碲锌镉缓冲层液相外延技术的研究

文章报道了采用液相外延方法，在碲锌镉衬底上进行碲锌镉薄膜缓冲层生长的情况，并且采用X光双晶衍射仪、X光形貌仪、红外傅里叶光谱仪、二次离子质谱仪等手段对碲锌镉薄膜进行了表征，碲锌镉薄膜具有较好地组分及均匀性，晶体结构质量也较好。采用碲锌镉缓冲结构生长了碲镉汞液相外延片，其碲锌镉与碲镉汞薄膜界面附近的杂质得到了有效的控制。     

碲锌镉缓冲层液相外延技术的研究

文章报道了采用液相外延方法，在碲锌镉衬底上进行碲锌镉薄膜缓冲层生长的情况，并且采用X光双晶衍射仪、X光形貌仪、红外傅里叶光谱仪、二次离子质谱仪等手段对碲锌镉薄膜进行了表征，碲锌镉薄膜具有较好地组分及均匀性，晶体结构质量也较好。采用碲锌镉缓冲结构生长了碲镉汞液相外延片，其碲锌镉与碲镉汞薄膜界面附近的杂质得到了有效的控制。     

昆明物理研究所大面积水平推舟液相外延碲镉汞薄膜技术进展

报道了近年来昆明物理研究所在富碲水平推舟液相外延碲镉汞外延薄膜制备技术方面的进展。2019年以来,突破了?120 mm碲锌镉晶体定向生长技术,使碲锌镉衬底沉积相和夹杂相密度≤5×103 cm－2,位错腐蚀坑密度（EPD）≤4.0×104 cm－2,?120 mm（111）晶圆衬底的Zn组份分布极差≤0.36%。基于碲锌镉衬底技术的进步,液相外延碲镉汞薄膜的最大生长尺寸达到了70 mm×75 mm,薄膜位错腐蚀坑密度均值为5×104 cm－2,X射线双晶回摆曲线半峰宽（DCRC-FWHM）≤35 arcsec,部分可控制到25 arcsec以下;50 mm×60 mm尺寸长波碲镉汞薄膜的厚度极差≤±1.25 μm,室温截止波长极差≤±0.1 μm,中波碲镉汞薄膜相应指标分别为≤±1 μm、≤±0.05 μm。材料技术的进展促进了制冷型碲镉汞探测器产能提升和成本的降低,也支撑了高性能长波/甚长波探测器、高工作温度（HOT）探测器以及2048×2048、4096×4096等甚高分辨率高性能探测器的研制。     

CdZnTe中富碲沉积相缺陷引起的液相外延HgCdTe薄膜表面缺陷

为了研究液相外延碲镉汞薄膜表面缺陷形成机制,采用光刻工艺结合化学腐蚀方法在碲锌镉衬底表面实现了网格化,研究了碲锌镉近表面富碲沉积相与外延薄膜表面缺陷的关系.结果表明:衬底近表面富碲沉积相会导致碲镉汞薄膜表面孔洞、类针形凹陷坑缺陷以及三角形凹陷坑聚集区;在液相外延过程中,高温碲镉汞熔液与CdZnTe衬底间的回熔作用可以减少与富碲沉积相相关的表面缺陷,薄膜表面缺陷与衬底表面富碲沉积相的匹配度与回熔深度负相关;回熔过程以及富碲沉积相形态、深度影响HgCdTe薄膜表面缺陷形态和分布.     

大尺寸碲锌镉基碲镉汞材料分子束外延技术研究

针对高质量、大规模碲镉汞红外焦平面探测器需求的持续增加,本文开展了使用分子束外延方式在50 mm×50 mm(211)B碲锌镉衬底上外延碲镉汞材料技术的研究.通过对碲锌镉衬底改进湿化学腐蚀、碲锌镉衬底预处理、碲锌镉衬底缓冲层生长、碲锌镉基碲镉汞材料工艺开发等方面的研究,开发出了能够稳定获得碲锌镉基碲镉汞材料的工艺.材料...     

