化学亚胺化法合成三元共聚聚酰亚胺

以N,N-二甲基甲酰胺为溶剂,用3,3′,4,4′-二苯酮四酸二酐(BTDA)、2,2-双[4-(4-氨基苯氧基)苯基]丙烷(BAPP)和4,4′-二氨基二苯砜(DDS)合成3种聚酰亚胺(PI)。先用BAPP和/或DDS与BTDA反应生成一系列聚酰胺酸(PAA),然后将得到的PAA化学亚胺化制备相应的PI。用傅里叶变换红外光谱(FTIR)仪、核磁共振仪和黏度计等表征了聚合物的结构和性能。FTIR谱图中1780,1720,725 cm~(-1)附近出现了PI的特征吸收峰。制备的PI有很好的热稳定性,N_2气氛中低于500℃没有明显的降解。     

2L-FCCL用聚酰亚胺复合膜的制备与性能

采用2,2′-双[4-(4-氨基苯氧基)苯基]丙烷(BAPP)、4,4′-二氨基二苯醚(ODA)和3,3′,4,4′-二苯酮四酸二酐(BTDA)合成BAPP/ODA/BTDA型聚酰亚胺(PI)的前驱体聚酰胺酸(PAA)溶液,将该溶液涂覆于3,3′,4,4′-联苯四甲酸二酐(BPDA)/ODA型PI基膜上,通过去溶剂和热亚胺化制备PI复合膜,将复合膜的热塑面与铜箔复合,热压制得二层挠性覆铜板(2L-FCCL)。研究了BAPP/ODA/BTDA型PI、BPDA/ODA型PI、PI复合膜及2L-FCCL的性能。结果表明:BAPP/ODA/BTDA型PI薄膜的玻璃化转变温度为238℃,耐热性能优异,PI复合膜在280℃,15MPa下与铜箔层压50~60min制得的2F-FCCL剥离强度大于0.8N/mm,且经360℃焊锡浴测试未分层、未起泡,耐热性能和剥离强度均满足工业要求。     

二层法双面挠性覆铜板用热塑性聚酰亚胺的合成与应用研究

选用合适的单体芳香二酐二苯甲酮四酸二酐（BTDA）、2,2’-双[4-（3,4-二羧基苯氧基）苯基]丙烷四羧酸二酐（BPADA）和芳香二胺3,3′,5,5′-四甲基-4,4′-二氨基二苯甲烷（AMD）、4,4′-二氨基二苯甲烷（MDA）、4,4′-二氨基二苯醚（ODA）,3,4＇-二氨基二苯醚（3,4＇-ODA）根据不同配比反应得到聚酰胺酸,用乙酸酐／三乙胺经化学亚胺化得到热塑性聚酰亚胺（TPI）,将其用N-甲基吡咯烷酮（NMP）溶解配成一定固含量的胶液,涂覆铜箔烘干溶剂得到二层挠性覆铜板（2L—FCCL）,然后将2L—FCCL高温压合制备双面挠性覆铜板,其剥离强度较高。     

聚酰胺酸的制备与亚胺化过程研究

用二酐BTDA与两种二胺单体(ODA、BAPP)在极性溶剂1-甲基-2-吡咯烷酮(NMP)中,通过共缩聚制备出聚酰胺酸(PAA),并经过热酰亚胺化得到聚酰亚胺(PI)。采用FT-IR和1H-NMR对产物的结构官能团和分子中质子氢进行表征,并利用FT-IR对聚酰胺酸热亚胺化过程进行追踪测试,结果表明,实验制备出了聚酰胺酸且固化工艺对聚酰胺酸亚胺化程度有较大影响。对固化温度和保温时间进行优化改进,确定出最佳固化工艺,并对聚酰胺酸热亚胺化过程的环化机理进行分析。     

BAPP-PBAP-ODPA共聚聚酰亚胺的合成

用2,2-双[4-(4-氨基苯氧基)苯基]丙烷(BAPP)和4-苯基-2,6-双(4-氨基苯基)吡啶(PBAP)作为二胺,3,3′,4,4′-二苯醚四羧酸二酐(ODPA)作为二酐,以N,N-二甲基甲酰胺(DMF)为溶剂,通过常规的两步法,分别经热亚胺化和化学亚胺化合成了3种聚酰亚胺。用傅里叶变换红外光谱和核磁共振氢谱表征聚合物的结构,结果表明在1 780,1 720,725 cm~(-1)附近出现了聚酰亚胺的特征吸收峰。采用热重分析,溶解性、拉伸性能和吸水率测试表征了产物性能。所合成的聚酰亚胺溶解性和热稳定性良好,在N_2气氛中,起始降解温度超过500℃;800℃质量保持率为46.2%～64.5%(化学亚胺化)和52.6%～64.8%(热亚胺化)。聚酰亚胺膜的拉伸强度、拉伸断裂应变、拉伸模量分别为107.2～109.6 MPa,7.8%～10.5%,2.13～2.28 GPa。膜的吸水率为0.68%～0.75%。     

