采用Ag-Cu-Ti钎料钎焊Cf/SiC接头的组织和强度

选用Ag-35.5Cu-1.8Ti和Ag-27.4Cu-4.4Ti两种钎料,在880℃/10min钎焊规范下进行了Cf/SiC陶瓷基复合材料的钎焊实验。实验结果表明,钎焊接头中央为典型的Ag-Cu共晶组织,而在钎料与Cf/SiC母材的界面处形成了扩散反应层,Ti在该层中富集。通过界面X射线衍射分析,确定界面存在TiC相,但未检测到Ti-Si相。分析了界面反应机理。接头强度试验结果表明,采用Ag-35.5Cu-1.8Ti钎料获得接头的三点弯曲强度为132.5MPa,而Ag-27.4Cu-4.4Ti对应的接头强度为159.5MPa,分析认为,Ti在钎料中的活性是决定接头性能的关键因素之一,即接头强度随着钎料中Ti活性的提高而呈现增加的趋势。     

用Ti50Cu＋W钎料连接Si／SiC复相陶瓷与殷钢的研究

采用真空钎焊方法,以Ti50Cu W钎料连接Si/SiC复相陶瓷与殷钢.观察分析了获得接头显微组织结构,测定了接头的力学性能,研究了工艺参数和增强相W含量对接头组织结构和力学性能的影响.研究结果表明:采用Ti50Cu W钎料连接Si/SiC复相陶瓷与殷钢,可获得连接良好、组织致密的接头,W含量30%(体积分数),钎焊温度970℃,保温时间5rain时,接头室温剪切强度达到最大值106MPa.     

采用BNi68CrWB钎料钎焊GH783的接头组织与性能

选用BNi68CrWB钎料,对低膨胀高温合金GH783的钎焊工艺及接头组织性能进行研究.研究表明,采取BNi68CrWB钎料、钎焊规范为1180℃/10min,钎焊试样焊后进行完全热处理,获得钎焊接头室温拉伸强度最高达到701MPa,接头650℃拉伸强度最高达到了696MPa;钎焊接头的组织由镍-钴基γ固溶体、共晶及其他脆性化合物相构成;钎焊间隙不同,接头中固溶体所占比例不同,0.05mm间隙中元素扩散较充分,接头以固溶体为主,共晶及其他脆性化合物相较少.钎焊间隙对接头性能影响较大,0.05mm钎焊间隙的接头强度明显高于0.1mm间隙接头.     

Ti(C,N)基金属陶瓷/AgCuTi/40Cr钎焊接头组织和机械性能研究

在真空钎焊炉中采用活性钎料AgCuTi,成功将Ti(C,N)基金属陶瓷和金属40Cr进行钎焊连接,形成了Ti(C,N)基金属陶瓷/AgCuTi/40Cr钎焊接头.采用SEM、EDS和XRD等手段对Ti(C,N)基金属陶瓷/AgCuTi/40Cr钎焊接头的形貌组织进行了分析,研究了钎焊接头的机械性能,得到了Ti(C,N)...     

采用Ag-Cu-Ti钎料真空钎焊SiO2f/SiO2复合陶瓷与C/C复合材料

分别在880℃/10min和880℃/60min规范下,采用Ag-Cu-Ti活性钎料实现了SiO2f/SiO2复合陶瓷与C/C复合材料的真空钎焊连接,通过电子探针(EPMA)、能谱仪(XEDS)和X射线衍射仪(XRD)分析了接头微观组织,室温下测试了接头的抗剪强度。结果表明:两种规范下所得接头界面结合良好,接头中靠近两侧母材均形成了一层扩散反应层,钎缝基体主要由均匀的共晶组织组成。880℃/10min规范下钎焊接头界面产物依次为:SiO2f/SiO2→Ti4O7→Ti5Si4+Cu(s,s)+Ag-Cu共晶合金→TiC→C/C;对于880℃/60min规范下的接头,界面组织结构与保温10min的接头基本类似,但是不存在Cu(s,s),并且接头反应层明显增厚。880℃/60min条件下所得钎焊接头剪切强度平均值为16.6MPa。     

采用Ti-Zr-Cu-Ni钎料钎焊SiC纤维增强钛基复合材料的接头组织与性能

针对SiCf/β21S钛基复合材料,采用Ti-Zr-Cu-Ni钎料,进行了钎焊实验和接头力学性能测试.实验结果表明:960℃/10min规范下的钎缝组织形貌单一,钎焊接头剪切强度平均值为97.9MPa;960℃/10min/5MPa规范下的钎缝主要由层片状组织组成,接头剪切强度平均值达到303.7MPa,较前者提高了3倍左右,该接头经过900℃/2h热处理后组织变化不大.钎缝中的缺陷以及Ti和Zr与Cu和Ni两种合金元素形成的脆性化合物相在接头中含量的多少决定着接头的力学性能.     