液相外延碲镉汞贯穿型缺陷研究

液相外延碲镉汞材料的贯穿型缺陷会在后续器件制备中导致多个盲元的形成。采用共聚焦显微镜对该类缺陷的深度进行了表征,并对缺陷底部的成分进行了测试。使用聚焦离子束(Focused Ion Beam, FIB)将缺陷挖开后对其进行观察。对于贯穿型缺陷较多的碲锌镉衬底外延生长碲镉汞薄膜,统计后发现碲镉汞表面的贯穿型缺陷与衬底缺陷存在一定的对应关系,因此推测液相外延贯穿型缺陷起源于碲锌镉衬底缺陷。     

Si基复合衬底碲镉汞液相外延技术的研究

文章报道了采用Si基复合衬底,利用液相外延方法成功进行中波碲镉汞薄膜生长的情况,并且采用X光双晶衍射、X光形貌、红外付立叶光谱仪等手段对碲镉汞薄膜进行了表征。Si基复合衬底碲镉汞外延膜晶体结构为单晶,并且它的双晶衍射半峰值接近国外同类产品的先进水平。     

碲锌镉衬底上中长双色红外碲镉汞分子束外延生长研究

报道了使用分子束外延(Molecular beam epitaxy,MBE)技术,在(211)B碲镉汞(CdZnTe,CZT)衬底上生长中长波双色碲镉汞(HgCdTe,MCT)薄膜材料,生长温度为180℃,研究了双色碲镉汞薄膜材料衬底脱氧技术、分子束外延薄膜生长温度与缓冲层生长等关键技术,实现了中长波双色碲镉汞薄膜生长,外延薄膜采用相差显微镜、扫描电子显微镜(SEM)、傅里叶变换红外光谱仪(FTIR)、二次离子质谱仪(SIMS)及X射线衍射仪(XRD)对薄膜的表面缺陷、厚度、组分及其均匀性、薄膜纵向组分以及晶体质量进行了表征,表面缺陷数量低于600 cm~(-2),组分(300 K测试)和厚度均匀性分别为(35)x≤0.001、(35)d≤0.9μm,X-Ray双晶衍射摇摆曲线FWHM=65 arcsec,得到了质量较高的中长波双色碲镉汞薄膜材料。     

碲锌镉衬底表面在碲镉汞液相外延工艺中的热腐蚀效应

该研究以提高液相外延碲镉汞材料的质量为出发点,研究液相外延生长过程中碲锌镉衬底受到高温汞蒸气影响后的变化情况,并利用光学显微镜、白光干涉仪、能谱仪等分析测试手段对碲锌镉衬底表面进行分析.研究结果表明,液相外延生长过程中,高温汞蒸气对碲锌镉衬底中表面沉淀物尺寸无明显影响,但在衬底表面发现两种类型的腐蚀点,一种是尺寸为25μm左右的较大腐蚀点,分布较均匀;另一种是尺寸为7μm左右的圆形腐蚀点,分布不均匀.衬底经过液相外延薄膜成核生长前的温度变化过程以及高温Hg蒸气的作用,碲锌镉衬底表面形貌呈鱼鳞状,粗糙度增大了50%以上.     

中国电科11所碲镉汞薄膜材料制备技术进展

碲镉汞材料具有响应速度快、量子效率高、带隙连续可调等优点,广泛应用于红外探测领域,本文报道了近年来中国电科11所在碲镉汞薄膜材料制备方面的技术进展。在碲锌镉衬底材料制备方面,已突破135mm碲锌镉晶体生长技术,碲锌镉衬底平均位错腐蚀坑密度(EPD) <1×104cm-2,具备了80mm×80mm规格碲锌镉衬底的批量生产能力。在液相外延碲镉汞薄膜制备方面,富碲水平液相外延碲镉汞薄膜平均位错腐蚀坑密度EPD<4×104cm-2,具备80mm×80mm规格碲镉汞薄膜的制备能力;富汞垂直液相外延实现高质量双层异质结碲镉汞薄膜材料批量化制备,该种材料的半峰宽(FWHM)控制在(20～40)arcsec范围内,碲镉汞薄膜厚度极差≤±06μm。在分子束外延碲镉汞薄膜方面,实现了6 in硅基碲镉汞材料制备,组分标准偏差≤00015,表面宏观缺陷密度≤100cm-2;碲锌镉基碲镉汞材料已具备50mm×50mm制备能力,组分标准偏差为0002,厚度标准偏差为0047μm。从探测器验证结果来看,基于富碲水平液相外延碲镉汞薄膜实现了1 k×1 k、2 k×2 k等规格红外焦平面探测器的工程化制备;采用双层异质结碲镉汞薄膜实现了高温工作、长波及甚长波探测器的制备;使用分子束外延制备的碲镉汞薄膜实现了27 k×27 k、54 k×54 k、8 k×8 k等规格红外焦平面探测器研制,在宇航领域有巨大的应用潜力。     

Recent progress in CdZnTe crystals

CdZnTe crystals were grown by vertical gradient freezing (VGF) method with a Cd reservoir for controlling the Cd pressure under conditions such that the crystals are in equilibrium with a Cd vapor corresponding to the minimum deviation from stoichiometry. The precipitate size became smaller by a post growth annealing method in the VGF furnace after the crystal growth without using wafer annealing. The size became less than 2 μm. Precipitate-free crystals were also grown by controlling the cooling method. In addition, the carrier concentration of p-type CdZnTe crystals was reduced using polycrystals grown in pBN boats. We have found that the carrier concentration of p-type ingots is dependent on Na and Li impurity concentrations.     

