PTCDA表面射频磁控溅射ITO薄膜的特性研究

将氧化铟锡(ITO)溅射淀积在PTCDA/玻璃衬底表面,利用原子力显微镜(AFM)、四探针和紫外可见分光光度计分别测量薄膜的表面形貌、电阻率和透光率.结果表明:衬底温度对ITO在PTCDA上的淀积有着与在其他衬底上淀积所不同的影响,提高衬底温度淀积ITO并没有提高薄膜的结晶度;溅射功率的提高有利于ITO电阻率的下降,但是功率过高会破坏ITO薄膜的特性:ITO膜厚度的增加导致其电阻率减小.     

等离子体淀积氧化硅

本文叙述在平板型等离子体径流反应器中,由硅烧和一氧化二氮激活反应淀积二氧化硅薄膜的方法,测量了薄膜的特性,包括红外吸收谱、淀积速率、密度、电阻率、折射率、击穿电场.应力.薄膜的特性与淀积条件有密切关系.     

气体流量比对PECVD硅化钛薄膜性质的影响

本文报道了以四氯化钛(TiCl_4)和硅烷(SiH_4)为源物质,采用等离子增强化学气相淀积工艺(PECVD)制备硅化钛薄膜的方法;着重研究了气体流量比变化对薄膜电阻率、淀积速率以及化学组成的影响,通过实验获得了制备优良硅化钛薄膜的最佳气流比条件。     

磷硅玻璃膜的等离子活性淀积及特性

研究了由等离子体活化反应系统(P—PSG)淀积的磷硅玻离膜。分析了对应不同淀积参数的P—PSG的基本特征。在该等离子体淀积方法中,利用反应气体SiH_4、PH_3和N_2O进行淀积, P—PSG有高的淀积速率〔大约为百分之10(W/O)P摩尔重量〕。用这种方法淀积的P-PSG膜与常压下(AP-PSG)淀积的常规PSG膜比较,显示出良好的薄膜性能,如在热处理期间具有较强的抗裂性,保真的台阶覆盖和可控的压应力等。     

LPCVD系统淀积多晶硅薄膜的发雾分析

叙述了采用LPCVD系统淀积多晶硅薄膜的机理,分析了在淀积多晶硅薄膜过程中引起发雾的因素,指出了保持LPCVD系统的洁净能有效消除在淀积多晶硅薄膜过程中出现的发雾现象.     

反应溅射氮化钨薄膜特性研究

本文采用两种溅射系统:射频磁控溅射系统和S枪溅射系统淀积了氮化钨薄膜。X射线衍射方法(XRD)、俄歇电子谱(AES)和电学测量等方法用来分析了氮化钨薄膜的组分、晶体结构和薄膜的电阻率。并研究了氮在氮、氩混合气体中的不同流量比对氮化钨薄膜特性的影响。用卢瑟福背散射(RBS)方法对比研究了纯钨薄膜和氮化钨薄膜在Al/W/Si和Al/WN_x/Si两种金属化系统中的扩散势垒特性。分析结果表明,Al/W/Si金属化系统经500℃、30分钟热退火后,出现了明显的互扩散现象;而Al/WN_x/Si金属化系统在550℃、30分钟热退火后,没有发现互扩散的迹象,说明氮化钨在硅集成电路中是一种有效的扩散势垒材料。     

薄膜的离子束辅助淀积及离子轰击后处理工艺研究

本文详述了离子束辅助淀积薄膜及离子轰击后处理薄膜的工艺装置。用新一代的离子源系统作为离子轰击源,e型电子枪为膜料的热蒸发源。首先进行离子辅助淀积工艺研究。用离子辅助淀积和常规淀积方法制备ZnS/MgF_215层(HL)~4(LH)~4单半波窄带滤光片。两种样品镀制后立即进行测试其曲线和放置18天后     

光诱导化学汽相淀积非晶硅薄膜及其在太阳电池中的应用

本文较系统地评述了光诱导化学汽相淀积(LCVD)技术淀积非晶硅薄膜的开发现状,主要介绍了LCVD淀积非晶硅薄膜 的机理.评价了LCVD淀积非晶硅薄膜的电学和光学特性,最后介绍了这种薄在制备晶硅太阳电池方面的应用.     

电子束蒸发沉积TiN薄膜的电学特性研究

采用TCP(Transverse coupled plasma)等离子体辅助电子枪蒸镀技术,在玻璃衬底上制备了TiN薄膜。用X射线衍射仪(XRD)、扫描电子显微镜(SEM)和原子力显微镜(AFM)研究了不同工艺条件对薄膜晶体结构和表面形貌的影响;用四探针法测量薄膜的电阻率变化。结果表明,所制备的TiN薄膜在(111)晶面有择优取向。与金属薄膜类似,TiN薄膜的平均表面粗糙度与电阻率之间存在近似线性关系,并且电阻率随残余应力增大而增大。     

AI/W/TiN/AI及AI/W/TiW/AI结构特性研究

本文研究了H_2还原WF_6在α-Si/TiN/Al和TiW/Al衬底上LPCVD生长钨膜的特性。测量和分析了Al/W/TiN/Al和Al/W/TiW/Al结构的接触电阻和界面特性,研究了两种结构的热稳定性。结果表明,H_2还原WF_6可以在α-Si/TiN/Al和TiW/Al衬底上实现选择性钨淀积,钨膜质量较好。Al/W/TiN/Al和Al/W/TiW/Al结构接触电阻率为10~(-?)Ωcm~2量级,远低于难熔金属硅化物同硅的欧姆接触电阻率。两种结构的热稳定性良好。采用TiN或TiW作为Al和W之间的隔离层,CVD-W填充互连层连通孔可以满足多层金属平坦化互连技术的要求。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

A method for calculating the center position of collimated light

It is a key problem to accurately calculate beam spots＇ center of measuring the warp by using a collimated laser. A new method, named double geometrical center method （DGCM）, is put forward for the first time. In this method, a plane wave perpendicularly irradiates an aperture stop, and a charge couple device （CCD） is employed to receive the diffraction-beam spots, then the geometrical centers of the fast and the second diffraction-beam spots are calculated respectively, and their mean value is regarded as the center of datum beam. In face of such adverse instances as laser intension distributing defectively, part of the image being saturated, this method can still work well. What＇s more, this method can detect whether an unacceptable error exits in the courses of image receiving, processing and calculating. The experimental results indicate the precision of this method is high.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.