双酚A型二胺和二酐与含吡啶环二胺共聚改性

用2,2-双[4-(4-氨基苯氧基)苯基]丙烷(BAPP)和4-苯基-2,6-双(4-氨基苯基)吡啶(PBA P)作为二胺,双酚A型二酐(BPADA)作为二酐,以N,N-二甲基甲酰胺(DMF)为溶剂,通过常规的两步法.分别经热亚胺化和化学亚胺化过程合成了3种聚酰亚胺(PI).用傅里叶变换红外光谱表征聚合物的结构.结果表...     

以BAPP为原料的热塑性PI薄膜的合成及性能

以芳香长链二胺2,2-双[4-(4-氨基苯氧基)苯基]丙烷(BAPP)为二胺原料,与最具商业价值的四种酸酐均苯四甲酸二酐(PMDA)、3,3′,4,4′-联苯四酸二酐(BPDA)、3,3′,4,4′-二苯酮四酸二酐(BTDA)、3,3′,4．4′-二苯醚四酸二酐(ODPA)为二酸酐原料,采用二步溶液缩聚法制得了一系列均聚和共聚聚酰亚胺薄膜。利用FTIR表征了聚酰亚胺的结构,并用DSC、TOA、TMA DMA等手段测得了不同聚酰亚胺的Tg、5%与10%热失重温度、线膨胀系数、拉伸强度、断裂延伸率、热压粘接T型剥离强度等性能数据。     

共聚型聚酰亚胺热亚胺化动力学研究

为考察共聚体系的热亚胺化动力学,今以4,4’-二氨基二苯醚(ODA),均苯二酐(PMDA),3,3’,4,4’-二苯酮二酐(BTDA)为单体合成共聚型聚酰胺酸(PAA),通过差示扫描量热分析(DSC)法测量PAA亚胺化动力学,并通过红外光谱分析仪 FT-IR 分析聚酰亚胺(PI)亚胺化程度,万能试验机测试共聚物力学性能.结果表明:随着柔性二酐(BTDA)的引入,聚合物分子链柔性增强,DSC图谱上反应出亚胺化反应相对平缓.动力学数据显示,二酐共聚体系亚胺化反应活化能最小,端基间碰撞克服的能垒最低,有利于亚胺化的进行.     

柔性覆铜板用1，4-双（2，4-二氨基苯氧基）苯型聚酰亚胺薄膜的制备方法

公开了一种柔性覆铜板用1，4-双（2，4-二氨基苯氧基）苯型聚酰亚胺薄膜的制备方法。包括：（1）1，4-双（2，4-二氨基苯氧基）苯、芳香族二元伯胺、芳香族二元酐、含不饱和双键的有机化合物，在强极性非质子有机溶剂体系中于20—80℃搅拌反应，得到棕色粘稠的聚酰胺酸溶液；     

DABA-BAPP-BPADA共聚聚酰亚胺的合成与性能

用2,2-双[4-(4-氨基苯氧基)苯基]丙烷(BAPP)及3,5-二氨基苯甲酸(DABA)作为二胺,2,2-双[4-(3,4-二羧基苯氧基)苯基]丙烷二酐(BPADA)作为二酐,以N,N-二甲基甲酰胺(DMF)为溶剂,通过常规的两步法,分别经热亚胺化和化学亚胺化过程合成了可溶性共聚聚酰亚胺。用FT-IR对聚合物的结构进行了表征,性能测试采用了溶解性测试、DSC、TGA、拉伸测试和吸水率测试。FT-IR图谱表明,在1 780cm~(-1)、1720 cm~(-1)和740 cm~(-1)左右出现了聚酰亚胺的特征吸收峰。共聚聚酰亚胺在常见有机溶剂中可溶,并且有很好的热稳定性,玻璃化转变温度T_g为226.5℃,在氮气氛中降解起始温度508.5℃,800℃质量保持率为46.5%。共聚聚酰亚胺膜的拉伸强度、拉伸模量、断裂伸长率分别为109.7MPa、2.25GPa和15.2%。     

双酚A型二胺和二酐合成可溶性聚酰亚胺的研究

采用2,2-双[4-(4-氨基苯氧基)苯基]丙烷(BAPP)和2,2-双[4-(3,4-二羧基苯氧基)苯基]丙烷二酐(BPADA)为单体,N,N-二甲基甲酰胺(DMF)为溶剂,通过常规的两步法,并分别经热亚胺化和化学亚胺化过程合成了双酚A型聚酰亚胺(PI).用FTIR、DSC、TGA等对聚合物的结构和性能进行了表征.F...     

