatment. The etching compositions were shown to be useful for controlled removal of semiconductor material, and also for chemical polishing of CdTe-based surfaces.     

直拉硅单晶中的流动图形缺陷

用Secco腐蚀液对直径150mm p型(100)直拉硅单晶片进行择优腐蚀后,得到了流动图形缺陷(FPDs),并通过原子力显微镜(AFM)对其微观结构进行观察.实验发现,在FPDs缺陷的尖端存在有几百纳米的由(111)面构成的八面体空洞,这与Takeno等人的实验结果相反,他们认为FPD的端部是间隙型的位错环;实验还发现,FPD端部的空洞随腐蚀时间延长会逐渐变为圆形的浅坑直至最后消失.     

直拉硅单晶中的流动图形缺陷

用Secco腐蚀液对直径15 0 mm p型(10 0 )直拉硅单晶片进行择优腐蚀后,得到了流动图形缺陷(FPDs) ,并通过原子力显微镜(AFM)对其微观结构进行观察.实验发现,在FPDs缺陷的尖端存在有几百纳米的由(111)面构成的八面体空洞,这与Takeno等人的实验结果相反,他们认为FPD的端部是间隙型的位错环;实验还发现,FPD端部的空洞随腐蚀时间延长会逐渐变为圆形的浅坑直至最后消失     

CZ硅单晶中原生缺陷的特性

描术了ＣＺ硅单晶中原生缺陷的分类,形成机理及它们对相关器件性能的影响,并就其控制和消除的方法进行了讨论。     

青海天然湖盐晶体的结构缺陷与红外透射率研究

对青海湖盐晶体进行了结构缺陷的观察和红外透射率的测量,将所得结果与人工生长的氯化纳晶体进行了比较,发现青海湖盐的位错分布和人工晶体的位错分布不同:前者具有单个位错均匀分布的特征,后者除单个位错外,还呈现由位错密排形成的亚晶界网络。两种晶体的红外透射率几乎完全相同,表明天然湖盐晶体的位错密度和分布状况不太影响其红外透射率。     

CdZnTe晶片的红外透过率研究

测试了多个性能各异的Cd0.9Zn0.1Te晶片的红外透过率。研究表明,红外透过率与晶片的性能有着密切的联系,即红外透过率的大小及红外透过率图谱的形状可反映晶片的成分分布、位错密度以及杂质含量的情况。从晶片对红外光的吸收机理出发,对这些联系进行了详细的分析。     

用液晶检测绝缘薄膜的缺陷

本文介绍一种检测绝缘薄膜缺陷的简易而有效的方法——液晶测量法,并针对交流薄膜电致发光(ACTFEL)器件中常用的几种绝缘薄膜作检测与分析。     

纳米掺杂光子晶体材料的研究

采用传输矩阵的方法研究带缺陷的一维光子晶体,纳米缺陷的引入使得原来不透电磁 波的禁带中,出现了缺陷模,即某一频率的电磁波可以透过,计算表明缺陷模的频率与透射谱随着不同介电常量、不同几何结构以及掺杂的晶体结构而改变。     

Deep Radiation-Induced Defect Centers Created by a Fast Neutron Flux in CdZnTe Single Crystals

The effect of a fast neutron flux (Φ = 10¹⁴–10¹⁵ cm^–2) on the electrical and photoluminescence properties of p-CdZnTe single crystals is studied. Isothermal annealing is performed (T = 400–500 K), and the activation energy of the dissociation of radiation-induced defects is determined at E_D ≈ 0.75 eV.     

ULSI用CZ硅单晶中的空洞型原生缺陷及其控制

详细阐述了COP、LSTD和FPD等空洞型原生缺陷的基本性质、形成机理和它们与晶体生长参数的关系,以及目前主要采用的几种消除空洞型缺陷的方法.研究表明,利用快速退火消除空洞型原生缺陷,是一种简单而有效的方法.     

Superlarge Defects in CZ Si : B Single Crystals

Superlarge defects in CZ Si : B single crystals were visualized by scanning laser mid-IR microscopy. Previously, these defects were revealed in similar single crystals with the use of an SEM operating in the electron-beam-induced current (EBIC) mode and by small-angle scattering of mid-IR radiation.