材料特性对亲水性固结磨料研磨垫加工性能的影响

为研究材料特性对亲水性固结磨料研磨垫的加工性能影响,本文研究了K9玻璃和硅片两种材料在不同加工顺序下研磨过程中的声发射信号和摩擦系数特征,采用扫描电镜分析磨屑的尺寸与形态.结果表明:不同加工顺序下工件的材料去除速率差别很大.与直接研磨硅片相比,先研磨K9玻璃再研磨硅片,硅片的材料去除速率大幅下降;相反,先研磨硅片再研磨K9玻璃,与直接研磨K9玻璃相比,K9玻璃的材料去除速率变化不大.无论采用哪种加工顺序,后研磨的工件表面粗糙度均比直接研磨的同种工件要大.扫描电镜的分析表明,硅片的磨屑尺寸集中在600 nm~1.5μm,磨屑大部分都棱角完整;而K9玻璃的磨屑尺寸集中在300 nm~500 nm左右,无明显棱角.硅片磨屑较大的尺寸与完整的棱角促进了研磨垫的自修正过程,所以硅片这类脆性较大的材料有利于研磨垫的自修正过程.     

固结磨料研磨SiC单晶基片(0001)C面研究

碳化硅(SiC)单晶基片已广泛应用于微电子、光电子等领域.本文针对传统游离磨料研磨加工的缺点,提出了固结磨料研磨SiC单晶基片技术,以前期研究的SiC单晶基片研磨膏配方,试制了一系列固结磨料研磨盘,研究了固结磨料研磨SiC单晶基片(0001)C面时的材料去除率、表面粗糙度及平面度,并与游离磨料研磨进行了对比.结果表明,固结磨料研磨后样品表面有深度较浅的划痕,游离磨料研磨后表面没有划痕,但表面呈凹坑状;游离磨料研磨后工件表面粗糙度轮廓最大高度Rz远大于固结磨料研磨;固结磨料研磨的材料去除率高于游离磨料,固结磨料研磨后的表面粗糙度Ra远低于游离磨料研磨,固结磨料研磨可提高平面度;研究结果可为进一步研究固结磨料化学机械研磨盘、固结磨料研磨工艺参数及机理提供参考依据.     

半固着磨具特性对其磨耗和工件材料去除的影响

为获得先进陶瓷材料的高效、高精度加工,通过采用新研制的半固着磨具来实现一种半固着磨粒加工技术．制作了以SiC为磨料的不同粒度和磨料浓度的半固着磨具（SFAT）,讨论分析了磨料粒度和磨料浓度对半固着磨具特性（剪切强度和表面硬度等）的影响．采用所制作的半固着磨具加工单晶硅片,研究半固着磨具的磨耗率和工件材料去除率．初步实验结果表明,磨料粒度#1000和磨料质量分数为65％的半固着磨具的磨具磨耗率最小且工件材料去除率最大．实验结果有助于指导半固着磨具制作．     

液体磁性磨具小孔光整加工材料去除机理及实验

针对小孔内壁光整加工技术的难题,本文提出一种新型精密研磨孔光整加工技术,以磁致相变理论为指导,从微观角度阐述了液体磁性磨具研磨孔光整加工的材料去除机理.采用"双刃圆半径"模型进行单个磨料颗粒切削模型研究,得出小孔光整加工的材料去除率数学表达式.通过实验验证了磨料粒度、入口压力、电流强度等因素对材料去除率以及表面粗糙度的影响,实验结果表明:在合适的范围内,增大磨料颗粒直径、入口压力以及电流强度有利于提高材料的去除率和表面质量.而当磨粒直径、入口压力以及电流强度选取过大时,虽然能获得较高的材料去除率,但是最终获得的表面粗糙度值并不理想.该研究为通孔零件内壁表面精密光整加工提供了有益参考.     