Thermoplastic and low dielectric constants polyimides based on BPADA-BAPP

ABSTRACT

The thermoplastic and low dielectric constants polyimides were introduced. The polyimides were prepared by pyromellitic dianhydride (PMDA) or 4,4?-(4,4?-Isopropylidenediphenoxy)diphthalic anhydride (BPADA) as anhydride monomer and 4,4?-oxydianiline (ODA) or 2,2-bis(4-(4-aminephenoxy)phenyl)propane (BAPP) as amine monomer. The polyimides were well characterized by FT-IR, thermogravimetric analysis, dynamic thermomechanical analysis, dielectric measurement, and tensile test. The dielectric constants were 2.32–2.95 compared with 3.10 of ODA-PMDA polyimide, while partly polyimides were thermoplastic. The results indicated anhydride monomers, containing lateral methyl groups, made polyimides become thermoplastic. The results of molecular simulations via Materials Studio also proved this conclusion.     

可溶性PBAP-ODPA-BPADA共聚聚酰亚胺的合成与性能

用4-苯基-2,6-双(4-氨基苯基)吡啶作为二胺,3,3′,4,4′-二苯醚四羧酸二酐和双酚A型二酐作为二酐,以N,N-二甲基甲酰胺(DMF)为溶剂,通过常规的两步法,分别经热亚胺化和化学亚胺化过程合成了3种聚酰亚胺。用傅里叶变换红外光谱对聚合物的结构进行表征,表明在1 780,1 720,725cm-1附近出现了聚酰亚胺的特征吸收峰。采用溶解性测试、X射线衍射、热重分析、拉伸测试和吸水率测试表征了产物性能。所合成的共聚聚酰亚胺溶解性较好,溶于常见有机溶剂。所合成的聚酰亚胺膜热稳定性良好,在氮气氛中,起始降解温度超过500℃,10%失重温度为547.1～601.5℃,800℃质量保持率为64.8%～67.2%。聚酰亚胺膜的拉伸强度、拉伸模量、断裂伸长率分别为105.8～112.6 MPa,2.24～2.32 GPa,9.5%～10.2%。膜的吸水率为0.96%～0.98%。     

可溶性BAPP-MDA-ODPA共聚聚酰亚胺的合成与性能

用2,2-双[4-(4-氨基苯氧基)苯基]丙烷(BAPP)和4,4′-二氨基二苯甲烷(MDA)作为二胺,3,3,′4,4′-二苯醚四羧酸二酐(ODPA)作为二酐,以N,N-二甲基甲酰胺(DMF)为溶剂,通过常规的两步法,分别经热亚胺化和化学亚胺化过程合成了可溶性共聚聚酰亚胺。用FT-IR对聚合物的结构进行了表征,FT-IR测试结果表明在1 780 cm-1、1 720 cm-1和725 cm-1左右出现了聚酰亚胺的特征吸收峰。采用溶解性测试、DSC、TGA、拉伸测试和吸水率测试对产物的性能进行了测试。共聚聚酰亚胺在常见有机溶剂中可溶,并且有很好的热稳定性,在氮气氛中,起始降解温度超过500℃,800℃质量保持率为58.2%。共聚聚酰亚胺膜的拉伸强度、拉伸模量、断裂伸长率分别为103.5 MPa,2.36 GPa和11.7%。同时共聚聚酰亚胺膜还有很低的吸水率,为0.87%。     

Synthesis and characterization of polyimides from novel 1-(3′,5′-bis(trifluoromethyl)benzene) pyromelliticdianhydride (6FPPMDA)