SiC陶瓷与316L不锈钢真空活性钎焊

采用Ag-Cu-Ti活性钎料,通过真空钎焊方法进行了SiC陶瓷与316L不锈钢的连接,研究了接头的界面组织、特征点成分和物相,并探讨了钎焊温度(800～930℃)、保温时间(0～30 min)对接头界面组织和连接强度的影响。结果表明,SiC陶瓷与316L不锈钢钎焊抗剪断口均发生在SiC陶瓷与钎料连接界面处,由于活性元素Ti的作用,在陶瓷与钎料的界面处形成了连续的反应层,反应生成了Ti C和Ti5Si3;在316L不锈钢与钎料的界面处,生成了Fe-Ti化合物和Cu-Ti化合物。随着钎焊温度升高及保温时间延长,接头强度均呈现出一个峰值,在温度为900℃,保温20 min的工艺条件下可获得最大接头抗剪强度。     

SiC陶瓷与316L不锈钢真空活性钎焊北大核心CSCD

采用Ag-Cu-Ti活性钎料,通过真空钎焊方法进行了SiC陶瓷与316L不锈钢的连接,研究了接头的界面组织、特征点成分和物相,并探讨了钎焊温度(800～930℃)、保温时间(0～30 min)对接头界面组织和连接强度的影响。结果表明,SiC陶瓷与316L不锈钢钎焊抗剪断口均发生在SiC陶瓷与钎料连接界面处,由于活性元素Ti的作用,在陶瓷与钎料的界面处形成了连续的反应层,反应生成了Ti C和Ti5Si3;在316L不锈钢与钎料的界面处,生成了Fe-Ti化合物和Cu-Ti化合物。随着钎焊温度升高及保温时间延长,接头强度均呈现出一个峰值,在温度为900℃,保温20 min的工艺条件下可获得最大接头抗剪强度。     

Cu-Ni-Ti系合金钎料对Si_3N_4陶瓷自身及其与金属的连接研究

系统研究了Cu-Ni-Ti系合金钎料对Si3 N4陶瓷的润湿性 ,并使用不同形式的钎料进行了Si3 N4/Si3 N4的连接 .使用真空熔炼合金作为钎料 ,获得的Si3 N4/Si3 N4接头强度值并不理想 ,分析其原因 ,采用膏状钎料改善钎料成分的均匀性 ,并重新设计了四种成分的钎料 ,其中钎料Cu -Ni5～ 2 5 -Ti1 6～ 2 8-Br(B) / %对应的Si3 N4/Si3 N4接头强度最高 ,在 1 3 5 3K ,1 0min的真空钎焊条件下三点弯曲强度达 3 3 8.8MPa.制备了上述合金的急冷态钎料 ,使连接强度进一步提高至 40 2MPa,接头呈现较稳定的高温性能 .使用这种急冷态钎料还获得了室温及高温强度均较理想的Si3 N4/ 1 .2 5Cr-0 .5Mo钢接头 .     

Ti2AlNb合金钎焊工艺研究

研究了不同钎焊工艺对Ti2 A1Nb合金的接头组织和力学性能的影响.分别选取中温、高温Ti-Cu-Zr-Ni两种粉末钎料,在不同的钎焊温度和保温时间钎焊,采用光学金相显徽镜、扫描电镜、能谱以及室温拉律力学实验对接头的组织和室温抗拉强度进行研究.实验结果表明,接头组织与母材组织相差较大,中间有双相脆性中间层组织产生.高温钎料在其钎焊温度下接头晶粒长大,母材组织粗化.室温拉伸实验表明,两种钎料钎焊的接头力学性能较差.     

采用Ag-Cu-In-Ti焊料连接碳化硅陶瓷

采用四元Ag-Cu-In-Ti焊料成功地连接了常压烧结SiC陶瓷. 研究了钎焊温度和保温时间对碳化硅连接强度的影响, 同时通过EPMA和TEM分析连接界面的微观结构, 并且探讨了连接的原理. 试验结果表明, 在700～780℃试验温度范围内, 碳化硅的连接强度存在峰值, 最高四点弯曲强度达到了234MPa, 但是连接强度随着保温时间的增加呈现单调下降趋势. 接头微观结构由基体SiC、反应层和焊料三部分组成, 连续致密的反应层紧密连接基体和焊料, 反应层由带状层、TiC层和Ti5Si3层组成, 带状层宽度约20nm, 由Ag、In、Si和少量的Ti、Cu组成. 元素线扫描结果显示焊料中的活性元素Ti含量在反应层内形成峰值, 活性元素Ti与SiC发生反应生成新的反应层是连接的主要因素.     