雾化法磁性磨料的磁力光整加工

利用雾化法制备的磁性磨料,通过自行研制的微型数控研磨机床,以S136模具钢为工件,进行磁力光整加工实验,考查主轴转速、磁性磨料粒度、磁场强度等因素对磁力光整加工中工件的表面粗糙度的影响。结果表明,主轴转速为900 r/min,磁性磨料粒径在104~150μm,磁场强度为0.9 T时,磁力光整加工中工件的表面质量最佳。     

CVD金刚石膜高效超精密抛光技术

CVD金刚石膜作为光学透射窗口和新一代计算机芯片的材料,其表面必须得到高质量抛光,但是现存方法难以满足既高效又超精密的加工要求.本文提出机械抛光与化学机械抛光相结合的方法.首先,采用固结金刚石磨料抛光盘和游离金刚石磨料两种机械抛光方法对CVD金刚石膜进行粗加工,然后采用化学机械抛光的方法对CVD金刚石膜进行精加工.结果表明,采用游离磨料抛光时材料去除率远比固结磨料高,表面粗糙度最低达到42.2 nm.化学机械抛光方法在CVD金刚石膜的超精密抛光中表现出较大的优势,CVD金刚石膜的表面粗糙度为4.551 nm.     

超声振动辅助固结磨粒抛光硅片表面形貌及粗糙度研究

高面型精度和高表面质量的硅片表面加工是目前研究的难点和热点问题之一,基于超声加工所具有的加工效率和加工表面质量高的特性,以及固结磨粒的加工质量易控制和对环境污染小的特点,开展超声椭圆振动辅助固结磨粒抛光硅片的材料去除、抛光表面面型精度及粗糙度的加工机理及实验研究。研究认为抛光工具运动轨迹是影响上述问题的主要因素,为此在对抛光实验系统描述基础上,分析并建立了抛光工具运动轨迹及轨迹密度模型,进而完成硅片材料去除,抛光表面形貌和表面粗糙度的建模仿真。开展相应的实验研究,发现理论分析与实验的结果相一致,基于抛光工具运动轨迹建模的可行性。该研究方法和得出结论为今后开展固结磨粒抛光硅片表面实验的工艺参数的选择和优化,提供了可供借鉴的研究成果,为实际生产提供了可供参考的理论依据。     

超粗糙氧化锆复合陶瓷磁性剪切增稠光整加工特性

针对超粗糙表面氧化锆陶瓷材料的光整问题,配置磁性剪切增稠光整加工介质,利用设计的磁场发生装置,在主轴转速900 r/min、X轴进给速度10000 mm/min和加工间隙0.7 mm的实验参数下,探究不同磨粒和磨粒粒径对氧化锆陶瓷件加工的影响规律.对250μm绿碳化硅的磁性剪切增稠光整介质进行加工时,工件表面粗糙度值能在180 min内降低38％.10μm立方氮化硼配置的磁性剪切增稠光整介质,能使工件表面粗糙度值在210 min内降低41％.在磨粒粒径相同的条件下,随着磨粒硬度的提高,加工效率增大.在磨粒质量分数相同的条件下,磨粒粒径越小,获取的最终表面粗糙度值越小.观测结果表明,对比未加工表面,加工后的表面变得光滑,材料去除肉眼可见,验证了所提出方法的有效性.     

磨削加工对Al_2O_3陶瓷表面质量与力学性能的影响

航空航天等领域的快速发展对Al_2O_3陶瓷表面加工质量的要求越来越高。目前,磨削加工由于精度高、材料去除率高而成为陶瓷表面加工最主要、最常用的方法,因此,建立磨削加工方式、陶瓷表面质量和力学性能之间的联系具有十分重要的意义。本工作利用精密研磨抛光机和磨床对Al_2O_3陶瓷进行表面加工,探讨了不同磨盘转速、磨盘/磨床砂轮目数、砂轮进刀量、磨床横向平移速度等不同磨削加工条件对陶瓷表面质量(材料表面粗糙度、表面形貌、表面残余应力)和力学性能的影响。研究结果表明:相比于磨盘加工,磨床加工对Al_2O_3陶瓷表面质量的影响较大,表现为磨床加工后的粗糙度数值较大,且磨削表面产生了较为明显的加工划痕。Al_2O_3陶瓷在磨削加工中的去除方式主要为脆性去除和延性域去除,加工后其表面残余应力均为压应力。特别地,在高的磨盘或砂轮目数、大的磨盘转速、较小的砂轮进刀量以及大的磨床平移速度情况下,Al_2O_3陶瓷以延性域去除为主,表面残余压应力最高达到-241 MPa。Al_2O_3陶瓷的力学性能是由表面粗糙度、表面微观形貌、表面残余应力共同作用的,随着陶瓷表面粗糙度的减小、残余压应力的增大,陶瓷弯曲强度提高,最高可达528 MPa。     