Mono-substituted dianhydride monomer, 1-(3′,5′-bis(trifluoromethyl)phenyl) pyromellitic dianhydride (6FPPMDA), was prepared via the Suzuki cross coupling reaction followed by oxidation and cyclodehydration. The monomer was characterized by FT-IR, NMR, elemental analyzer (EA) and melting point apparatus. For comparison, 1-(4′-trifluoromethylphenyl)pyromellitic dianhydride (3FPPMDA) and 1-phenyl pyromellitic dianhydride (PPMDA) were also utilized. The dianhydrides were used to prepare polyimides with aromatic diamines such as bis(3-aminophenyl) 3,4-bis(trifluoromethyl)phenyl phosphine oxide (mDA6FPPO), bis(3-aminophenyl) 4-(trifluoromethyl)phenyl phosphine oxide (mDA3FPPO), bis(3-aminophenyl) phenyl phosphine oxide (mDAPPO) and 1,1-bis(4-aminophenyl)-1-phenyl-2,2,2-trifluoroethane (p3FDAm). The polyimides were synthesized via a two-step process; preparation of poly(amic-acid) in p-chlorophenol with isoquinoline, followed by solution imidization at the reflux temperature for 12 h. Polymer characterization was carried out by FT-IR, NMR, GPC, DSC and TGA, and their solubility, solution viscosity, water absorption, CTE, dielectric constant and refractive index were also evaluated.     

Synthesis and characterization of polyimides and co-polyimides having pendant benzoic acid moiety

A novel diamine monomer, 2,4-diamino-4′-carboxy diphenyl ether had been synthesized. Several polyimides were prepared by reacting this diamine with commercially available dianhydrides, such as benzophenone tetracarboxylic acid dianhydride (BTDA), 4,4′-bis{hexafluoroisopropylidene bis (phthalic anhydride)}(6-FDA), oxydiphthalic anhydride (ODPA) and 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride (BPDA). Furthermore, copolymers from the resulting diamine and oxydianiline (ODA) with 6 FDA were also synthesized. The inherent viscosities of the polymers were 0.42-0.67 dl g⁻¹. The polymers have good solubility in polar aprotic solvents, high thermal stability up to 410 °C in nitrogen and high glass transition temperatures (T_g) ranging from 260-330 °C. These polymers formed tough flexible films by solution casting.     

微波辐射合成聚酰胺酸和聚酰亚胺的研究

在N,N’-二甲基甲酰胺溶剂中,以均苯四甲酸酐和3,3’,4,4’-二苯酮四羧酸二酐为二酐单体,4,4’-二氨基二苯醚和4,4’-二氨基二苯甲烷为二胺单体,采用微波辐射低温溶液共缩聚,合成了聚酰胺酸(PAA)预聚体,然后亚胺化脱水、环化,生成共缩聚聚酰亚胺(PI)。通过红外光谱(FT-IR)、特性粘度[η]和热重分析(TG)等对聚合物进行了一系列的结构表征和性能测试。结果表明,微波辐射溶液聚合能够提高PAA的特性粘数及产率,微波的引入大大缩短了反应时间;FT-IR表明,在1 775 cm-1和1 724 cm-1处观察到聚酰亚胺特征峰;TG表明,PI的5%热失重温度(Td5%)为477℃,10%热失重温度(Td10%)为553℃。     

Synthesis and characterization of novel polyimides derived from 2,6-bis[4-(3,4-dicarboxyphenoxy)benzoyl]pyridine dianhydride and aromatic diamines

A novel pyridine-containing aromatic dianhydride monomer, 2,6-bis[4-(3,4-dicarboxyphenoxy)benzoyl]pyridine dianhydride, was synthesized from the nitro displacement of 4-nitrophthalonitrile by the phenoxide ion of 2,6-bis(4-hydroxybenzoyl)pyridine, followed by acidic hydrolysis of the intermediate tetranitrile and cyclodehydration of the resulting tetraacid. A series of new polyimides holding pyridine moieties in main chain were prepared from the resulting dianhydride monomer with various aromatic diamines via a conventional two-stage process, i.e. ring-opening polycondensation forming the poly(amic acid)s and further thermal or chemical imidization forming polyimides. The inherent viscosities of the resulting polyimides were in the range of 0.51-0.68 dL/g, and most of them were soluble in aprotic amide solvents and cresols, such as N,N-dimethylacetamide, N-methyl-2-pyrrolidone, and m-cresol, etc. Meanwhile, some strong and flexible polyimide films were obtained, which have good thermal stability with the glass transition temperatures of 221-278 °C, the temperature at 5% weight loss of 512-540 °C, and the residue at 800 °C of 60.4-65.3% in nitrogen, as well as have outstanding mechanical properties with the tensile strengths of 72.8-104.4 MPa and elongations at breakage of 9.1-11.7%. The polyimides also were found to possess low dielectric constants.