CdZnTe单元探测器信号模拟及仿真

介绍了CdZnTe单元平面型射线探测器工作原理和模型,并对其输出的电流脉冲信号进行了理论计算和分析,结果表明输出电流信号约为1 nA/kev、脉冲上升时间为几十纳秒.讨论了在CdZnTe探测器前放电路设计过程中,采用PSpice软件进行模拟和仿真时,信号源选择采用电流源和电压源的参数计算方法.     

Surface passivation of CdZnTe wafers

The chemical polishing process and the subsequent passivation process of CdZnTe wafers were studied. The treatment effects were tested through XPS analysis and I–V measurement. The chemical etching in 2%Br–MeOH solution may effectively remove the damaged layer and improve the ohmic contact between CdZnTe wafer and Au electrodes. CdZnTe wafers after Br–MeOH etching were passivated with five different passivants respectively. It was found that the surface leakage currents of all CdZnTe wafers passivated with different passivants were reduced by 1–2 orders. CdZnTe wafer passivated in NH₄F/H₂O₂ solution showed the best passivation efficiency because the enriched Te on the surface was fully oxidized to TeO₂, which results in the thickest oxide layer, the most stoichiometric surface and the least leakage current. The surface of CdZnTe wafer is Te-rich after passivated in NH₄F/H₂O₂ or H₂O₂ solution and Cd-rich after passivated in KOH or KOH/H₂O₂ solution.     

Photoresponse asymmetry of CdZnTe crystals

It is shown that transformation of photoelectric characteristics of sensors based on Cd_{1 − x} Zn _x Te (x = 0.05–0.15) crystals into parametric spectral I(λ)-dI/dλ, kinetic I(t)-dI/dt, and dynamic U-I(Δy) _{f, λ} signatures (I(λ) is the photocurrent, U is the voltage, f is the frequency, t is the time, and y is the coordinate) makes it possible to reveal integrative photoresponse features caused by the photoresponse asymmetry and nonlinearity. Indices of asymmetry and balance of dynamic and energy photoinduced states are suggested; these indices represent systematically the effect of multiscale fields on photoelectronic processes. Using these indices, the ranges of external effects at which systematic features of photoresponse of sensors are minimal or maximal are determined, which makes it possible to increase the efficiency of purposeful selection and treatment of sensors.     

CdZnTe晶片的性能测试

测试了多个Cd0．9Zn0．1Te晶片的性能，包括红外透过率、成分分布、位错密度、Te沉淀／夹杂密度以及电阻率。研究表明，红外透过率与性能有着密切的联系：红外透过率的大小及红外透过率图谱的形状可反映晶片的成分分布、位错密度以及电阻率的情况。从晶片对红外光的吸收机理出发，对这些联系进行了详细的分析。     

Photoelectric signatures of CdZnTe crystals

To reveal the distribution of evident and latent electrically active defects of various types and different scales that affect the photoresponse of Cd_{1 − x} Zn _x Te alloys (x = 0.05–0.2), it is suggested to compare local photoelectric signatures U–I(y) _{f, λ} of various segments of the sample (U is the testing voltage, I is the photocurrent, y is the coordinate, λ is the wavelength, and f is the frequency of the testing signal), while, for the search of local instabilities of photoresponse, totality of integrated signatures U–I(Δy) _{f, λ} is most suitable. It is shown for the first time that the multiple scale and coordination of the fields of defects and acting field generate the spectral features of the photoresponse (reconstruction of the spectra and manifestation of latent photosensitivity bands), which are most completely and integratively reflected in signatures of the photocurrent spectra I(λ)–dI/dλ.     

未掺杂CdZnTe与掺铟CdZnTe晶体的热处理

对于未掺杂Cd0.9Zn0.1Te晶片,采用在Cd/Zn气氛下,以In作为气相掺杂源进行热处理;而对于低阻In-Cd0.9Zn0.1Te晶片,则采用在Te气氛下进行热处理.分别研究了不同的热处理条件,包括温度、时间、pIn或pTe等对晶片电学性能、红外透过率以及Te夹杂/沉淀相的影响.结果表明,在Cd/Zn气氛下适当的掺In热处理和在Te气氛下适当的热处理均有效地提高了晶片的电阻率,分别达到2.3×1010和5.7×109Ω·cm,同时晶片的其他性能也得到明显改善.