Joining of carbon fibre-reinforced silicon nitride composites with 72Ag-26Cu-2Ti filler metal

Unidirectionally reinforced carbon fibre/Si₃N₄ matrix composites were joined with 72Ag-26Cu-2Ti filler metal. Joining interfaces were observed by SEM and analysed by energy dispersive spectroscopy. The strength of the joints was evaluated by four-point bending tests. Most of the interfaces of Si₄N₄ matrix/filler metal were firm without cracking and separation. At the interfaces, reaction between the composites and filler metal was limited. Only a concentration of titanium at Si₃N₄ matrix/filler metal interface was confirmed. On the fracture surfaces, many holes left as traces of pull-out of carbon fibres and pulled out fibres could be observed. The maximum joining strength and the average strength, measured by the bending test, were 159 MPa and 107 MPa, respectively. The pull-out process of fibres from the matrix and the reasons for the large scatter in the strength of joints, were discussed. The fibre pull-out behaviour could be related to fibre distribution density at the joining interface.     

Microstructure and strength of brazed joints of Ti3Al-base alloy with different filler metals

The interfacial microstructure and properties of brazed joints of a Ti₃Al-based alloy were investigated in this paper to meet the requirements of the use of Ti₃Al-based alloy in the aeronautic and space industries. The effects of different brazing fillers on the interfacial microstructure and shear strength were studied. The relationship between brazing parameters and shear strength of the joints was discussed, and the optimum brazing parameters were obtained. The brazed joints were qualitatively and quantitatively analyzed by means of EPMA, SEM and XRD. The results showed that using a AgCuZn brazing filler, TiCu, Ti(Cu,Al)₂ and Ag[s,s] were formed, the shear strength of the joint was decreased because of the formation of TiCu and Ti(Cu,Al)₂; using a CuP brazing filler, Cu₃P, TiCu and Cu[s,s] were formed at the interface of the joint, the former two intermetallic compounds decreased the shear strength. The analysis also indicated that using the TiZrNiCu brazing filler, the optimum parameters were temperature T=1323 K, joining time t=5 min, and the maximum shear strength was 259.6 MPa. For the AgCuZn brazing filler, the optimum parameters were joining temperature T=1073 K, joining time t=5 min, and the maximum shear strength was 165.4 MPa. To the CuP brazing filler, the optimum parameters were joining temperature T=1223 K, joining time t=5 min, and the maximum shear strength is 98.6 MPa. Consulting the results of P. He, J.C. Feng and H. Zhou [Microstructure and strength of brazed joints of Ti₃Al-base alloy with NiCrSiB, Mater. Charact., 52(8) (2004) 309–318], relative to the other brazing fillers, TiZrNiCu is the optimum brazing filler for brazing Ti₃Al-based alloy.     

Microstructure and strength of TiC cermet/cast iron brazed with Ag – Cu – Zn filler metal

Abstract

The brazing of TiC cermet to cast iron was carried out at 1223 K for 5 – 30 min using Ag – Cu – Zn filler metal. The formation phases, interface structures and shear strengths of the joints were investigated. The experiment result and analysis identify that three new phases, namely Cu base solid solution, Ag base solid solution and (Fe, Ni) have formed during the brazing of TiC cermet to iron. The interface structure of the joints can be expressed as TiC cermet/Cu base solid solution/Ag base solid solution + a little Cu base solid solution/Cu base solid solution + (Fe, Ni)/cast iron. The highest shear strength of the joints is 292.0 MPa, obtained with a brazing time of 20 min.     

高体积比SiCp/6063Al复合材料的铝基钎料制备及钎焊工艺研究

采用快速甩带技术制备了(Al-10Si-20Cu-0.05Ce)-1Ti(质量分数/％)急冷箔状钎料,并对60％体积分数的SiCp/6063Al复合材料进行真空钎焊实验,然后对钎料及接头的显微组织与性能进行测定和分析.结果表明,急冷钎料的微观组织细小、成分均匀,厚80～90μm,主要包含Al、CuAl2、Si和Al2Ti等相.当升高钎焊温度(T/℃)或延长保温时间(t/min),SiCp/钎料界面的润湿性改善,6063Al基体/钎料间互扩散和溶解作用增强,接头连接质量逐渐提高.当T=590℃、t=30 min时,接头抗剪强度达到112.6MPa;当T=590℃、t=50 min时,少量小尺寸SiCp因液态钎料排挤而分散于钎缝,因加工硬化而使接头强度递增7.3％.然而,当T≥595℃、t≥60 min时,SiCp偏聚于钎缝,导致接头组织恶化,且剪切断裂以脆性断裂为主.综合考虑钎焊成本与接头强度使用要求,确定最佳钎焊工艺为590℃、30 min.     