K9光学元件的锥形约束射流抛光流场与加工实验研究

提出了锥形约束射流抛光的加工方法,将原本垂直的细小射流约束成几乎平行于工件表面的环形射流。使用Fluent软件对抛光流场进行数值分析,根据Preston方程建立了材料去除函数模型;并以K9玻璃为加工对象,利用自主设计的锥形约束射流抛光平台进行加工实验。结果表明,锥形约束射流抛光方法法向最大速度比切向最大速度小63.9%,从而减少射流在垂直于工件表面方向的冲击损伤;锥形约束射流抛光后,K9玻璃表面粗糙度在加工区域内呈“V”型分布,其算数平均粗糙度(Ra)值从95.40 nm降至14.52 nm,表面质量得到明显提高。锥形约束射流抛光主要依靠射流沿工件表面的剪切力,不仅有效减小了射流法向冲击力,对射流的约束还减小了射流束的发散;确定的表面去除函数表明该方法有望实现确定性抛光;另外,环形的射流出口提高了射流抛光的效率。     

基于摩擦磨损实验的双盘直槽研磨方法的研具选材研究

双盘直槽（double-disc and linear-groove, DDLG）研磨方法是以1个平端面研磨盘和1个具有多条直沟槽的研磨盘为对磨研具,对圆柱滚子的滚动面进行精密加工的新方法。在加工过程中,圆柱滚子沿直沟槽连续供料,在2个研磨盘的摩擦力矩驱动下连续自转。研磨盘材料的选择是搭建双盘直槽研磨设备的基础。为了确定适用于双盘直槽研磨方法的研磨盘材料组合,基于摩擦磨损实验展开相关研究。首先,基于摩擦原理,分析了圆柱滚子的运动状态和研磨盘材料的摩擦特性对研磨效果的影响,并确定了研磨盘材料摩擦系数的筛选条件。然后,通过销-盘摩擦磨损实验测试了铸铁、45钢、黄铜、聚四氟乙烯（polytetrafluoroethylene, PTFE）、有机玻璃（polymethyl methacrylate, PMMA）、125%铸铁基固结磨料和125%树脂基固结磨料等多种备选材料在研磨条件下的摩擦系数、耐磨性和排屑性能。最后,搭建了双盘直槽研磨试验台,通过观察圆柱滚子的自转情况来验证基于摩擦磨损实验的研具选材方法的合理性。通过摩擦磨损实验测得,铸铁和45钢的滑动摩擦系数大,磨削效率高,但耐磨性差,适合用作大去除量场合的上研磨盘材料;有机玻璃的滑动摩擦系数大,耐磨性好,磨削效率高,适合用作小去除量场合的上研磨盘材料;聚四氟乙烯的滑动摩擦系数小,耐磨性好,可用作下研磨盘直沟槽材料;固结磨料的滑动摩擦系数变化大且易堵塞,不适合用作研磨盘材料。研究结果可为双盘直槽研磨设备的设计提供可行的研具选材依据。     

Loose abrasive lapping hardness of optical glasses and its interpretation

We present an interpretation of the lapping hardness of commercially available optical glasses in terms of a micromechanics model of material removal by subsurface lateral cracking. We analyze data on loose abrasive microgrinding, or lapping at fixed nominal pressure, for many commercially available optical glasses in terms of this model. The Schott and Hoya data on lapping hardness are correlated with the results of such a model. Lapping hardness is a function of the mechanical properties of the glass: The volume removal rate increases approximately linearly with Young's modulus, and it decreases with fracture toughness and (approximately) the square of the Knoop hardness. The microroughness induced by lapping depends on the plastic and elastic properties of the glass, depending on abrasive shape. This is in contrast to deterministic microgrinding (fixed infeed rate), where it is determined from the plastic and fracture properties of the glass. We also show that Preston's coefficient has a similar dependence as lapping hardness on glass mechanical properties, as well as a linear dependence on abrasive size for the case of brittle material removal. These observations lead to the definition of an augmented Preston coefficient during brittle material removal. The augmented Preston coefficient does not depend on glass material properties or abrasive size and thus describes the interaction of the glass surface with the coolant-immersed abrasive grain and the backing plate. Numerical simulations of indentation are used to locate the origin of subsurface cracks and the distribution of residual surface and subsurface stresses, known to cause surface (radial) and subsurface (median, lateral) cracks.     