Brazing continuous carbon fiber reinforced Li2O–Al2O3–SiO2 ceramic matrix composites to Ti–6Al–4V alloy using Ag–Cu–Ti active filler metal

C_f/LAS composites and TC4 alloy were brazed successfully by vacuum brazing using Ag–Cu–Ti active filler metal. The interfacial microstructure was characterized by a scanning electron microscope, energy dispersive spectrometer and X-ray diffraction. The effects of brazing temperature on the interfacial microstructure and joint properties were investigated in details. Various phases including TiC, TiSi₂, Ti₃Cu₄, Cu (s,s), Ag (s,s), TiCu and Ti₂Cu were formed in the brazed joints. Interfacial microstructure varies greatly with the increase of brazing temperature, while the amount of Ti₂Cu reduced, but no new phase is generated. The optimal shear strength of the joint is 26.4 MPa when brazed at 890 °C for 10 min. Shear test indicated that the fracture of the brazed joints went through the TiSi₂ + TiC layer close to the C_f/LAS composites interface.     

活性钎焊法连接碳化硅陶瓷的连接强度和微观结构

采用三元Ag-Cu-Ti活性焊料连接常压烧结碳化硅陶瓷,研究了反应温度、保温时间等钎焊工艺对碳化硅陶瓷连接强度的影响,分析了连接界面的微观结构和反应产物. 实验结果表明,在实验范围内,钎焊温度和保温时间对碳化硅陶瓷的连接强度均有峰值,四点弯曲强度最高达到342MPa,随着钎焊温度的升高,界面反应层厚度增加,连接强度提高,但过高的钎焊温度引起焊料的挥发而使连接强度下降. 焊料中的活性元素Ti与碳化硅发生反应在连接界面形成均匀致密的反应层,反应层厚度约1μm,XRD和EDX能谱分析结果表明反应产物是TiC和Ti₅Si₃.     

原位法表征碳／碳复合材料界面性能的研究

用单丝顶出和束顶出法分别测试了细编穿刺碳／碳（Ｃ／Ｃ）复合材料不同层次的界面粘结性能，研究了生产工艺对不同层次界面性能的影响，建立了顶出试验的力学模型，并用有限元方法分析了界面上应力的分布情况，对可能的界面破坏模式进行了预测，为最终优化Ｃ／Ｃ复合材料的生产工艺提供了依据。     

Effects of Al–8.5Si–25Cu–xY filler metal foils on vacuum brazing of SiCp/Al composites

Rapidly solidified Al–8.5Si–25Cu–xY (wt-%, x?=?0, 0.05, 0.1, 0.2, 0.3, 0.4, and 0.5) foils were used as filler metal to braze Al matrix composites with high SiC particle content (SiCp/Al-MMCs), and the filler presented fine microstructure and good wettability on the composites. The joint shear strength first increased, then decreased and a sound joint with a maximum shear strength of 135.32?MPa was achieved using Al–8.5Si–25Cu–0.3Y as the filler metal. After Y exceeded 0.3%, a needle-like intermetallic compound, Al3Y, was found in the brazing seam, resulting in a dramatic decline in the shear strength of the brazed joints. In this research, the Al–8.5Si–25Cu–0.3Y filler metal foil was found to be suitable for the brazing of SiCp/Al-MMCs with high SiC particle content.     

SiC颗粒增强铝基复合材料的纯铜中间层液相扩散焊

采用Cu箔中间层在Ar气氛保护、550℃条件下过渡液相扩散焊(TLP)焊接SiC颗粒(SiC_P)增强Al基复合材料SiC_P/ZL101和SiC_P/Al (SiC_P 10vol%),对母材与焊接接头的微观组织、剪切强度、焊接接头剪切断面与断裂路径等进行分析。结果表明:在铸Al(ZL101)与纯Al(Al)基体中,分别通过共晶温度较低的Al-Si-Cu(524℃)三元共晶反应与Al-Cu(548℃)二元共晶反应实现中间层金属/基体金属(M/M)界面润湿。其中铸Al基体焊接接头中虽有颗粒偏聚,但由于Al-Si-Cu三元共晶反应的Cu含量(26.7wt%)低于Al-Cu二元共晶反应的Cu含量(33wt%),SiC_P/ZL101焊接接头焊缝中CuAl₂相少于SiC_P/Al焊接接头焊缝中的CuAl₂相,且未出现CuAl₂相的聚集,故其强度较高。Cu中间层形成的金属间化合物CuAl₂相是影响焊接接头力学性能的重要因素,两种复合材料焊接接头的剪切强度分别为85.4 MPa和73 MPa。