Machining and surface finishing of brittle solids

Ceramic materials are finished primarily by abrasive machining processes such as grinding, lapping, and polishing. In grinding, the abrasives typically are bonded in a grinding wheel and brought into contact with the ceramic surface at relatively high sliding speeds. In lapping and polishing, the ceramic is pressed against a polishing block with the abrasives suspended in between them in the form of a slurry. The material removal process here resembles three-body wear. In all these processes, the mechanical action of the abrasive can be thought of as the repeated application of relatively sharp sliding indenters to the ceramic surface. Under these conditions, a small number of mechanisms dominate the material removal process. These are brittle fracture due to crack systems oriented both parallel (lateral) and perpendicular (radial/median) to the free surface, ductile cutting with the formation of thin ribbon-like chips, and chemically assisted wear in the presence of a reactant that is enhanced by the mechanical action (tribochemical reaction). The relative role of each of these mechanisms in a particular finishing process can be related to the load applied to an abrasive particle, the sliding speed of the particle, and the presence of a chemical reactant. These wear mechanisms also cause damage to the near ceramic surface in the form of microcracking, residual stress, plastic deformation, and surface roughness which together determine the strength and performance of the finished component. A complete understanding of the wear mechanisms leading to material removal would allow for the design of efficient machining processes for producing ceramic surfaces of high quality. The research was supported in part by the National Science Foundation through grants MSS 9057082, Jorn Larsen-Basse, Program Director and DDM 9057916, Bruce Kramer, Program Director.     

Grinding process for beveling and lapping operations in lens manufacturing

A grinding process that uses loose abrasives for the beveling of lenses is presented. Determination of the parameters of grinding tools with loose abrasives for beveling applications with various optical elements is discussed. The process of grinding with loose abrasives for a lapping operation is analyzed by examination of the influence of optical glass material parameters on material removal and surface roughness for lens manufacturing conditions. The model established for this analysis uses the concept of lateral fracture, which is based on removal of optical glass material by rolling abrasive particles. The particles remove material by lateral cracking. The abrasive mineral Barton Garnet was used in the lapping experiments. Under specific large-diameter lens manufacturing conditions, lapping time values at the conventional removal depth have been obtained for various optical glasses.     

Loose abrasive slurries for optical glass lapping

Loose abrasive lapping is widely used to prepare optical glass before its final polishing. We carried out a comparison of 20 different slurries from four different vendors. Slurry particle sizes and morphologies were measured. Fused silica samples were lapped with these different slurries on a single side polishing machine and characterized in terms of surface roughness and depth of subsurface damage (SSD). Effects of load, rotation speed, and slurry concentration during lapping on roughness, material removal rate, and SSD were investigated.     

Polishing of semiconductor materials

Different abrasive processes such as grinding and lapping are necessary to produce semiconductor wafers. However grinding and lapping leads to deterioration of the surface integrity of monocrystalline wafers. Therefore polishing and planarization is of utmost importance to produce microelectronic components. In this lecture the basics of polishing technology as well as different process models are presented. Additionally the properties of different semiconductor substrate materials Si, GaAs are discussed.     

研磨加工中光学材料亚表面损伤的表征方法

研磨加工过程中引入的亚表面损伤直接降低了光学零件的强度、长期稳定性、成像质量、镀膜质量和抗激光损伤阂值等重要性能指标,对其进行准确检测和全面表征是提高光学加工质量和加工效率的前提条件之一．为此,利用名义深度、最大深度和损伤密度沿深度分布3个表征参数对亚表面损伤进行全面的表征,并建立了上述参数的理论预测模型;使用磁流变斜面抛光测试技术结合图像处理方法测量了K9玻璃在不同研磨条件下的亚表面损伤,对理论模型进行验证．研究表明：上述3个表征参数能够对研磨亚表面损伤进行全面、定量和准确的描述;建立的理论预测模型实现了亚表面损伤深度的准确预测;研磨亚表面损伤最大深度约为磨粒粒度的1／2,最大深度与名义深度的比值为1．21±0．05;亚表面损伤密度沿深度呈指数递减分布,并在距离表面约为名义深度的1／2时,下降趋势变缓．